Abstract: There is provided an electronic component module capable of increasing the degree of integration by mounting electronic components on both surfaces of a substrate. The electronic component module according to an exemplary embodiment of the present disclosure includes a first substrate having one surface on which at least one electronic component is mounted; and a second substrate bonded to one surface of the first substrate and including at least one component accommodating part in which the at least one electronic component is accommodated, wherein the second substrate includes a core layer, and metal wiring layers formed on both surfaces of the core layer and having a plurality of electrode pads.

Abstract: Provided is a battery cell balancing circuit including: a battery cell module including a plurality of battery cells connected in series; a series resonant circuit including an inductor unit and a capacitor unit which are connected in series so as to store electric energy recovered from a corresponding battery cell of the battery cell module and supply the stored electric energy to a corresponding battery cell of the battery cell module; and a switch unit configured to provide an electric energy recovery path for storing the electric energy recovered from the corresponding battery cell of the battery cell module into the capacitor unit of the series resonant circuit and provide an electric energy supply path for supplying the stored electric energy to the corresponding battery cell of the battery cell module.

Abstract: There is provided an electronic component module capable of increasing the degree of integration by mounting electronic components on both surfaces of a substrate. The electronic component module according to an exemplary embodiment of the present disclosure includes a first substrate having one surface on which at least one electronic component is mounted; and a second substrate bonded to one surface of the first substrate and including at least one component accommodating part in which the at least one electronic component is accommodated, wherein the second substrate includes a core layer, and metal wiring layers formed on both surfaces of the core layer and having a plurality of electrode pads.

Abstract: There are provided a semiconductor package and a manufacturing method thereof, capable of increasing integration by mounting electronic devices on both surfaces of a substrate. The semiconductor package includes a first substrate having mounting electrodes on both surfaces thereof; a plurality of electronic devices mounted on both surfaces of the first substrate; and a second substrate exposed in cavities and bonded to a bottom surface of the first substrate so as to accommodate the electronic devices mounted on the bottom surface of the first substrate in the cavities.

Abstract: There are provided a semiconductor package and a manufacturing method thereof, capable of increasing integration by mounting electronic devices on both surfaces of a substrate. The semiconductor package includes a first substrate having mounting electrodes on both surfaces thereof; a plurality of electronic devices mounted on both surfaces of the first substrate; and a second substrate exposed in cavities and bonded to a bottom surface of the first substrate so as to accommodate the electronic devices mounted on the bottom surface of the first substrate in the cavities.

Abstract: Provided is a battery cell balancing circuit including: a battery cell module including a plurality of battery cells connected in series; a series resonant circuit including an inductor unit and a capacitor unit which are connected in series so as to store electric energy recovered from a corresponding battery cell of the battery cell module and supply the stored electric energy to a corresponding battery cell of the battery cell module; and a switch unit configured to provide an electric energy recovery path for storing the electric energy recovered from the corresponding battery cell of the battery cell module into the capacitor unit of the series resonant circuit and provide an electric energy supply path for supplying the stored electric energy to the corresponding battery cell of the battery cell module.

Abstract: There are provided a semiconductor package and a manufacturing method thereof, capable of increasing integration by mounting electronic devices on both surfaces of a substrate. The semiconductor package includes a first substrate having mounting electrodes on both surfaces thereof; a plurality of electronic devices mounted on both surfaces of the first substrate; and a second substrate exposed in cavities and bonded to a bottom surface of the first substrate so as to accommodate the electronic devices mounted on the bottom surface of the first substrate in the cavities.

Abstract: A fan including a hub part, a blade part and a vibration-absorbing boss, all constituent elements of which are injection molded, thereby reducing production costs. The fan has a minimized contact area between the vibration-absorbing boss and the hub part to prevent the vibration-absorbing boss from being deformed by high-temperature heat during insert injection molding of the hub part and the blade part while assuring sufficient strength of the hub part.

Abstract: An indoor unit of an air conditioner having improved structures of suction, discharge and/or flow passages which may increase operation efficiency, reduce noises and realize a compact size. The indoor unit includes a housing comprising a front panel and a rear panel coupled to a rear portion of the front panel, at least one discharge outlet exposed to a front of the front panel, at least one suction inlet formed in the rear panel at a position corresponding to the discharge outlet, at least one heat exchanger disposed at a front portion of the suction inlet to absorb heat from air introduced through the suction inlet or transfer heat to the air introduced through the suction inlet, and at least one diagonal flow fan disposed between the heat exchanger and the discharge outlet to suction air passing through the heat exchanger and discharge the air through the discharge outlet.

Abstract: There are provided a semiconductor package and a manufacturing method thereof, capable of increasing integration by mounting electronic devices on both surfaces of a substrate. The semiconductor package includes a first substrate having mounting electrodes on both surfaces thereof; a plurality of electronic devices mounted on both surfaces of the first substrate; and a second substrate exposed in cavities and bonded to a bottom surface of the first substrate so as to accommodate the electronic devices mounted on the bottom surface of the first substrate in the cavities.

Abstract: Disclosed is an axial flow fan capable of preventing cracks from generating at parts where stress is concentrated, by improving the structure. For this, the axial flow fan includes a hub, a plurality of wings extended from an outer surface of the hub, and a reinforcing member filling a space formed between the outer surface of the hub and a front edge part of each wing.

Abstract: A fan including a hub part, a blade part and a vibration-absorbing boss, all constituent elements of which are injection molded, thereby reducing production costs. The fan has a minimized contact area between the vibration-absorbing boss and the hub part to prevent the vibration-absorbing boss from being deformed by high-temperature heat during insert injection molding of the hub part and the blade part while assuring sufficient strength of the hub part.

Abstract: A turbo fan includes a plurality of blades positioned vertically in a radial direction between a main plate and a shroud. Each of the plurality of blades is formed with a slope at an outer periphery thereof to suppress generation of turbulence.

Abstract: Disclosed is an axial flow fan capable of preventing cracks from generating at parts where stress is concentrated, by improving the structure. For this, the axial flow fan includes a hub, a plurality of wings extended from an outer surface of the hub, and a reinforcing member filling a space formed between the outer surface of the hub and a front edge part of each wing.

Abstract: A turbo fan including backward-inclined blades that are inclined in a direction opposite to a rotating direction of a rotating plate. A positive pressure surface of each blade, facing the rotating direction of the rotating plate, takes the form of a flat surface, and a negative pressure surface of the blade, opposite to the rotating direction of the rotating plate, takes the form of a convexly-curved surface. A radius of curvature defined by the convexly-curved negative pressure surface is within a range of 2.5˜4 times of a radius of the turbo fan. The turbo fan can reduce noise and consumption of power together, and consequently, an air conditioner having the turbo fan can achieve an improvement in performance.

Abstract: A turbofan to reduce a blowing noise, and an air conditioner having the same. The turbofan includes a rotating plate coupled to a shaft of a driving motor, a plurality of blades coupled to an outer circumference of the rotating plate, and an annular shroud coupled to an end of each blade. The end of each blade includes an inner end that is coupled to the rotating plate, and an outer end that is not coupled to the rotating plate. The outer end of each blade is tilted toward the rotating plate such that a distance between the outer end of each blade and an inner surface of an apparatus employing the turbofan is increased as the outer end of each blade moves away from a rotational center of the rotating plate in a radial outward direction.

Abstract: A turbo fan includes a plurality of blades positioned vertically in a radial direction between a main plate and a shroud. Each of the plurality of blades is formed with a slope at an outer periphery thereof to suppress generation of turbulence.