Patents by Inventor Min-Hsing Wu

Min-Hsing Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170194721
    Abstract: A novel electrical connector and method of manufacture is disclosed which provides an integral attachment and retention means for the purpose of electrically and mechanically interconnecting circuit elements in electronic devices, said circuit elements including but not limited to printed circuit boards, flexible printed circuits, rigid flex circuits, semiconductor package substrates, modules, and batteries. The electrical connector of the present invention utilizes a bonding material, disposed at least between the electrical spring contact elements on a surface of the connector, to bond and retain first and second portions of the electrical connector in an actuated state on a mating circuit element whereby stable and low resistance electrical interconnections are formed and maintained between the electrical connector and interconnection terminals on the mating circuit element. This design permits the electrical connector to be low-profile and use a reduced amount of space on a circuit member such as a PCB.
    Type: Application
    Filed: January 7, 2017
    Publication date: July 6, 2017
    Inventors: Chih-Peng Fan, Ching-Ho Hsieh, Min-Hsing Wu, David L. Chen, Woody James Maynard