Abstract: Disclosed is a muffler for an exhaust system of a vehicle, which improves fuel efficiency through weight reduction and reduces deterioration of peripheral components. To this end, the present provides a muffler for an exhaust system of a vehicle. More specifically, the muffler includes a triple-material hollow casing, in which an outer layer formed of a plastic material and disposed on the outermost surface of the muffler, an intermediate insulating layer disposed on the inside of the outer layer and containing an aerogel material, and an inner layer formed of a stainless steel material and disposed on the inside of the intermediate insulating layer are stacked.

Abstract: Disclosed is a lightweight reinforced plastic composite composition for a front-end module carrier, wherein glass fiber and carbon fiber are added as reinforcing agent to a resin mixture of an engineering plastic resin, such as polyamide, and a general-use plastic resin, such as polyalkylene. The disclosed composite composition is an ecofriendly composite material effective in reducing carbon dioxide emission and improving fuel efficiency in automobiles through reinforcement and weight reduction of the front-end module carrier.

Abstract: Provided is a method of producing 1,3-propanediol by culturing a recombinant strain in which the glycerol oxidative pathway had been blocked, and more particularly a method of producing 1,3-propanediol by two-step culture of a recombinant strain in which the oxidative pathway that produces byproducts in the glycerol metabolic pathway had been blocked. When the recombinant strain in which the glycerol oxidative pathway that produces byproducts had been blocked is cultured in two steps, 1,3-propanediol can be produced with improved yield without producing products that result in an increase in purification costs.

Abstract: The present invention provides a low-noise plastic intercooler pipe. In preferred embodiments, the present invention preferably provides a low-noise plastic intercooler pipe having a multi-layered structure including: a skin layer including a thermoplastic etherester elastomer (TEEE) and a soundproof core layer including glass bubbles.

Abstract: Provided are a thermoplastic composite for an impact modifier and a method for preparing the same. More particularly, the thermoplastic composite includes a polycarbonate resin including carbon nanotube and cyclic butylene terephthalate impregnated into a fiber mat. The thermoplastic composite is prepared by uniformly coating a polycarbonate resin including carbon nanotube and cyclic butylene terephthalate on a fiber mat and heating to melt the resin, so that the melt resin is impregnated into the fiber mat. With superior mechanical strength, conductivity, electromagnetic shielding property and coating property, the disclosed thermoplastic composite may replace the currently used steel-based impact modifiers such as bumper back beams, front-end module carriers, door side impact bars, or the like.

Abstract: Provided is a method of producing 1,3-propanediol by culturing a recombinant strain in which the glycerol oxidative pathway had been blocked, and more particularly a method of producing 1,3-propanediol by two-step culture of a recombinant strain in which the oxidative pathway that produces byproducts in the glycerol metabolic pathway had been blocked. When the recombinant strain in which the glycerol oxidative pathway that produces byproducts had been blocked is cultured in two steps, 1,3-propanediol can be produced with improved yield without producing products that result in an increase in purification costs.

Abstract: A developing-transferring module includes a sub frame which is detachably mounted to a main frame, a plurality of photosensitive units which are disposed inside the sub frame with a predetermined interval and includes a photosensitive body to which a developer is attached, and a intermediate transferring unit which are provided inside the sub frame disposed opposite the plurality of photosensitive units so that the developer of the photosensitive units can be primarily transferred thereto and secondarily transfers the primarily transferred developer to a record medium of the main frame.

Abstract: A developing-transferring module includes a sub frame which is detachably mounted to a main frame, a plurality of photosensitive units which are disposed inside the sub frame with a predetermined interval and includes a photosensitive body to which a developer is attached, and a intermediate transferring unit which are provided inside the sub frame disposed opposite the plurality of photosensitive units so that the developer of the photosensitive units can be primarily transferred thereto and secondarily transfers the primarily transferred developer to a record medium of the main frame.

Abstract: A developing-transferring module includes a sub frame which is detachably mounted to a main frame, a plurality of photosensitive units which are disposed inside the sub frame with a predetermined interval and includes a photosensitive body to which a developer is attached, and a intermediate transferring unit which are provided inside the sub frame disposed opposite the plurality of photosensitive units so that the developer of the photosensitive units can be primarily transferred thereto and secondarily transfers the primarily transferred developer to a record medium of the main frame.

Abstract: Provided are an aluminium alloy and a manufacturing method thereof. In the method, aluminium and a master alloy containing a calcium (Ca)-based compound are provided. A melt is prepared, in which the master alloy and the Al are melted. The aluminum alloy may be manufactured by casting the melt.

Abstract: The present invention provides a low-noise plastic intercooler pipe. In preferred embodiments, the present invention preferably provides a low-noise plastic intercooler pipe having a multi-layered structure including: a skin layer including a thermoplastic etherester elastomer (TEEE) and a soundproof core layer including glass bubbles.

Abstract: Provided are an aluminium alloy and a manufacturing method thereof. In the method, aluminium and a magnesium (Mg) master alloy containing a calcium (Ca)-based compound are provided. A melt is prepared, in which the Mg master alloy and the Al are melted. The aluminum alloy may be manufactured by casting the melt.

Abstract: A photolithography process facility comprising a substrate treating apparatus, the substrate treating apparatus includes a temperature control plate controlling a temperature a substrate, a central supporter having a pin shape vertically penetrating the temperature control plate and supporting a central region of substrate, and a collision preventer preventing a collision between the substrate and the temperature control plate.

Abstract: A method for forming an electrochromic layer pattern includes forming a transparent electrode layer and a photoresist layer on a transparent substrate, forming a photoresist pattern by laser interference lithography, and depositing an electrochromic layer pattern on the transparent electrode through openings defined by the photoresist pattern by depositing an electrochromic layer on a front surface of the substrate and then lifting up the photoresist pattern. An insulation layer may be further formed between the transparent layer and the photoresist layer. Here, the electrochromic layer may be formed after an insulation layer pattern is formed using the photoresist pattern as an etching mask. In this case, the electrochromic layer pattern is formed in openings defined by the insulation layer pattern. As a result, a contact surface area between the electrochromic layer pattern and the ion conductive layer is increased to ensure a rapid response speed.

Abstract: Disclosed is a light emitting diode (LED) device that comprises a crystal structure of a sapphire substrate-free gallium nitride (GaN) LED, wherein the crystal structure is mounted on a first surface of a sub-mount substrate in the form of a unit chip, and the first surface of the sub-mount substrate has a surface area greater than the surface area of a region in which the unit chip is bonded. Preforms for manufacturing the LED device and a method for manufacturing the LED device are also disclosed. The sapphire substrate, on which the crystal structure of the light emitting diode has grown, is processed into a unit chip before being removed. Thus, any crack in the crystal structure of the light emitting diode that may occur during the removal of the sapphire substrate can be prevented. Therefore, a thin light emitting diode device can be manufactured in a mass production system.

Abstract: The present invention discloses a keyboard comprising light emitting devices, each respectively disposed below a key to lighten the top surface of the key; and a micro controller unit transmitting signals generated by each key to the computer, having switches for controlling the light emitting devices, and controlling switches according to signals transmitted from the computer, and a method of selecting the colors of the keys of the same.

Abstract: The present invention provides long-fiber reinforced polypropylene compositions comprising: (a) about 29-77 wt % of a crystalline polypropylene resin comprising about 50-100 wt % of a propylene homopolymer; (b) about 20-50 wt % of a long-fiber reinforcing material having an average fiber length of about 3-50 mm and an average diameter of about 4-30 ?m; (c) about 2-20 wt % of an elastomer, a plastomer, or a mixture thereof having a melt index as measured at 190° C. of about 20-150 g/10 min, wherein said elastomer, plastomer, or mixture thereof was polymerized by a metallocene-based catalyst; and (d) about 0.01-3 wt % of a radical initiator, wherein the ratio of the melt index as measured at 230° C. of the crystalline polypropylene resin to the melt index as measured at 190° C. of the elastomer, the plastomer, or the mixture thereof is in the range of about 0.5 to about 10.

Abstract: A chuck assembly for high density plasma equipment includes: a chuck having an upper surface and a plurality of pin holes formed in an outer peripheral portion, wherein the chuck upper surface is configured to receive a semiconductor substrate thereon; a substrate guide disposed on an outer surface of the chuck, wherein the substrate guide is configured to prevent a semiconductor substrate positioned on the upper surface of the chuck from being separated from the chuck; a fixing plate disposed at a lower portion of the chuck; a plurality of lift pins secured to the fixing plate and extending in an upward direction from the fixing plate so that each lift pin is inserted into a respective one of the pin holes, wherein each lift pin has an upper surface that extends to a position adjacent to the upper surface of the chuck; and a chuck lifter penetrating the fixing plate and engaged with a lower portion of the chuck, wherein the chuck lifter is configured to move the chuck upward and downward.