Patents by Inventor Min-Hang WENG

Min-Hang WENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250126688
    Abstract: A continuous microwave curing system, includes a heating cavity with a microwave power source and an inlet opening and an outlet opening on opposite sides; a first microwave suppression cavity, connected to the inlet opening of the heating cavity; a second microwave suppression cavity, connected to the outlet opening of the heating cavity; a conveyor belt, used to transport a laminated structure that needs to be heated by microwave power; wherein the laminated structure includes at least one adhesive and two layers of objects, the adhesive is placed between the two layers of objects. A continuous microwave curing process includes placing an adhesive between two layers of objects to form a laminated structure and using a conveyor belt to send the laminated structure into a heating cavity for heating with microwave power for a period of time, so that the temperature of the adhesive reaches above 60 degrees.
    Type: Application
    Filed: April 15, 2024
    Publication date: April 17, 2025
    Inventors: Ru-Yuan YANG, Min-Hang WENG
  • Publication number: 20240334948
    Abstract: A method for puffing natural cheese includes the following steps of: step 1: subjecting a natural cheese to a physical pretreatment to form a target shape; step 2: placing the natural cheese after physical pretreatment into a bearing plate; step 3: sending the natural cheese placed in the bearing plate into a puffing cavity of a puffing equipment; step 4: setting multiple puffing process parameters for the puffing equipment; step 5: providing an electromagnetic energy by the puffing equipment to perform a puffing process on the natural cheese; and step 6: producing a puffed product after the puffing process is completed. A puffed product of natural cheese uses the process disclosed above. The technology of the method and the puffed product has great market potential for the puffed food production of natural cheese.
    Type: Application
    Filed: February 20, 2024
    Publication date: October 10, 2024
    Inventors: Min-Hang WENG, Tsung-Chih YU, Tung-Chieh YANG, Chia-Chen CHANG
  • Publication number: 20240149315
    Abstract: The present invention discloses a microwave heating system for desorbing contaminated soil, comprising: a feeding module; a heating cavity; a first microwave suppression cavity; a second microwave suppression cavity; a conveyor belt; a feeding device; and an exhaust module. The feeding device is arranged above the first microwave suppression cavity or the second microwave suppression cavity, and the feeding device contains a microwave absorber material. The invention further discloses a microwave heating process for desorption of polluted soil. With the microwave heating system and process for desorbing contaminated soil, the contaminated soil can be heated quickly and uniformly, and quickly cooled and taken out smoothly.
    Type: Application
    Filed: September 7, 2023
    Publication date: May 9, 2024
    Inventors: Tsung-Chih YU, Tung-Chieh YANG, Wu-Yeh LEE, Min-Hang WENG
  • Publication number: 20180149644
    Abstract: A biosensor includes a microstrip resonator, a collection actuator disposed adjacent to and spaced from the microstrip resonator, a port unit connected to a network analyzer and coupled with the microstrip resonator, and a substrate. The microstrip resonator includes a collecting portion provided with an analyte-specific reagent (ASR) for binding an analyte in a suspension. The collection actuator and the microstrip resonator are applied with alternating current (AC) electric energy to induce AC electrokinetic stirring in the suspension for actuating the binding. The microstrip resonator resonates at a resonant frequency associated with the binding so that the analyte can be quantified.
    Type: Application
    Filed: December 30, 2016
    Publication date: May 31, 2018
    Inventors: Tung-Chieh YANG, Yu-Jie LAN, Tsung-Chih YU, Min-Hang WENG, Siang-Wen LAN, Ru-Yuan YANG, Tien-Chun TSAI, Hsien-Chang CHANG
  • Publication number: 20160149281
    Abstract: A coplanar waveguide structure is provided, which includes a transparent substrate, a center conductor, a first ground conductor and a second ground conductor. The center conductor is disposed on the transparent substrate. The center conductor has a first light transmissive area. The first light transmissive area is greater than 80% of the area of the center conductor. The first ground conductor is disposed on the transparent substrate and opposite to a side of the center conductor. The first ground conductor has a second light transmissive area. The second light transmissive area is greater than 83% of the area of the first ground conductor. The second ground conductor is disposed on the transparent substrate and opposite to another side of the center conductor. The second ground conductor has a third light transmissive area. The third light transmissive area is greater than 83% of the area of the second ground conductor.
    Type: Application
    Filed: December 9, 2014
    Publication date: May 26, 2016
    Inventors: Cheng-Yuan HUNG, Hung-Wei WU, Yung-Wei CHEN, Min-Hang WENG, Yii-Der WU
  • Publication number: 20160149306
    Abstract: A microstrip antenna structure is provided, which includes a substrate, a ring microstrip line and a signal transmission port. The substrate has opposite first and second surfaces. The ring microstrip line is disposed on the first surface of the substrate. The ring microstrip line has a short coupling gap ranged between 0.004?g and 0.06?g for forming a radiation bandwidth with high selectivity, where ?g represents a guided wavelength of an electromagnetic wave in the ring microstrip line corresponding to a center frequency of the radiation bandwidth. The signal transmission port is disposed on the second surface of the substrate. The signal transmission port penetrates through the substrate and is electrically connected to the ring microstrip line.
    Type: Application
    Filed: December 9, 2014
    Publication date: May 26, 2016
    Inventors: Cheng-Yuan HUNG, Min-Hang WENG, Siang-Wen LAN, Shoou-Jinn CHANG, Ru-Yuan YANG, Tsung-Chih YU