Patents by Inventor Min Gil

Min Gil has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing NAND flash device
    Publication number: 20050272204
    Abstract: Disclosed is a method for manufacturing a NAND flash device. After a source line plug hole is formed, a drain contact plug hole is formed. The holes are filled with a conductive material film and are then polished. It is therefore possible to simplify the process since a blanket etch process step is omitted. Moreover, loss of a drain contact plug by the blanket etch process is prevented. It is therefore possible to improve the electrical properties of a device and reduce the manufacturing cost price.
    Type: Application
    Filed: May 26, 2005
    Publication date: December 8, 2005
    Applicant: HYNIX SEMICONDUCTOR INC.
    Inventor: Min Gil
  • Method for manufacturing NAND flash device
    Publication number: 20050208721
    Abstract: Disclosed is a method for manufacturing a NAND flash device. After a source line plug hole is formed, a drain contact plug hole is formed. The holes are filled with a conductive material film and are then polished. It is therefore possible to simplify the process since a blanket etch process step is omitted. Moreover, loss of a drain contact plug by the blanket etch process is prevented. It is therefore possible to improve the electrical properties of a device and reduce the manufacturing cost price.
    Type: Application
    Filed: May 26, 2005
    Publication date: September 22, 2005
    Applicant: HYNIX SEMICONDUCTOR INC.
    Inventor: Min Gil
  • Method for manufacturing NAND flash device
    Publication number: 20050124103
    Abstract: Disclosed is a method for manufacturing a NAND flash device. After a source line plug hole is formed, a drain contact plug hole is formed. The holes are filled with a conductive material film and are then polished. It is therefore possible to simplify the process since a blanket etch process step is omitted. Moreover, loss of a drain contact plug by the blanket etch process is prevented. It is therefore possible to improve the electrical properties of a device and reduce the manufacturing cost price.
    Type: Application
    Filed: June 24, 2004
    Publication date: June 9, 2005
    Applicant: HYNIX SEMICONDUCTOR INC.
    Inventor: Min Gil