Patents by Inventor Min Han

Min Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240317035
    Abstract: A sealing structure of an active weather strip is arranged such that a nozzle resin is mounted in an air injection hole connected to an air chamber formed inside the weather strip in the shape of a closed type ring, and an air control module is connected to the nozzle resin through an air hose. In response to driving conditions of a vehicle, air is injected into or discharged from the air chamber inside the weather strip by an air control module to adjust a reaction force of the weather strip, so as to improve door closing characteristics and minimize an inflow of wind sounds while maintaining airtightness even at a high pressure.
    Type: Application
    Filed: August 9, 2023
    Publication date: September 26, 2024
    Inventors: Myung-Hee Lee, Hyung-Sik Choi, Min-Han Ryu, Jong-Seon Lee, Hyun-Sung Nam, Jang-Kwon Kim, Yoo-Geun Jeon
  • Patent number: 12100633
    Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.
    Type: Grant
    Filed: June 27, 2023
    Date of Patent: September 24, 2024
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Ho-Chuan Lin, Min-Han Chuang, Chia-Chu Lai
  • Patent number: 12100648
    Abstract: An electronic module is provided, in which a first metal layer, an insulating layer and a second metal layer are sequentially formed on side faces and a non-active face of an electronic component to serve as a capacitor structure, where the capacitor structure is exposed from an active face of the electronic component so that by directly forming the capacitor structure on the electronic component, a distance between the capacitor structure and the electronic component is minimized, such that the effect of suppressing impedance can be optimized.
    Type: Grant
    Filed: August 16, 2023
    Date of Patent: September 24, 2024
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Ho-Chuan Lin, Chia-Chu Lai, Min-Han Chuang
  • Publication number: 20240295675
    Abstract: A water-repellent coating lens for a camera has enhanced abrasion resistance performance and chemical resistance performance of the water-repellent coating. The water-repellent coating lens includes a lens base layer and a plurality of coating layers deposited on the lens base layer. The plurality of coating layers include a first water-repellent coating layer containing a fluorine-based compound and a second water-repellent coating layer positioned on the bottom surface of the first water-repellent coating layer and containing an inorganic oxide.
    Type: Application
    Filed: July 19, 2023
    Publication date: September 5, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, SEKONIX CO. LTD.
    Inventors: Jai-Min Han, Byung-Kyu Cho, Kwang-Joon Han, Ji-Woong Yeon, Jin-Ho Kim
  • Publication number: 20240290674
    Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.
    Type: Application
    Filed: May 6, 2024
    Publication date: August 29, 2024
    Inventors: Ho-Chuan LIN, Min-Han CHUANG, Chia-Chu LAI
  • Publication number: 20240287747
    Abstract: An artificial turf structure includes a protective layer, a buffer layer disposed on a lower surface of the protective layer and having a three-dimensional structure comprising a front surface layer, an intermediate layer and a rear surface layer, a bubble layer disposed on a lower surface of the buffer layer, a pile unit tufted to the protective layer, the buffer layer and the bubble layer, and a backing layer disposed on a lower surface of the bubble layer and preventing the pile unit from leaving.
    Type: Application
    Filed: January 5, 2024
    Publication date: August 29, 2024
    Inventors: Kwang Su CHO, Eun Seon JEONG, Seung Min HAN, Hyun Joung JUN, Ki Tae BAE, Se Jun HWANG, Hye In BANG
  • Publication number: 20240290675
    Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.
    Type: Application
    Filed: May 9, 2024
    Publication date: August 29, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Ho-Chuan LIN, Min-Han CHUANG, Chia-Chu LAI
  • Publication number: 20240290691
    Abstract: An electronic package and a manufacturing method thereof are provided, in which a magnetically permeable member and a plurality of supporting members having conductive through vias are disposed on a carrier structure having a circuit layer, the magnetically permeable member is located between two supporting members, and a conductive member is disposed on the supporting members to cover the magnetically permeable member, so that the circuit layer, the conductive through vias and the conductive member form a coil surrounding the magnetically permeable member to increase the inductance.
    Type: Application
    Filed: June 26, 2023
    Publication date: August 29, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Min-Han CHUANG, Ho-Chuan LIN, Chia-Chu LAI
  • Patent number: 12072079
    Abstract: A lamp for a laptop includes a lamp arm, a base, and a lamp body. The lamp arm has a connecting element and a first electrical contact located at the connecting element. The base has a first rotating shaft portion fixedly connected to the connecting element. The lamp body includes a casing, a circuit board, a second electrical contact, and a flexible circuit board. The casing has a second rotating shaft portion adapted to rotate relative to the first rotating shaft portion. The circuit board is disposed in the casing. The second electrical contact passing through the first rotating shaft portion is configured to contact the first electrical contact. The flexible circuit board is electrically connected between the circuit board and the second electrical contact. When the lamp body is rotated, the relative position of the second electrical contact and the first electrical contact is fixed.
    Type: Grant
    Filed: January 3, 2024
    Date of Patent: August 27, 2024
    Assignee: Qisda Corporation
    Inventor: Min Han Zhan
  • Patent number: 12068211
    Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.
    Type: Grant
    Filed: June 27, 2023
    Date of Patent: August 20, 2024
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Ho-Chuan Lin, Min-Han Chuang, Chia-Chu Lai
  • Patent number: 12065133
    Abstract: An apparatus for controlling a host vehicle may include: a processor configured to calculate a cut-in possibility in which a nearby vehicle cuts into a lane on which the host vehicle travels ahead of the host vehicle, to determine a plurality of cut-in steps of the calculated cut-in possibility, and to control operation of the host vehicle so as to perform an inter-vehicle distance control operation or to provide a warning to a user of the host vehicle based on a state of the user in each of the plurality of cut-in steps; and storage configured to store the calculated cut-in possibility.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: August 20, 2024
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Dae Young Kim, Young Min Han
  • Patent number: 12057552
    Abstract: A method for manufacturing a secondary battery capable of preventing the phenomenon of bending of an electrode stack generated in an activation step, and a secondary battery produced thereby are provided. The method of manufacturing a lithium secondary battery includes (a) a step of manufacturing a lithium secondary battery by embedding an electrode stack together with an electrolyte in a battery case, (b) a step of aging the battery at room temperature, (c) a hot press step of applying pressure and heat to the lithium secondary battery, and (d) a step of charging the battery, in which a stack surface of the electrode stack is laminated by the hot press step. In the process of activating the secondary battery in which the electrolyte is injected by performing a hot press step, it is possible laminate the stack surface of the electrode stack before the charging process.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: August 6, 2024
    Assignee: LG ENERGY SOLUTION, LTD.
    Inventors: In Tae Chun, Jae Huoung Son, Chang Min Han, Ik Soo Chae, Chang Bum Ahn
  • Publication number: 20240258109
    Abstract: A method of forming a structure on a substrate includes forming an adhesion layer on a substrate. The method further includes forming a tungsten containing layer in-situ with the adhesion layer. The tungsten containing layer is formed by a one-time soak process including soaking the substrate once, and only once, in a first gas, purging the first gas, and soaking the substrate once, and only once, in a second gas. The method further includes removing the tungsten containing layer from the adhesion layer.
    Type: Application
    Filed: December 7, 2023
    Publication date: August 1, 2024
    Inventors: Xi CEN, Kai WU, Min-Han LEE, Yang LI, Cheng CHENG, Zhixiu LIANG
  • Publication number: 20240258499
    Abstract: A positive electrode active material for a secondary battery includes a lithium composite transition metal oxide including nickel (Ni), cobalt (Co), and manganese (Mn), and at least one particle growth-promoting element selected from the group consisting of strontium (Sr), zirconium (Zr), magnesium (Mg), yttrium (Y), and aluminum (Al). The lithium composite transition metal oxide includes the nickel (Ni) in an amount of 65 mol % or more and the manganese (Mn) in an amount of 5 mol % or more based on a total amount of transition metals, and the positive active material has a single particle.
    Type: Application
    Filed: February 16, 2024
    Publication date: August 1, 2024
    Applicant: LG Energy Solution, Ltd.
    Inventors: Sung Bin Park, Dong Hun Lee, Hyung Man Cho, Jung Min Han, Jin Tae Hwang, Wang Mo Jung
  • Patent number: 12051617
    Abstract: A method includes depositing a metallic hardmask over a dielectric layer. The method further includes etching a metallic hardmask opening in the metallic hardmask to expose a top surface of the dielectric layer. Th method further includes modifying a sidewall of the metallic hardmask opening by adding non-metal atoms into the metallic hardmask. The method further includes depositing a conductive material in the metallic hardmask opening.
    Type: Grant
    Filed: July 29, 2022
    Date of Patent: July 30, 2024
    Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., TSMC NANJING COMPANY, LIMITED
    Inventors: Min Han Hsu, Chun-Chang Chen, Jung-Chih Tsao
  • Publication number: 20240247785
    Abstract: A lamp for a laptop includes a lamp arm, a base, and a lamp body. The lamp arm has a connecting element and a first electrical contact located at the connecting element. The base has a first rotating shaft portion fixedly connected to the connecting element. The lamp body includes a casing, a circuit board, a second electrical contact, and a flexible circuit board. The casing has a second rotating shaft portion adapted to rotate relative to the first rotating shaft portion. The circuit board is disposed in the casing. The second electrical contact passing through the first rotating shaft portion is configured to contact the first electrical contact. The flexible circuit board is electrically connected between the circuit board and the second electrical contact. When the lamp body is rotated, the relative position of the second electrical contact and the first electrical contact is fixed.
    Type: Application
    Filed: January 3, 2024
    Publication date: July 25, 2024
    Applicant: Qisda Corporation
    Inventor: Min Han Zhan
  • Publication number: 20240250076
    Abstract: An electronic device includes a first curved module and a second curved module. The first curved module includes a first electronic element and a first curved unit. The second curved module is spliced to one side of the first curved module and includes a second electronic element and a second curved unit. The first curved unit and the second curved unit include curved surfaces.
    Type: Application
    Filed: January 3, 2024
    Publication date: July 25, 2024
    Applicant: Innolux Corporation
    Inventors: Kuang-Pin Chao, Min-Han Tsai, Hao-Jung Huang
  • Publication number: 20240240314
    Abstract: Embodiments of the disclosure relate to methods for metal gapfill of a logic device with lower resistivity. Specific embodiments provide integrated separate tungsten PVD processes with plasma-etch to solve the overhang issue caused by tungsten PVD and the high resistivity caused by nucleation.
    Type: Application
    Filed: January 2, 2024
    Publication date: July 18, 2024
    Applicant: Applied Materials, Inc.
    Inventors: Zhen Liu, Min-Han Lee, Jie Zhang, Yongqian Gao, Tsung-Han Yang, Rongjun Wang
  • Patent number: 12040473
    Abstract: The present disclosure provides a method for manufacturing a positive electrode for a secondary battery, the method including forming a positive electrode mixture layer including a positive electrode active material on a positive electrode current collector, and forming a metal oxide coating layer on the positive electrode mixture layer by atomic layer deposition, wherein the positive electrode active material includes lithium composite transition metal oxide particles and a boron-containing coating layer formed on the lithium composite transition metal oxide particles, and the lithium composite transition metal oxide particles include nickel (Ni), cobalt (Co), and manganese (Mn), wherein the nickel (Ni) is 60 mol % or greater of all metals excluding lithium.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: July 16, 2024
    Assignee: LG Energy Solution, Ltd.
    Inventors: Sung Bin Park, Dong Hun Lee, Hyung Man Cho, Jung Min Han, Jin Tae Hwang, Wang Mo Jung
  • Publication number: 20240231416
    Abstract: The present disclosure discloses a memory access interface device. A clock generation circuit generates reference signals. A transmitter transmits an output command and address signal to a memory device according to the reference signals. A signal training circuit executes a training process in a training mode that includes steps outlined below. A training signal is generated such that the training signal is transmitted as the output command and address signal. The training signal and the data signal generated by the memory device are compared to generate a comparison result indicating whether the data signal matches the training signal. The comparison result is stored. The clock generation circuit is controlled to modify a phase of at least one of the reference signals to be one of a plurality of under-test phases to execute a new loop of the training process until all the under-test phases are trained.
    Type: Application
    Filed: October 25, 2022
    Publication date: July 11, 2024
    Inventors: FU-CHIN TSAI, GER-CHIH CHOU, CHUN-CHI YU, CHIH-WEI CHANG, MIN-HAN TSAI