Patents by Inventor Min Gyum KIM

Min Gyum KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Phosphonium-based compound, epoxy resin composition containing same, semiconductor device manufactured using same
    Patent number: 10385161
    Abstract: The present invention relates to a phosphonium-based compound represented by chemical formula 1, an epoxy resin composition containing the same, and a semiconductor device manufactured by using the same.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: August 20, 2019
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Min Gyum Kim, Jin Woo Choi, Ki Hyeok Kwon, Dong Hwan Lee, Joo Young Chung, Jin Min Cheon
  • Compound containing phosphonium ion, epoxy resin composition containing same, and device manufactured by using same
    Patent number: 10047191
    Abstract: The present invention relates to a compound containing phosphonium ion of a chemical formula 1, an epoxy resin composition containing the same, and a device manufactured by using the same.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: August 14, 2018
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Jin Min Cheon, Min Gyum Kim, Jung Seob Kim, Dong Hwan Lee, Hwan Sung Cheon, Seung Han
  • Pyridiniuivi-based compound, epoxy resin composition comprising same, and apparatus manufactured using same
    Patent number: 9957348
    Abstract: The present invention relates to a pyridinium-based compound of chemical formula 1, an epoxy resin composition comprising the same, and an apparatus manufactured by using the same.
    Type: Grant
    Filed: May 9, 2014
    Date of Patent: May 1, 2018
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Dong Hwan Lee, Min Gyum Kim, Jung Seob Kim, Jin Min Cheon, Hwan Sung Cheon, Seung Han
  • Phosphonium compound, preparation method thereof, epoxy resin composition including the same, and semiconductor device prepared by using the same
    Patent number: 9896465
    Abstract: A phosphonium compound, a method of preparing the same, an epoxy resin composition including the same, and a semiconductor device encapsulated with the same, the compound being represented by Formula 1:
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: February 20, 2018
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Dong Hwan Lee, Min Gyum Kim, So Yoon Kim, Woo Chul Na, Yoon Man Lee, Ji Yoon Cho, Ki Hyeok Kwon, KyoungChul Bae, Eun Jung Lee, Joo Young Chung, Jin Min Cheon, Jin Woo Choi, Seung Han
  • Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared using the same
    Patent number: 9890307
    Abstract: A phosphonium compound, an epoxy resin composition including the same, a semiconductor device encapsulated with the same, and a method of encapsulating a semiconductor device, the phosphonium compound being represented by Formula 1:
    Type: Grant
    Filed: July 14, 2016
    Date of Patent: February 13, 2018
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Ki Hyeok Kwon, Min Gyum Kim, Joo Young Chung, Jin Min Cheon, Jin Woo Choi, Seung Han, Dong Hwan Lee
  • Curing catalyst for epoxy resin composition, epoxy resin composition comprising same, and apparatus manufactured by using same
    Patent number: 9890238
    Abstract: The present invention relates to a curing catalyst for an epoxy resin composition represented by chemical formula 1, an epoxy resin composition comprising the same, and an apparatus manufactured using the same.
    Type: Grant
    Filed: May 16, 2014
    Date of Patent: February 13, 2018
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Jung Seob Kim, Min Gyum Kim, Dong Hwan Lee, Jin Min Cheon, Hwan Sung Cheon, Seung Han
  • Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared from the same
    Patent number: 9868751
    Abstract: A phosphonium compound, an epoxy resin composition, a method of preparing a phosphonium compound, and a semiconductor device encapsulated with the epoxy resin composition, the compound being represented by Formula 1:
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: January 16, 2018
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Min Gyum Kim, Ki Hyeok Kwon, Dong Hwan Lee, Joo Young Chung, Jin Min Cheon, Jin Woo Choi
  • Epoxy resin composition for encapsulating a semiconductor device and semiconductor device prepared using the same
    Patent number: 9870971
    Abstract: An epoxy resin composition and a semiconductor device, the composition including an epoxy resin; a curing agent; an inorganic filler; a curing catalyst; and a silicon compound, wherein the curing catalyst includes a phosphonium compound represented by the following Formula 4 and the silicon compound comprises a silicon compound represented by the following Formula 7:
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: January 16, 2018
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Joo Young Chung, Ki Hyeok Kwon, Min Gyum Kim, Jin Min Cheon, Jin Woo Choi, Seung Han
  • Epoxy resin composition for encapsulating semiconductor device and semiconductor device prepared using the same
    Patent number: 9850390
    Abstract: An epoxy resin composition for encapsulation of a semiconductor device and a semiconductor device encapsulated with the epoxy resin composition, the composition including an epoxy resin; a curing agent; an inorganic filler; a curing catalyst; and a compound containing at least one hydroxyl group, wherein the curing catalyst includes a phosphonium compound represented by Formula 4:
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: December 26, 2017
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Jin Min Cheon, Ki Hyeok Kwon, Min Gyum Kim, Joo Young Chung, Jin Woo Choi, Seung Han
  • PHOSPHONIUM-BASED COMPOUND, EPOXY RESIN COMPOSITION CONTAINING SAME, SEMICONDUCTOR DEVICE MANUFACTURED USING SAME
    Publication number: 20170306079
    Abstract: The present invention relates to a phosphonium-based compound represented by chemical formula 1, an epoxy resin composition containing the same, and a semiconductor device manufactured by using the same.
    Type: Application
    Filed: January 22, 2016
    Publication date: October 26, 2017
    Inventors: Min Gyum KIM, Jin Woo CHOI, Ki Hyeok KWON, Dong Hwan LEE, Joo Young CHUNG, Jin Min CHEON
  • Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same
    Patent number: 9695294
    Abstract: An epoxy resin composition includes: an epoxy resin; a curing agent; a curing accelerator; and an inorganic filler, wherein the curing accelerator includes a 4-valent ammonium salt or a 4-valent phosphonium salt represented by Formula 1, wherein A1 is nitrogen or phosphorus; R1, R2, R3 and R4 are each independently a substituted or unsubstituted C1 to C30 hydrocarbon group, or a substituted or unsubstituted C1 to C30 hydrocarbon group including a hetero atom; X1, X2, X3, X4, X5 and X6 are each independently an oxygen atom (O), a sulfur atom (S), or NH; and Y1, Y2 and Y3 are each independently a substituted or unsubstituted C1 to C30 hydrocarbon group, or a substituted or unsubstituted C1 to C30 hydrocarbon group including a hetero atom.
    Type: Grant
    Filed: December 26, 2013
    Date of Patent: July 4, 2017
    Assignee: Cheil Industries, Inc.
    Inventors: Min Gyum Kim, Seung Han, Hwan Sung Cheon
  • Resist underlayer composition, method of forming patterns, and semiconductor integrated circuit device including the pattern
    Patent number: 9606438
    Abstract: Disclosed is a resist underlayer composition including a compound including a moiety represented by the following Chemical Formula 1 and a solvent. In the above Chemical Formula 1, A1 to A3, X1, X2, L1, L2, Z, and m are the same as defined in the specification.
    Type: Grant
    Filed: November 5, 2013
    Date of Patent: March 28, 2017
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Min-Gyum Kim, Hyo-Young Kwon, Jun-Ho Lee, Hwan-Sung Cheon
  • PHOSPHONIUM COMPOUND, EPOXY RESIN COMPOSITION INCLUDING THE SAME AND SEMICONDUCTOR DEVICE PREPARED USING THE SAME
    Publication number: 20170018473
    Abstract: A phosphonium compound, an epoxy resin composition including the same, a semiconductor device encapsulated with the same, and a method of encapsulating a semiconductor device, the phosphonium compound being represented by Formula 1:
    Type: Application
    Filed: July 14, 2016
    Publication date: January 19, 2017
    Inventors: Ki Hyeok KWON, Min Gyum KIM, Joo Young CHUNG, Jin Min CHEON, Jin Woo CHOI, Seung HAN, Dong Hwan LEE
  • EPOXY RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PREPARED USING THE SAME
    Publication number: 20170002192
    Abstract: An epoxy resin composition and a semiconductor device, the composition including an epoxy resin; a curing agent; an inorganic filler; a curing catalyst; and a silicon compound, wherein the curing catalyst includes a phosphonium compound represented by the following Formula 4 and the silicon compound comprises a silicon compound represented by the following Formula 7:
    Type: Application
    Filed: July 1, 2016
    Publication date: January 5, 2017
    Inventors: Joo Young CHUNG, Ki Hyeok KWON, Min Gyum KIM, Jin Min CHEON, Jin Woo CHOI, Seung HAN
  • EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PREPARED USING THE SAME
    Publication number: 20160379909
    Abstract: An epoxy resin composition for encapsulation of a semiconductor device and a semiconductor device encapsulated with the epoxy resin composition, the composition including an epoxy resin; a curing agent; an inorganic filler; a curing catalyst; and a compound containing at least one hydroxyl group, wherein the curing catalyst includes a phosphonium compound represented by Formula 4:
    Type: Application
    Filed: June 21, 2016
    Publication date: December 29, 2016
    Inventors: Jin Min CHEON, Ki Hyeok KWON, Min Gyum KIM, Joo Young CHUNG, Jin Woo CHOI, Seung HAN
  • PHOSPHONIUM COMPOUND, PREPARATION METHOD THEREOF, EPOXY RESIN COMPOSITION INCLUDING THE SAME, AND SEMICONDUCTOR DEVICE PREPARED BY USING THE SAME
    Publication number: 20160368937
    Abstract: A phosphonium compound, a method of preparing the same, an epoxy resin composition including the same, and a semiconductor device encapsulated with the same, the compound being represented by Formula 1:
    Type: Application
    Filed: June 22, 2016
    Publication date: December 22, 2016
    Inventors: Dong Hwan LEE, Min Gyum KIM, So Yoon KIM, Woo Chul NA, Yoon Man LEE, Ji Yoon CHO, Ki Hyeok KWON, KyoungChul BAE, Eun Jung LEE, Joo Young CHUNG, Jin Min CHEON, Jin Woo CHOI, Seung HAN
  • PYRIDINIUM-BASED COMPOUND, EPOXY RESIN COMPOSITION COMPRISING SAME, AND APPARATUS MANUFACTURED USING SAME
    Publication number: 20160333136
    Abstract: The present invention relates to a pyridinium-based compound of chemical formula 1, an epoxy resin composition comprising the same, and an apparatus manufactured by using the same.
    Type: Application
    Filed: May 9, 2014
    Publication date: November 17, 2016
    Inventors: Dong Hwan LEE, Min Gyum KIM, Jung Seob KIM, Jin Min CHEON, Hwan Sung CHEON, Seung HAN
  • CURING CATALYST FOR EPOXY RESIN COMPOSITION, EPOXY RESIN COMPOSITION COMPRISING SAME, AND APPARATUS MANUFACTURED BY USING SAME
    Publication number: 20160326303
    Abstract: The present invention relates to a curing catalyst for an epoxy resin composition represented by chemical formula 1, an epoxy resin composition comprising the same, and an apparatus manufactured using the same.
    Type: Application
    Filed: May 16, 2014
    Publication date: November 10, 2016
    Inventors: Jung Seob KIM, Min Gyum KIM, Dong Hwan LEE, Jin Min CHEON, Hwan Sung CHEON, Seung HAN
  • Quaternary phosphonium salt, epoxy resin composition for encapsulating semiconductor device and including the quaternary phosphonium salt, and semiconductor device encapsulated with the epoxy resin composition
    Patent number: 9428632
    Abstract: A quaternary phosphonium salt, an epoxy resin composition including the quaternary phosphonium salt, and a semiconductor device encapsulated with the epoxy resin composition, the quaternary phosphonium salt being represented by Formula 1:
    Type: Grant
    Filed: November 1, 2013
    Date of Patent: August 30, 2016
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Min Gyum Kim, Seung Han, Hwan Sung Cheon
  • COMPOUND CONTAINING PHOSPHONIUM ION, EPOXY RESIN COMPOSITION CONTAINING SAME, AND DEVICE MANUFACTURED BY USING SAME
    Publication number: 20160159971
    Abstract: The present invention relates to a compound containing phosphonium ion of a chemical formula 1, an epoxy resin composition containing the same, and a device manufactured by using the same.
    Type: Application
    Filed: February 27, 2014
    Publication date: June 9, 2016
    Inventors: Jin Min CHEON, Min Gyum KIM, Jung Seob KIM, Dong Hwan LEE, Hwan Sung CHEON, Seung HAN