Patents by Inventor Min-Gun Lee

Min-Gun Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240136527
    Abstract: Provided is a binder for a secondary battery including a copolymer including repeating units of the Chemical Formula 1, Chemical Formula 2, Chemical Formula 3, and Chemical Formula 4 disclosed herein. When the binder for a secondary battery is applied to a negative electrode and a secondary battery, expansion of the negative electrode may be effectively suppressed. Furthermore, the binder for a secondary battery has improved adhesion to effectively suppress exfoliation and desorption of a negative electrode, thereby manufacturing a secondary battery having significantly improved charge/discharge cycle characteristics and battery performance by using the binder.
    Type: Application
    Filed: October 10, 2023
    Publication date: April 25, 2024
    Inventors: Jun Soo Son, Min Kyung Seon, Dong Gun Lee, Kwang Ho Jung, Seung Deok Seo
  • Publication number: 20240116184
    Abstract: An automated gas supply system includes a gas cylinder transfer unit configured to transfer a cradle in which one or more gas cylinders storing a gas therein are stored; a gas cylinder inspection unit configured to check properties of the gas stored in the gas cylinder transferred from the gas cylinder transfer unit and check whether the gas leaks from the gas cylinder; a storage queue configured to receive the gas cylinder from the gas cylinder inspection unit by a mobile robot and configured to classify and store the transferred gas cylinders according to the properties of the gas stored in the gas cylinder; and a gas cabinet configured to receive the gas cylinder from the storage queue by the mobile robot and fasten a gas pipe, which is connected to a semiconductor manufacturing process line, to a gas spray nozzle, which is disposed at one side of the received gas cylinder, to supply the gas stored in the gas cylinder to the semiconductor manufacturing process line, wherein the gas cabinet includes a resid
    Type: Application
    Filed: December 20, 2023
    Publication date: April 11, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Min Sung HA, Kwang-Jun KIM, Jong Kyu KIM, Hyun-Joong KIM, Jin Ho SO, Chi-Gun AN, Ki Moon LEE, Hui Gwan LEE, Beom Soo HWANG
  • Patent number: 11955888
    Abstract: As inputs of a controller of a direct current (DC)-DC converter are sampled for a predetermined time and thus two-dimensional state information in which one axis is an input physical quantity and the other axis is a time is generated, the two-dimensional state information is processed by a convolutional neural network to determine and output one of a plurality of control signals. An artificial intelligence control part may operate in accordance with a plurality of operation conditions or dynamically determined operation conditions by applying different artificial intelligence engines according to operation modes.
    Type: Grant
    Filed: July 3, 2021
    Date of Patent: April 9, 2024
    Inventors: Kang Yoon Lee, Jong Wan Jo, Min Young Kim, Dong Soo Park, Kyung Duk Choi, Young Gun Pu
  • Patent number: 11787974
    Abstract: The present disclosure provides chemical-mechanical polishing (CMP) particles exhibiting a high polishing rate and a high polishing quality of generating few defects or scratches due to their modified surface thereof. The present disclosure also provides a polishing slurry composition including the polishing particles.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: October 17, 2023
    Assignee: Dongjin Semichem Co., Ltd.
    Inventors: Weoun Gyuen Moon, Jae Hyun Kim, Kyu Soon Shin, Jong Dai Park, Min Gun Lee, Sung Hoon Jin, Goo Hwa Lee, Gyeong Sook Cho, Jae Hong Yoo
  • Publication number: 20210340405
    Abstract: The present disclosure provides chemical-mechanical polishing (CMP) particles exhibiting a high polishing rate and a high polishing quality of generating few defects or scratches due to their modified surface thereof. The present disclosure also provides a polishing slurry composition including the polishing particles.
    Type: Application
    Filed: June 30, 2021
    Publication date: November 4, 2021
    Inventors: Weoun Gyuen MOON, Jae Hyun KIM, Kyu Soon SHIN, Jong Dai PARK, Min Gun LEE, Sung Hoon JIN, Goo Hwa LEE, Gyeong Sook CHO, Jae Hong YOO
  • Patent number: 11001732
    Abstract: Disclosed is a chemical-mechanical polishing slurry composition having a small change in pH over time under an acidic condition and thus being easy to store for a long time. The chemical-mechanical polishing slurry composition includes an abrasive; an amount of about 0.000006 to 0.01 weight % of an aluminum component based on the total weight of the polishing slurry composition; and water. The number of silanol groups on a surface of the abrasive and a content of the aluminum component satisfy the requirements of following Equation 1: 0.0005?(S*C)*100?4.5,??[Equation 1] wherein, S is the number of the silanol groups present on 1 nm2 of the abrasive surface (unit: number/nm2), and C is the content of the aluminum component (weight %) in the slurry composition.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: May 11, 2021
    Assignee: Dongjin Semichem Co., Ltd.
    Inventors: Hye Jung Park, Jae Hyun Kim, Jong Dai Park, Min Gun Lee, Jong Chul Shin, Sung Hoon Jin
  • Publication number: 20190077993
    Abstract: Disclosed is a chemical-mechanical polishing slurry composition having a small change in pH over time under an acidic condition and thus being easy to store for a long time. The chemical-mechanical polishing slurry composition includes an abrasive; an amount of about 0.000006 to 0.01 weight % of an aluminum component based on the total weight of the polishing slurry composition; and water. The number of silanol groups on a surface of the abrasive and a content of the aluminum component satisfy the requirements of following Equation 1: 0.0005?(S*C)*100?4.5,??[Equation 1] wherein, S is the number of the silanol groups present on 1 nm2 of the abrasive surface (unit: number/nm2), and C is the content of the aluminum component (weight %) in the slurry composition.
    Type: Application
    Filed: November 13, 2018
    Publication date: March 14, 2019
    Inventors: Hye Jung Park, Jae Hyun Kim, Jong Dai Park, Min Gun Lee, Jong Chul Shin, Sung Hoon Jin
  • Publication number: 20190077994
    Abstract: Disclosed is a chemical-mechanical polishing slurry composition having a small change in pH over time under an acidic condition and thus being easy to store for a long time. The chemical-mechanical polishing slurry composition includes an abrasive; an amount of about 0.000006 to 0.01 weight % of an aluminum component based on the total weight of the polishing slurry composition; and water. The number of silanol groups on a surface of the abrasive and a content of the aluminum component satisfy the requirements of following Equation 1: 0.0005?(S*C)*100?4.5,??[Equation 1] wherein, S is the number of the silanol groups present on 1 nm2 of the abrasive surface (unit: number/nm2), and C is the content of the aluminum component (weight %) in the slurry composition.
    Type: Application
    Filed: November 13, 2018
    Publication date: March 14, 2019
    Inventors: Hye Jung Park, Jae Hyun Kim, Jong Dai Park, Min Gun Lee, Jong Chul Shin, Sung Hoon Jin
  • Patent number: 7307259
    Abstract: A system and a method for controlling the multi-component composition such as photoresist, stripper, developer, etchant, thinner, rinser/cleaner and etch bead remover, for a lithography process, which is used for manufacturing a semiconductor device, a liquid crystal display device and so on, are disclosed.
    Type: Grant
    Filed: March 10, 2005
    Date of Patent: December 11, 2007
    Assignee: Dongjin Semichem Co., Ltd.
    Inventors: Ki-Beom Lee, Jae-Ku Lee, Mi-Sun Park, Jong-Min Kim, Min-Gun Lee
  • Publication number: 20050202564
    Abstract: A system and a method for controlling the multi-component composition such as photoresist, stripper, developer, etchant, thinner, rinser/cleaner and etch bead remover, for a lithography process, which is used for manufacturing a semiconductor device, a liquid crystal display device and so on, are disclosed.
    Type: Application
    Filed: March 10, 2005
    Publication date: September 15, 2005
    Inventors: Ki-Beom Lee, Jae-Ku Lee, Mi-Sun Park, Jong-Min Kim, Min-Gun Lee