Patents by Inventor Min-Hsiang Chen

Min-Hsiang Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fabricating a conductive trace structure and substrate having the structure
    Patent number: 9826634
    Abstract: A method for fabricating a conductive trace structure includes the steps: forming a first metal layer on a non-conductive substrate; removing a part of the first metal layer to expose the non-conductive substrate so as to form the first metal layer into a plating region and a non-plating region, the plating region being divided into at least two trace-forming portions and at least one bridge portion; forming a second metal layer on the plating region by electroplating the plating region using one of the trace-forming portions and the bridge portion as an electrode; and removing the bridge portion and the second metal layer formed on the bridge portion.
    Type: Grant
    Filed: November 27, 2012
    Date of Patent: November 21, 2017
    Assignee: Taiwan Green Point Enterprises, Co., Ltd.
    Inventors: Sheng-Hung Yi, Pen-Yi Liao, Min-Hsiang Chen
  • FABRICATING A CONDUCTIVE TRACE STRUCTURE AND SUBSTRATE HAVING THE STRUCTURE
    Publication number: 20140374141
    Abstract: A method for fabricating a conductive trace structure includes the steps: forming a first metal layer on a non-conductive substrate; removing a part of the first metal layer to expose the non-conductive substrate so as to form the first metal layer into a plating region and a non-plating region, the plating region being divided into at least two trace-forming portions and at least one bridge portion; forming a second metal layer on the plating region by electroplating the plating region using one of the trace-forming portions and the bridge portion as an electrode; and removing the bridge portion and the second metal layer formed on the bridge portion.
    Type: Application
    Filed: November 27, 2012
    Publication date: December 25, 2014
    Inventors: Sheng-Hung Yi, Pen-Yi Liao, Min-Hsiang Chen