Patents by Inventor MIN-HSI CHEN

MIN-HSI CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTEGRATED CIRCUIT FLIP-CHIP AND LIGHT-EMITTING DEVICE
    Publication number: 20240347486
    Abstract: An integrated circuit (IC) flip-chip and a light-emitting device are provided. The IC flip-chip includes a chip body, a plurality of metal pads, and a plurality of flip-chip pads. The chip body has a surface. The metal pads are disposed on the surface of the chip body. The flip-chip pads are disposed on the metal pads, and the flip-chip pads are electrically coupled to the metal pads through a redistribution layer therebetween. A distribution of the flip-chip pads is more even than a distribution of the metal pads.
    Type: Application
    Filed: May 29, 2024
    Publication date: October 17, 2024
    Inventors: CHEN-HSIU LIN, MIN-HSI CHEN, CHANG-HUNG HSIEH, SHAN-HUI CHEN, YU-HSUAN CHU
  • Light-emitting device, light-emitting assembly, and integrated circuit flip-chip
    Patent number: 12009459
    Abstract: A light-emitting device, a light-emitting assembly and an integrated circuit (IC) flip-chip are provided. The light-emitting device includes the IC flip-chip, a plurality of light-emitting diode (LED) flip-chips and a substrate. The IC flip-chip includes a plurality of flip-chip pads. The LED flip-chips are spaced apart from the IC flip-chip. The substrate carries the IC flip-chip and the LED flip-chips. The LED flip-chips have a plurality of electrodes, and the flip-chip pads of the IC flip-chip and the electrodes of the LED flip-chips are disposed on the substrate by way of soldering. The LED flip-chips are electrically coupled to the IC flip-chip through the substrate.
    Type: Grant
    Filed: August 1, 2021
    Date of Patent: June 11, 2024
    Assignee: LITE-ON TECHNOLOGY CORPORATION
    Inventors: Chen-Hsiu Lin, Min-Hsi Chen
  • LIGHT-EMITTING DEVICE, LIGHT-EMITTING ASSEMBLY, AND INTEGRATED CIRCUIT FLIP-CHIP
    Publication number: 20220052230
    Abstract: A light-emitting device, a light-emitting assembly and an integrated circuit (IC) flip-chip are provided. The light-emitting device includes the IC flip-chip, a plurality of light-emitting diode (LED) flip-chips and a substrate. The IC flip-chip includes a plurality of flip-chip pads. The LED flip-chips are spaced apart from the IC flip-chip. The substrate carries the IC flip-chip and the LED flip-chips. The LED flip-chips have a plurality of electrodes, and the flip-chip pads of the IC flip-chip and the electrodes of the LED flip-chips are disposed on the substrate by way of soldering. The LED flip-chips are electrically coupled to the IC flip-chip through the substrate.
    Type: Application
    Filed: August 1, 2021
    Publication date: February 17, 2022
    Inventors: CHEN-HSIU LIN, MIN-HSI CHEN