Patents by Inventor Min-Ho IM

Min-Ho IM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LAMINATION METHOD OF ADHESIVE TAPE AND LEAD FRAME
    Publication number: 20110056623
    Abstract: This disclosure provides a method for laminating an adhesive tape and a lead frame, more specifically to reduce the warpage of a lead frame after heated lamination in which an adhesive tape for manufacturing semiconductor devices is attached to the lead frame, satisfying all the properties required for lamination, and avoiding adhesive residues from adhesive tapes and the leakage of a sealing resin. A method for laminating an adhesive tape and a lead frame comprises laminating an adhesive tape and a lead, wherein the lamination temperature of an adhesive tape surface and that of a lead frame surface are different from each other, for example, wherein the lamination temperature of the lead frame surface is lower than that of the adhesive tape surface by about 1 to about 200° C.
    Type: Application
    Filed: November 10, 2009
    Publication date: March 10, 2011
    Applicant: Toray Saehan, Inc.
    Inventors: Min-Ho IM, Sung-Hwan Choi, Chang-Hoon Sim, Ki-Jeong Moon, Hae-Sang Jeon