Patents by Inventor Min Gu Ko
Min Gu Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11069845Abstract: A light emitting device includes a substrate extending in a first direction and a second direction, first through fourth light emitting structures spaced apart from each other in the first and second direction and arranged in a matrix form on the substrate, a plurality of first interconnection layer structures connecting the first light emitting structure to the second light emitting structure, a second interconnection layer structure connecting the second light emitting structure to the third light emitting structure, and a plurality of third interconnection layer structures connecting the third light emitting structure to the fourth light emitting structure.Type: GrantFiled: March 20, 2019Date of Patent: July 20, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Min-gu Ko, Jung-hee Kwak, Young-ho Ryoo, Seong-seok Yang, Sang-seok Lee, Seung-wan Chae
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Publication number: 20200006611Abstract: A light emitting device includes a substrate extending in a first direction and a second direction, first through fourth light emitting structures spaced apart from each other in the first and second direction and arranged in a matrix form on the substrate, a plurality of first interconnection layer structures connecting the first light emitting structure to the second light emitting structure, a second interconnection layer structure connecting the second light emitting structure to the third light emitting structure, and a plurality of third interconnection layer structures connecting the third light emitting structure to the fourth light emitting structure.Type: ApplicationFiled: March 20, 2019Publication date: January 2, 2020Inventors: Min-gu Ko, Jung-hee Kwak, Young-ho Ryoo, Seong-seok Yang, Sang-seok Lee, Seung-wan Chae
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Patent number: 10147760Abstract: A light-emitting device may include separate, first and second light-emitting structures that are isolated from direct contact with each other on a phototransmissive substrate. Each light-emitting structure may include a first conductivity-type semiconductor layer, an active layer on the first conductivity-type semiconductor layer, and a second conductivity-type semiconductor layer on the active layer. The first and second light-emitting structures may be electrically connected to each other. An inter-structure conductive layer may electrically interconnect the first conductivity-type semiconductor layer of the first light-emitting structure to the second conductivity-type semiconductor layer of the second light-emitting structure. The second light-emitting structure may include a finger structure extending from an outer edge of the second light-emitting structure toward an interior of the second light-emitting structure.Type: GrantFiled: May 30, 2017Date of Patent: December 4, 2018Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Young-kyu Sung, Jae-ryung Yoo, Seung-wan Chae, Jae-young Lee, In-bum Yang, Min-gu Ko, Sung-wook Lee
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Publication number: 20180166498Abstract: A light-emitting device may include separate, first and second light-emitting structures that are isolated from direct contact with each other on a phototransmissive substrate. Each light-emitting structure may include a first conductivity-type semiconductor layer, an active layer on the first conductivity-type semiconductor layer, and a second conductivity-type semiconductor layer on the active layer. The first and second light-emitting structures may be electrically connected to each other. An inter-structure conductive layer may electrically interconnect the first conductivity-type semiconductor layer of the first light-emitting structure to the second conductivity-type semiconductor layer of the second light-emitting structure. The second light-emitting structure may include a finger structure extending from an outer edge of the second light-emitting structure toward an interior of the second light-emitting structure.Type: ApplicationFiled: May 30, 2017Publication date: June 14, 2018Applicant: Samsung Electronics Co., Ltd.Inventors: Young-kyu SUNG, Jae-ryung YOO, Seung-wan CHAE, Jae-young LEE, In-bum YANG, Min-gu KO, Sung-wook LEE
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Patent number: 8324664Abstract: A method for forming a fuse of a semiconductor device includes performing an ion-implanting process at sides of a fuse blowing region of a metal fuse, thereby increasing the concentration of impurity ions of a thermal transmission path region. In a subsequent laser blowing process, as a result of the increased resistance of metal fuse the electric and thermal conductivity is reduced, thereby increasing the thermal condensation efficiency of the fuse blowing region and improving the efficiency of the laser blowing process.Type: GrantFiled: August 8, 2011Date of Patent: December 4, 2012Assignee: Hynix Semiconductor Inc.Inventor: Min Gu Ko
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Publication number: 20110291230Abstract: A method for forming a fuse of a semiconductor device includes performing an ion-implanting process at sides of a fuse blowing region of a metal fuse, thereby increasing the concentration of impurity ions of a thermal transmission path region. In a subsequent laser blowing process, as a result of the increased resistance of metal fuse the electric and thermal conductivity is reduced, thereby increasing the thermal condensation efficiency of the fuse blowing region and improving the efficiency of the laser blowing process.Type: ApplicationFiled: August 8, 2011Publication date: December 1, 2011Applicant: HYNIX SEMICONDUCTOR INC.Inventor: Min Gu Ko
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Patent number: 8017454Abstract: A method for forming a fuse of a semiconductor device includes performing an ion-implanting process at sides of a fuse blowing region of a metal fuse, thereby increasing the concentration of impurity ions of a thermal transmission path region. In a subsequent laser blowing process, as a result of the increased resistance of metal fuse the electric and thermal conductivity is reduced, thereby increasing the thermal condensation efficiency of the fuse blowing region and improving the efficiency of the laser blowing process.Type: GrantFiled: November 17, 2008Date of Patent: September 13, 2011Assignee: Hynix Semiconductor Inc.Inventor: Min Gu Ko
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Publication number: 20090236687Abstract: A method for forming a fuse of a semiconductor device includes performing an ion-implanting process at sides of a fuse blowing region of a metal fuse, thereby increasing the concentration of impurity ions of a thermal transmission path region. In a subsequent laser blowing process, as a result of the increased resistance of metal fuse the electric and thermal conductivity is reduced, thereby increasing the thermal condensation efficiency of the fuse blowing region and improving the efficiency of the laser blowing process.Type: ApplicationFiled: November 17, 2008Publication date: September 24, 2009Applicant: HYNIX SEMICONDUCTOR INC.Inventor: Min Gu Ko