Abstract: A radiator structure is provided. The radiator structure includes a substrate, a first metal coating layer and a second metal coating layer. The first metal coating layer and the second metal coating layer are made of materials different from one another, and are formed on the substrate by different processes. The first metal coating layer is a non-first masking area formed on the substrate by wet processing. The second metal coating layer is a non-second masking area correspondingly formed on the first metal coating layer and the substrate by sputtering. A first masking area and a second masking area are not necessarily the same.

Abstract: A heat-dissipating substrate with a coating structure is provided. The heat-dissipating substrate includes at least two layers. A base layer is configured to dissipate heat, and one or more sputtered layers are formed on the base layer. The sputtered layer has a corrosion resistant property, a soldering ability, or a sintering ability. A thickness of the sputtered layer is less than 5 ?m.

Abstract: A heat-dissipation substrate structure with high adhesive strength is provided. The heat-dissipation substrate structure includes a heat-dissipation base layer, a functional layer, and a matching layer. The functional layer is formed by sputtering, and has a single layer structure or a multi-layer structure. A thickness of each layer of the functional layer is less than 3 ?m. The matching layer has a single layer structure or a multi-layer structure, and a thickness of each layer of the multi-layer structure of the matching layer is less than 1 ?m. The matching layer is formed by sputtering of one or any two of titanium, titanium alloy, nickel, and nickel alloy. The functional layer and the heat-dissipation base layer are two heterogeneous metal layers, and the matching layer is located between the functional layer and the heat-dissipation base layer.

Abstract: A heat-dissipation substrate having a gradient sputtered structure includes at least two layers. A first layer is a heat-dissipation base layer, and a second layer is a gradient sputtered layer that is bonded onto the heat-dissipation base layer by gradient sputtering. An outermost surface layer of the gradient sputtered layer is a functional layer, and the gradient sputtered layer contains a main component of the heat-dissipation base layer and that of the functional layer. A percentage of the main component of the functional layer contained in the gradient sputtered layer monotonically increases or strictly monotonically increases along a direction from the heat-dissipation base layer toward the functional layer, and a percentage of the main component of the heat-dissipation base layer contained in the gradient sputtered layer monotonically increases or strictly monotonically increases along a direction from the functional layer toward the heat-dissipation base layer.

Abstract: A radiator structure is provided. The radiator structure includes a substrate, a first metal coating layer and a second metal coating layer. The first metal coating layer and the second metal coating layer are made of materials different from one another, and are formed on the substrate by different processes. The first metal coating layer is a non-first masking area formed on the substrate by wet processing. The second metal coating layer is a non-second masking area correspondingly formed on the first metal coating layer and the substrate by sputtering. A first masking area and a second masking area are not necessarily the same.

Abstract: A heat dissipation substrate for increasing solderability is provided. The heat dissipation substrate for increasing solderability includes a heat dissipation layer serving as a base layer, a plating layer formed on the heat dissipation layer, and a protective layer formed on the plating layer. The protective layer is made of one of tin and tin alloy, and the protective layer is capable of being melted in a subsequent process, such that the protective layer is a meltable protective layer.

Abstract: A heat-dissipating substrate with a coating structure is provided. The heat-dissipating substrate includes at least two layers. A base layer is a heat dissipation layer, and one or more sputtered layers are formed on the heat dissipation layer. The sputtered layer has a corrosion resistant property, a soldering ability, or a sintering ability. A thickness of the sputtered layer is less than 5000 nm.

Abstract: A copper-alloy heat-dissipation structure with a milled surface includes a heat-dissipation main body. The heat-dissipation main body has a first milled surface and a second milled surface that are opposite to each other, where heat-dissipation fins are formed on the first milled surface, and the maximum height roughness Rz of the second milled surface ranges from 2.5 ?m to 5.4 ?m.

Abstract: A copper-alloy heat-dissipation structure with a milled surface includes a heat-dissipation main body. The heat-dissipation main body has a first milled surface and a second milled surface that are opposite to each other, where heat-dissipation fins are formed on the first milled surface, and the maximum height roughness Rz of the second milled surface ranges from 1.5 ?m to 5.4 ?m.