Abstract: Disclosed is a multi-cyclone dust separating apparatus, comprising a cyclone body, a top cover and a discharge cover. The cyclone body includes a main cyclone and a plurality of cyclone cones communicating with the main cyclone and arranged around a lower part of the main cyclone, each of which has a reverse conical shape whose diameter is reduced as approaching the top end thereof. The top cover is fitted on the top of the cyclone body and has an air inflow port introducing ambient air into the main cyclone. The discharge cover is fitted on the bottom of the main cyclone and collects and discharges the air discharged from the plurality of cyclone cones. Most of the air introduced into the top of the main cyclone through the air inflow port is discharged to the bottom of the main cyclone without being reversed to flow upwardly and then introduced into the plurality of cyclone cones.

Abstract: A dust separating apparatus for a vacuum cleaner includes a dust collection casing with an air inlet at a lower portion, a mesh filter formed on a bottom surface of the dust collection casing to firstly filter the contaminant from the drawn-in air, a plurality of cyclones formed in parallel in the dust collection casing to secondly filter the contaminant in the air drawn in via the air inlet, and a dust collection part formed at one side of the plurality of cyclones to collect the contaminant separated from the air. The air flowed in the air inlet formed at the lower portion of the dust collection casing is sequentially discharged via the mesh filter formed on the bottom surface of the dust collection casing and the plurality of cyclones.

Abstract: A cyclone dust collecting device using a corona discharge is provided. The cyclone dust collecting device includes a cyclone chamber rotating air drawn in from the outside to separate contaminants from the air, a discharge pipe guiding the air separated from the contaminants to the outside of the cyclone chamber and including a discharge electrode part with at least a part made of a conductive material and a power supply unit supplying a power to the discharge electrode part for the discharge electrode part to perform a corona discharge.

Abstract: A cyclone dust separating apparatus for separating dust from external air drawn in thereto and discharging the separated dust, comprises at least one first cyclone body having a tubular shape and forming a first cyclone chamber where the external air is rotated; and at least one second cyclone body forming a second cyclone chamber where the air discharged from the first cyclone chamber is rotated again to separate dust, wherein the external air is drawn in through a lower end of the first cyclone chamber and discharged through an upper end of the first cyclone chamber, and the air discharged from the first cyclone chamber is drawn in through an upper end of the second cyclone chamber and discharged through an upper end of the second cyclone chamber.

Abstract: A multi dust-collecting apparatus for a vacuum cleaner is provided. The apparatus includes a dust-collecting unit having an air guide member to separate dirt particles from drawn-in air by using a gravity and an inertia and a filter member to remove dirt particles from the discharged air. The apparatus also includes a plurality of cyclones to swirl the air discharged from the dust-collecting unit and separate minute dirt particles from the air by using a centrifugal force.

Abstract: A multi-cyclone dust separator according to an embodiment of the present invention comprises at least three dust separation units for separating dust stepwise from relatively larger size. The dust separation units comprise a first dust separation unit primarily separating dust from external air drawn in; a second dust separation unit secondarily separating dust from the air primarily dust-separated by the first dust separation unit; and a third dust separation unit thirdly separating dust from the air secondarily dust-separated by the second dust separation unit. Here, the first to third dust separation units are multi-layered in a serial manner.

Abstract: A cyclone dust separating apparatus has a first cyclone chamber for separating particles from the externally-drawn fluid by centrifugal force, one or more second cyclone chambers for separating particles from the fluid discharged from the first cyclone chamber by centrifugal force, and one or more third cyclone chambers for separating particles from the fluid discharged from the second cyclone chambers, and causing the fluid to be discharged out via a discharge passage. The second and the third cyclone chambers are arranged in radial relation with respect to the first cyclone chamber, and thus, surround the first cyclone chamber. Therefore, the cyclone dust separating apparatus provides multi-stage centrifugal cleaning process and improved cleaning efficiency, while remaining compact-sized.

Abstract: A cyclonic separating apparatus for a vacuum cleaner that can separately collect dust and water. The cyclonic separating apparatus includes: a cyclone body having an air inlet passage and an air discharge passage; a dust receptacle connected to a lower end of the cyclone body; and a screen dividing the cyclone body and interior space of the dust receptacle into a first chamber and a second chamber, the screen having a plurality of passing holes, wherein drawn air rotates in the first chamber and water separated from the air moves to the second chamber through the passing holes.

Abstract: Semiconductor packages are provided to prevent a chip, such as a central processing unit (CPU) chip, from being degraded due to hot spot heat generated during the operation of the chip and absorbs thermomechanical stresses in interfaces between the chip, a thermal interface material (TIM) and a lid. The chip is electrically connected, e.g., flip-chip bonded, to a package substrate. The lid is thermally connected to and disposed over a back surface of the chip with the TIM interposed therebetween. A heat dissipation means adjacent the TIM is also located between the lid and the chip to prevent the hot spot effect.

Abstract: A dust collecting apparatus for a vacuum cleaner, for separating dust and moisture from external air, comprises a cyclone body having an air inlet and an air outlet, a screen mounted in the cyclone body and having a plurality of moisture passing holes, and a dust receptacle engaging the cyclone body to collect therein the dust and moisture separated from the air.

Abstract: Semiconductor packages are provided to prevent a chip, such as a central processing unit (CPU) chip, from being degraded due to hot spot heat generated during the operation of the chip and absorbs thermomechanical stresses in interfaces between the chip, a thermal interface material (TIM) and a lid. The chip is electrically connected, e.g., flip-chip bonded, to a package substrate. The lid is thermally connected to and disposed over a back surface of the chip with the TIM interposed therebetween. A heat dissipation means adjacent the TIM is also located between the lid and the chip to prevent the hot spot effect.

Abstract: Semiconductor packages are provided to prevent a chip, such as a central processing unit (CPU) chip, from being degraded due to hot spot heat generated during the operation of the chip and absorbs thermomechanical stresses in interfaces between the chip, a thermal interface material (TIM) and a lid. The chip is electrically connected, e.g., flip-chip bonded, to a package substrate. The lid is thermally connected to and disposed over a back surface of the chip with the TIM interposed therebetween. A heat dissipation means adjacent the TIM is also located between the lid and the chip to prevent the hot spot effect.

Abstract: A method for remotely-controlling a mobile communication terminal is disclosed. The method includes the steps of: a) determining whether an address of a remote mobile communication terminal is included in a list of short-range mobile communication address; b) if the address of the remote mobile communication terminal is included in the list, controlling the remote mobile communication terminal according to a remote control signal by establishing a communication link with the remote mobile communication terminal from a short distance using a Bluetooth protocol, authorizing a remote control; and c) if not, controlling the remote mobile communication terminal by establishing a call connection with the remote mobile communication terminal and authorizing a remote control.

Abstract: Some embodiments of the invention include two heat exchange members, which are arranged facing each other with a semiconductor module therebetween, the semiconductor module including a plurality of packages; a connection member formed in the middle of each of the heat exchange members to hinge join the heat exchange members such that portions of the heat exchange members protrude above the semiconductor module inserted between the heat exchange members; and an elastic member disposed between the heat exchange members to provide a force pushing portions of the heat exchange members below the connection member toward the packages of the semiconductor module. Other embodiments of the invention are described in the claims.

Abstract: A multi-chip package (MCP) in which heat generated in first and second chips of the MCP is spread effectively and a method for manufacturing the same. The MCP includes first and second chips. The MCP further comprises a tape including a conductive material layer therein situated between the first chip and the second chip. Thus, the heat generated in the second chip can effectively spread to the outside through the tape.

Abstract: A high-power BGA includes a printed circuit board with a through hole, connection pads formed on the bottom of the printed circuit board, matrix solder balls surrounding the through hole and adjacent to the connection pads, a heat spreader on the top surface of the printed circuit board that includes an insulating layer of a high thermal conductivity, a semiconductor chip mounted within the through hole on the bottom surface of the heat spreader that includes a number of contact pads for bonding with the connection pads using gold wires, and a passive film filling the through hole and around the semiconductor chip. By interposing a ceramic insulating layer between the semiconductor chip and the heat spreader, charge generation between the semiconductor chip and the heat spreader is sharply reduced, and defects such as ESD (electrostatic discharge) is reduced during testing and mounting of the package.

Abstract: A multi-chip package (MCP) in which heat generated in first and second chips of the MCP is spread effectively and a method for manufacturing the same. The MCP includes first and second chips. The MCP further comprises a tape including a conductive material layer therein situated between the first chip and the second chip. Thus, the heat generated in the second chip can effectively spread to the outside through the tape.

Abstract: Semiconductor packages are provided to prevent a chip, such as a central processing unit (CPU) chip, from being degraded due to hot spot heat generated during the operation of the chip and absorbs thermomechanical stresses in interfaces between the chip, a thermal interface material (TIM) and a lid. The chip is electrically connected, e.g., flip-chip bonded, to a package substrate. The lid is thermally connected to and disposed over a back surface of the chip with the TIM interposed therebetween. A heat dissipation means adjacent the TIM is also located between the lid and the chip to prevent the hot spot effect.

Abstract: Provided is a semiconductor memory module including semiconductor devices using solder balls as outer connection terminals, which reduces the deterioration of solder joint reliability (SJR) due to the difference in the thermal expansion coefficients of the module components. The memory module includes a module board, an upper heat sink, a lower heat sink and a linking means. The linking means is formed to have a structure that makes it possible to absorb contraction and expansion within the semiconductor module due to the different thermal expansion coefficients of the upper heat sink, the lower heat sink and the module board.

Abstract: An apparatus for cooling a semiconductor package and preventing heat concentration at the central part of a heat sink includes a heat sink for cooling mounted on a semiconductor package and a fan installed over the heat sink. The heat sink includes a base plate, a support bar installed over the base plate for supporting the fan, a plurality of parallel fins, whose lengths decrease in size from a peripheral part to a central part of the heat sink. The parallel fins extend from the base plate. The heat sink further includes air guide plates for guiding air flow in the heat sink to the central part thereof.