Abstract: A display device includes a sensor having a detection electrode. An optical pattern layer is disposed directly on the sensor and includes a plurality of transmission portions and a light blocking portion. A display panel is disposed on the optical pattern layer. A minimum distance between the detection electrode and the light blocking portion is in a range of 1 micrometer-5 micrometers.

Abstract: A display device and a method of manufacturing the same are provided. The display device comprises a substrate comprising a display area in which emission areas are arranged, a main non-display area around the display area, a hole area surrounded by the display area, and an additional non-display area between the hole area and the display area; a circuit layer; a light emitting element layer; a sealing layer; a through portion in the hole area and penetrating at least the substrate; and sealing auxiliary structures in the additional non-display area and sequentially surrounding the hole area. Each of the sealing auxiliary structures comprises a first undercut portion in which a first cover layer protrudes from a first main layer; and a second undercut portion in which a second cover layer protrudes from a second main layer.

Abstract: A heat dissipation module disposed in a projection device and dissipating heat from a heat source includes a heat dissipation member, a thermoelectric cooler, a heat conduction member, and a sealant. The thermoelectric cooler has a heat absorbing surface, a heat dissipating surface contacting the heat dissipation member, and a first side surface adjacent between the heat absorbing surface and the heat dissipating surface. The heat conduction member has a first contact surface, a second contact surface opposite to the first contact surface, and a second side surface adjacent between the first and the second contact surfaces. The first contact surface contacts the heat source, and at least part of the second contact surface contacts the heat absorbing surface. The sealant is filled between the heat dissipation member and the heat source to cover the first side surface and the second side surface. A projection device is also provided.

Abstract: Proposed are a wafer heating apparatus and a wafer processing apparatus using the same. More particularly, proposed are a wafer heating apparatus having an improved structure to enable efficient cooling of a terminal block, and a wafer processing apparatus using the same. A wafer heating apparatus for heating a wafer according to one embodiment includes a heater disposed below the wafer and configured to serve as a heat source, a cooling plate disposed below the heater and configured to provide cool air, and a terminal block configured to supply power to the heater and having a lower end portion in contact with the cooling plate.

Abstract: An interactive control system includes: an active pen; and an electronic device configured to wirelessly control the active pen, receive a user command, and generate a control command according to the user command, wherein at least one of the active pen and the electronic device is configured to execute a control function according to the control command.

Abstract: A haptic feedback method for an electronic system includes pairing an electronic device with a first wireless communication module and an input device with a second wireless communication module and a haptic feedback motor unit, inputting a control signal to the electronic device through the input device, and sending a wireless motor driving signal to the second wireless communication module of the input device by the first wireless communication module of the electronic device according to the control signal, so that the second wireless communication module generates a wired motor driving signal according to the wireless motor driving signal and directly transmits the wired motor driving signal to the haptic feedback motor unit to directly enable vibration of the haptic feedback motor unit.

Abstract: A stylus and a touch interactive device is provided. The stylus includes a pen holder, a cover plate, and a circuit control assembly. The pen holder includes a pen head, a pen wall, and an accommodating space. A groove is defined in the pen wall and communicates with the accommodating space. The pen head is arranged at one end of the pen holder. The cover plate is arranged corresponding to the groove and covers the groove. The circuit control assembly is received in the accommodating space. The circuit control assembly includes a mainboard and a touch sensing module connected to the mainboard. The touch sensing module is attached to the pen wall or a first inner wall of the cover plate to form a touch sensing area. The touch sensing module is used to receive and sense at least one touch command of fingers in the touch sensing area.

Abstract: A stylus and a touch interactive device is provided. The stylus includes a pen holder, a cover plate, and a circuit control assembly. The pen holder includes a pen head, a pen wall, and an accommodating space. A groove is defined in the pen wall and communicates with the accommodating space. The pen head is arranged at one end of the pen holder. The cover plate is arranged corresponding to the groove and covers the groove. The circuit control assembly is received in the accommodating space. The circuit control assembly includes a mainboard and a touch sensing module connected to the mainboard. The touch sensing module is attached to the pen wall or a first inner wall of the cover plate to form a touch sensing area. The touch sensing module is used to receive and sense at least one touch command of fingers in the touch sensing area.

Abstract: An interactive control system includes: an active pen; and an electronic device configured to wirelessly control the active pen, receive a user command, and generate a control command according to the user command, wherein at least one of the active pen and the electronic device is configured to execute a control function according to the control command.

Abstract: An encoding-locked method for audio processing for audio receiving device includes the following steps: inserting a first encryption key into a first digital signal stream so as to obtain a second digital signal stream, checking whether there is the first encryption key in a received digital signal stream so as to determine whether the received digital signal stream is the second digital signal stream, and when the received digital signal stream is not the second digital signal stream, no processing the received digital signal stream.

Abstract: A semiconductor structure is provided. The semiconductor structure comprises a first conductive feature embedded within a first dielectric layer, a via disposed over the first conductive feature, a second conductive feature disposed over the via, and a graphene layer disposed over at least a portion of the first conductive feature. The via electrically couples the first conductive feature to the second conductive feature.

Abstract: An encoding-locked method for audio processing for audio receiving device includes the following steps: inserting a first encryption key into a first digital signal stream so as to obtain a second digital signal stream, checking whether there is the first encryption key in a received digital signal stream so as to determine whether the received digital signal stream is the second digital signal stream, and when the received digital signal stream is not the second digital signal stream, no processing the received digital signal stream.

Abstract: An integrated framework of a memory storage module and a sensor module comprises a sensor controller, an embedded memory storage device controller, a microcontroller, and a non-volatile memory. By way of integrating the sensor controller and the embedded memory storage device controller sharing a same microcontroller and a same non-volatile memory, the complexity of packaging and the manufacturing cost are accordingly reduced.