Abstract: A semiconductor device includes a multi-channel active pattern, a plurality of gate structures on the multi-channel active pattern and spaced apart from each other in a first direction, the plurality of gate structures including a gate electrode that extends in a second direction different from the first direction, a source/drain recess between the adjacent gate structures, and a source/drain pattern on the multi-channel active pattern in the source/drain recess, wherein the source/drain pattern includes: a semiconductor liner layer including silicon-germanium and extending along the source/drain recess, a semiconductor filling layer including silicon-germanium on the semiconductor liner layer, and at least one or more semiconductor insertion layers between the semiconductor liner layer and the semiconductor filling layer, and wherein the at least one or more semiconductor insertion layers have a saddle structure.

Abstract: A method and an apparatus for encoding/decoding an image according to the present invention may determine a reference area that is a pre-reconstructed area spatially adjacent to a current block on the basis of reference information for specifying the position of a reference area used for predicting a current block and may predict the current block on the basis of the reference area.

Abstract: The present disclosure relates to a healable superplastic amorphous alloy, and specifically, to a healable superplastic amorphous alloy capable of exhibiting superplastic behavior and unique healable behavior by maximizing the complexity of the amorphous structure for an Icosahedral quenched-in nuclei quasi-crystal cluster to be formed in the amorphous matrix through the composition limitation and additive element control of Zr—Cu—Ni—Al alloy.

Abstract: A lighting device includes a light guide plate configured to guide and diffuse a light from a light source, and a garnish body including a lighting area to which the diffused light is radiated, wherein the light guide plate is disposed at a predetermined angle with respect to the garnish body.

Abstract: A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.

Abstract: The present invention relates to a method for preparing an alkali metal ion conductive chalcogenide-based solid electrolyte, a solid electrolyte prepared thereby, and an all-solid-state battery comprising the same.

Abstract: Disclosed herein is a chip on film package including a base film, output wiring disposed on the base film and extending along a first direction, an insulation layer overlapping at least a portion of the output wiring, an output pad portion defined as a region in which the output wiring is exposed without the insulation layer, a semiconductor chip mounted on the base film and electrically connected to the output wiring, and a protective layer disposed between the semiconductor chip and the output pad portion with respect to the first direction.

Abstract: A semiconductor package includes a film substrate; a wiring layer provided on the film substrate; and a semiconductor chip provided on the wiring layer and electrically connected to the wiring layer. The film substrate includes a first layer, wherein the first layer is an insulating layer having the wiring layer thereon. The film substrate further includes a second layer, wherein the second layer is attached to a bottom of the first layer and comprises a gas. The second layer is configured to be peeled off of the first layer.

Abstract: A chip-on-film package may include a film substrate including a chip region and an edge region, a semiconductor chip provided on the chip region and mounted on a top surface of the film substrate, the semiconductor chip including a chip pad adjacent to a bottom surface thereof, an input line and an output line provided on the edge region and disposed on the top surface of the film substrate, a connection terminal interposed between the film substrate and the semiconductor chip, and a redistribution pattern disposed between the semiconductor chip and the connection terminal.

Abstract: Provided is a jetting driver that can be used for various types of heads with minimal changes. The jetting driver includes: an image board receiving raw image data and generating image data by transforming the raw image data into a form suitable for a type of heads used; and an interface board physically separated from the image board, receiving the image data, and transmitting the image data to the heads through a plurality of channels.

Abstract: Embodiments disclose a display panel including a glass substrate including a display area and a light-transmitting area, a circuit portion disposed in the display area, and a light emitting portion disposed on the circuit portion, wherein the glass substrate includes a first opening disposed at a position corresponding to the light-transmitting area, and the display panel includes a first etch-stop layer disposed on the glass substrate and surrounding the first opening, and a display device including the same.

Abstract: A pouch-type secondary battery according to an embodiment of the present invention for achieving the above object includes: an electrode assembly in which electrodes and separators are stacked; a pouch-type battery case comprising a first case and a second case, wherein at least one the first case and the second case comprises a cup part configured to accommodate the electrode assembly; a folding part coupling the first case to the second case; and a protrusion protruding from a portion of each of opposing ends of the folding part, wherein the protrusion has a length of 1.5 mm or less.

Abstract: An apparatus for sealing a battery case includes: a sealing tool configured to seal a side of a pouch-type secondary battery, wherein the sealing tool includes: a body; and a sealing part formed at one side of the body and configured to directly press the side so as to seal the side, wherein the sealing part includes: a weak sealing part configured to seal an inner portion of the side and formed to be recessed inward; and a pattern part configured to seal an outer portion of the side and formed by regularly repeating a rib formed to protrude outward and a groove formed to be recessed inward.

Abstract: An actuator according to an embodiment of the present invention comprises: a magnet; a plurality of position sensors arranged to face the magnet; and a control unit which is connected to each of the plurality of position sensors and receives a signal input to detect the position of the magnet.

Abstract: The present invention relates to an image encoding/decoding method and device, and the image encoding method or device according to an embodiment of the present invention may encode a position of a reference coefficient within a current transform block to be encoded, and encoding skip region information of a skip region selected on the basis of the position of the reference coefficient. The skip region information may represent whether or not coefficients within the skip region have an identical coefficient value.

Abstract: A pouch-type battery case according to an embodiment of the present invention can—include a cup part configured to accommodate an electrode assembly of stacked electrodes and separators. The cup part comprises a plurality of outer walls forming a periphery of the cup part, and a plurality of die edges connecting the plurality of outer walls to a side or degassing part. At least one of the die edges can be rounded to define a curvature radius of 1 mm or less. The cup part can have a depth of 6.5 mm or less.