Abstract: A photoelectric panel assembly includes a photoelectric panel, a support rail coupled to a rear surface of the photoelectric panel, the support rail including a base portion parallel to and spaced apart from the photoelectric panel, flange portions parallel to and adhered to the photoelectric panel, slope portions between the base portion and respective ones of the flange portions, and rounded portions between the base portion and the slope portions and between the slope portions and the flange portions.

Abstract: A solar cell module according to the present invention includes photoelectric converting cells, interconnect wiring, and a bus bar, wherein the interconnect wiring is attached by a conductive adhesive layer, and the bus bar is attached by an insulating adhesive layer. A method for manufacturing the solar cell module includes attaching the interconnect wiring and the bus bar by the conductive adhesive layer and the insulating adhesive layer, and according to the method, a solar cell module with excellent characteristics can be manufactured through a simple and inexpensive method.

Abstract: A cutting tool for drilling has cutting inserts in the same shape and is capable of discharging a chip in a chip flute. The cutting tool includes: a body having a lower end facing a direction of drilling, a central axis of rotation and at least two chip flutes; and indexable inner and outer cutting inserts each disposed in an insert pocket formed at the lower end of the body and at a forward end of a corresponding chip flute. The inner cutting insert is located closer to the central axis of the body than the outer cutting insert. The inner and outer cutting inserts have the same shape and include lower cutting edges for depth cutting during drilling. The lower cutting edge of the inner cutting insert is disposed lower than the lower cutting edge of an imaginary cutting insert at a position where the inner cutting insert is overlapped with the imaginary cutting insert where the outer cutting insert is rotated by approximately a half-turn relative to the central axis.

Abstract: A rotating tool includes a tool body, an outer cartridge, an inner cartridge and one or more setting plates. The tool body includes a pocket for the inner cartridge and a pocket for the outer cartridge. The outer cartridge has at least one cutting insert and a bolt through-hole extending toward a peripheral portion of the tool body. The outer cartridge is mounted on the pocket for the outer cartridge by means of a bolt. The setting plate is positioned to contact both the outer cartridge and the pocket for the outer cartridge. Screw holes for mounting the setting plate are formed on a side face of the outer cartridge adjacent to a rotating axis and through-holes are formed on the setting plate. This is so that the setting plate can be mounted on the side face of the outer cartridge by setting screws.

Abstract: There is provided a multilayer type test board assembly for high-precision inspection. The multilayer test board assembly comprises: a plurality of test boards separated from each other according to their functions, having input/output signal terminals, and including at least one test board each having a first section where first mounting devices sensitive to an influence of electrical signals are mounted and a second section where second mounting devices insensitive to an influence of electrical signals are mounted; spacers that arrange the test boards in parallel by spacing apart the test boards by predetermined intervals; connection cables connected to the input/output signal terminals of the test boards; and a signal shielding fence formed on each of the at least one test board so as to protect the first mounting devices from electrical signals generated by the second mounting devices.

Abstract: An apparatus for testing electrical characteristics includes a probe configured to contact a test object, a DC signal transmission line configured to transmit a DC signal to the probe, a frequency signal transmission line configured to transmit a frequency signal to the probe, and a line selection unit configured to selectively connect only one of the frequency signal transmission line and the DC signal transmission line to the probe at a time in accordance with a selected test.

Abstract: A probe card capable of multi-probing includes a print circuit board having a plurality of contact portions and a test module having a plurality of test boards. Each of the test boards includes at least one probing portion on which a plurality of needles are arrayed. The test module selects one of the test boards and probes semiconductor chips formed on a semiconductor wafer through the needles arrayed on the probing portion of the selected test board.

Abstract: There is provided a multilayer type test board assembly for high-precision inspection. The multilayer test board assembly comprises: a plurality of test boards separated from each other according to their functions, having input/output signal terminals, and including at least one test board each having a first section where first mounting devices sensitive to an influence of electrical signals are mounted and a second section where second mounting devices insensitive to an influence of electrical signals are mounted; spacers that arrange the test boards in parallel by spacing apart the test boards by predetermined intervals; connection cables connected to the input/output signal terminals of the test boards; and a signal shielding fence formed on each of the at least one test board so as to protect the first mounting devices from electrical signals generated by the second mounting devices.

Abstract: A system and method for testing a semiconductor integrated circuit (IC) in parallel includes a probe chuck, a test head, and a test controller. The probe chuck loads a plurality of different types of semiconductor DUTs. The test head provides a plurality of circuit sites to independently and simultaneously test the different types of semiconductor DUTs, and the test controller controls the test head and the probe chuck.

Abstract: A probe card capable of multi-probing includes a print circuit board having a plurality of contact portions and a test module having a plurality of test boards. Each of the test boards includes at least one probing portion on which a plurality of needles are arrayed. The test module selects one of the test boards and probes semiconductor chips formed on a semiconductor wafer through the needles arrayed on the probing portion of the selected test board.

Abstract: A satellite broadcast receiver comprises an antenna, a tuner, a modulator, a FEC decoder, a microprocessor, and an antenna driver. The antenna receives the satellite signal and the tuner tunes the satellite signal received by the antenna, and the modulator modulates the satellite signal tuned by the tuner into digital signal, the FEC decoder corrects a position error of the satellite antenna using the signal modulated by the modulator, and outputs a corresponding output signal, and the microprocessor receives the signal modulated by the modulator and the output signal of the error corrector, and outputs a control signal which controls the position of the antenna, and the antenna driver drives the antenna in accordance with the control signal of the microprocessor. The satellite broadcast receiver enables a user to detect satellites fast and see satellite broadcast conveniently.

Abstract: An optical disc recording/reproducing system having a single chip for a video decoder and an A/V codec. The optical disc recording/reproducing system includes an audio/video input part inputting audio and video signals in diverse formats, an audio/video codec converting the video signal inputted from the audio/video input part into a digital video signal, an audio ADC converting the audio signal inputted from the audio/video input part into a digital audio signal, and a recording medium recording the video and audio signals respectively encoded in a certain compression format.

Abstract: A satellite broadcast receiver comprises an antenna, a tuner, a modulator, a FEC decoder, a microprocessor, and an antenna driver. The antenna receives the satellite signal and the tuner tunes the satellite signal received by the antenna, and the modulator modulates the satellite signal tuned by the tuner into digital signal, the FEC decoder corrects a position error of the satellite antenna using the signal modulated by the modulator, and outputs a corresponding output signal, and the microprocessor receives the signal modulated by the modulator and the output signal of the error corrector, and outputs a control signal which controls the position of the antenna, and the antenna driver drives the antenna in accordance with the control signal of the microprocessor. The satellite broadcast receiver enables a user to detect satellites fast and see satellite broadcast conveniently.

Abstract: A satellite broadcast receiver comprises an antenna, a tuner, a modulator, a FEC decoder, a microprocessor, and an antenna driver. The antenna receives the satellite signal and the tuner tunes the satellite signal received by the antenna, and the modulator modulates the satellite signal tuned by the tuner into digital signal, the FEC decoder corrects a position error of the satellite antenna using the signal modulated by the modulator, and outputs a corresponding output signal, and the microprocessor receives the signal modulated by the modulator and the output signal of the error corrector, and outputs a control signal which controls the position of the antenna, and the antenna driver drives the antenna in accordance with the control signal of the microprocessor. The satellite broadcast receiver enables a user to detect satellites fast and see satellite broadcast conveniently.

Abstract: A satellite broadcast receiver comprises an antenna, a tuner, a modulator, a FEC decoder, a microprocessor, and an antenna driver. The antenna receives the satellite signal and the tuner tunes the satellite signal received by the antenna, and the modulator modulates the satellite signal tuned by the tuner into digital signal, the FEC decoder corrects a position error of the satellite antenna using the signal modulated by the modulator, and outputs a corresponding output signal, and the microprocessor receives the signal modulated by the modulator and the output signal of the error corrector, and outputs a control signal which controls the position of the antenna, and the antenna driver drives the antenna in accordance with the control signal of the microprocessor. The satellite broadcast receiver enables a user to detect satellites fast and see satellite broadcast conveniently.