Patents by Inventor Min-Hsiung Liang
Min-Hsiung Liang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20250081347Abstract: An electrical connection device includes a mother board and a daughter board. The mother board includes a first board body with at least one cavity and a first electrical contact printed on the first board body. The daughter board includes a second board body and a second electrical contact printed on the second board body. At least one of the daughter board and the mother board includes at least one contour feature integrally formed with at least one of the first board body and the second board body. When the second board body is inserted into the at least one cavity of the first board body, the second electrical contact is electrically connected to the first electrical contact, and the daughter board is positioned in the mother board through the at least one contour feature.Type: ApplicationFiled: August 30, 2024Publication date: March 6, 2025Applicant: Industrial Technology Research InstituteInventors: Chung-Wei Wang, Chen-Tsai Yang, Shu-Wei Kuo, Min-Hsiung Liang, Bor-Chuan Chuang
-
Patent number: 12238864Abstract: An electronic apparatus including a compression molding board and a connection pad is provided. The compression molding board has a device bonding area and a bending area formed by compression molding. The device bonding area is different from the bending area. The connection pad is disposed on the device bonding area of the compression molding board.Type: GrantFiled: March 24, 2022Date of Patent: February 25, 2025Assignee: Industrial Technology Research InstituteInventors: Yu-Lin Hsu, Kuan-Chu Wu, Ting-Yu Ke, Min-Hsiung Liang, Yu-Ming Peng
-
Patent number: 12232256Abstract: A flexible hybrid electronic substrate and electronic textile including the same are provided. The flexible hybrid electronic substrate includes a first region and a second region. There is a joint between the first region and the second region. Each of the first region and the second region includes at least one selected from the group consisting of the following structure features: multilayer structure feature, anisotropic structure feature and pre-strained structure feature.Type: GrantFiled: January 27, 2022Date of Patent: February 18, 2025Assignee: Industrial Technology Research InstituteInventors: I-Hung Chiang, Hung-Hsien Ko, Min-Hsiung Liang, Te-Hsun Lin, Chen-Tsai Yang, Hao-Wei Yu
-
Publication number: 20240341653Abstract: A flexible electronic device includes a first encapsulation layer and a sensing structure. The sensing structure is disposed on the first encapsulation layer and includes a substrate, a plurality of first sensing layer, a plurality of second sensing layer, a first groove and a second groove. The substrate includes a main body, a plurality of first branches and a plurality of second branches. The main body has a first side and a second side opposite to each other. The first branches connect the first side. The second branches connect the second side. The first sensing layers are disposed on the first branches. The second sensing layers are disposed on the second branches. The first groove is disposed between the first branches. The second groove is disposed between the second branches.Type: ApplicationFiled: January 24, 2024Publication date: October 17, 2024Applicant: Industrial Technology Research InstituteInventors: Min-Hsiung Liang, Chien-Hsun Chu, Kuan-Chu Wu, Wan-Chen Yang, Jui-Chang Chuang, Chen-Tsai Yang, Heng-Yin Chen, Hung-Hsien Ko
-
Publication number: 20240004474Abstract: A film deformation element includes a first stack and a second stack. The first stack includes a first passivation layer, a first substrate, a first metal layer and a first dielectric layer. The first substrate is disposed on the first passivation layer. The first metal layer is disposed on the first substrate. The first dielectric layer is disposed on the first metal layer. The second stack is bonded to the first stack, to form a sealing space. The second stack includes a second passivation layer, a second substrate, a second metal layer and a second dielectric layer. The second dielectric layer is disposed on and faces the first dielectric layer. The second metal layer is disposed on the second dielectric layer. The second substrate is disposed on the second metal layer. The second passivation layer is disposed on the second substrate.Type: ApplicationFiled: June 29, 2023Publication date: January 4, 2024Applicant: Industrial Technology Research InstituteInventors: Chen-Tsai Yang, Heng-Yin Chen, Wan-Chen Yang, Jui-Chang Chuang, Hung-Hsien Ko, Min-Hsiung Liang, Chih-Cheng Cheng
-
Publication number: 20230199961Abstract: An electronic apparatus including a compression molding board and a connection pad is provided. The compression molding board has a device bonding area and a bending area formed by compression molding. The device bonding area is different from the bending area. The connection pad is disposed on the device bonding area of the compression molding board.Type: ApplicationFiled: March 24, 2022Publication date: June 22, 2023Applicant: Industrial Technology Research InstituteInventors: Yu-Lin Hsu, Kuan-Chu Wu, Ting-Yu Ke, Min-Hsiung Liang, Yu-Ming Peng
-
Publication number: 20230147556Abstract: A flexible hybrid electronic substrate and electronic textile including the same are provided. The flexible hybrid electronic substrate includes a first region and a second region. There is a joint between the first region and the second region. Each of the first region and the second region includes at least one selected from the group consisting of the following structure features: multilayer structure feature, anisotropic structure feature and pre-strained structure feature.Type: ApplicationFiled: January 27, 2022Publication date: May 11, 2023Applicant: Industrial Technology Research InstituteInventors: I-Hung Chiang, Hung-Hsien Ko, Min-Hsiung Liang, Te-Hsun Lin, Chen-Tsai Yang, Hao-Wei Yu
-
Patent number: 11565152Abstract: An exercise sensing method, an exercise sensing apparatus and an exercise sensing system are provided. The exercise sensing system includes a computing device, a storage device and at least one biophysical quantity sensor disposed on at least one muscle portion of a user. In the method, a current muscle strength of the muscle portion when the user performs an exercise is monitored by the biophysical quantity sensor. An exercise history of the user is accessed to obtain a muscle strength reference value of the muscle portion when the user previously performed the exercise. The current muscle strength is compared with the muscle strength reference value so as to adjust an exercise intensity of the exercise.Type: GrantFiled: April 8, 2020Date of Patent: January 31, 2023Assignee: Industrial Technology Research InstituteInventors: Min-Hsiung Liang, Yun-Yi Huang, Tzu-Yang Ting, Yu-Jhen Yang, Tzu-Hao Yu
-
Publication number: 20220338309Abstract: A transparent film heater is provided, including a transparent conductive film, at least two main electrodes and at least four multiple electrodes. The transparent conductive film is disposed on a transparent substrate. At least two main electrodes are arranged on two sides of the transparent conductive film along an edge of the transparent conductive film. The at least four multiple electrodes are composed of a first pair of multiple electrodes and a second pair of multiple electrodes, and are arranged on the transparent conductive film. A first spacing region and a second spacing region are respectively located between adjacent end points of the two main electrodes along the edge of the transparent conductive film. The first pair of multiple electrodes are arranged in the first spacing region, and the second pair of multiple electrodes are arranged in the second spacing region.Type: ApplicationFiled: March 30, 2022Publication date: October 20, 2022Applicant: Industrial Technology Research InstituteInventors: Li-Wei Yao, Min-Hsiung Liang, Hsiao-Fen Wei, Yu-Pei Chang, Te-Hsun Lin, Chih-Chia Chang, Yen-Shu Lee
-
Publication number: 20210197643Abstract: A temperature control method, including periodically sensing an air temperature of a space, and periodically sensing a surface temperature of each of a plurality of interior surfaces; in response to the air temperature and the surface temperatures being less than a target temperature, calculating an air heating duration of an air conditioner and a surface heating duration of each of a plurality of heater devices arranged in an array according to the target temperature, the air temperature and the surface temperatures; performing an air heating operation according to the air heating duration and performing surface heating operations according to the surface heating durations; and in response to the air temperature currently sensed and the surface temperatures currently sensed reaching the target temperature, instructing the air conditioner to stop performing the air heating operation.Type: ApplicationFiled: March 30, 2020Publication date: July 1, 2021Applicant: Industrial Technology Research InstituteInventors: Jui-Wen Yang, Yi-Cheng Lu, Min-Hsiung Liang, Tzu-Hao Yu, Tzu-Yang Ting
-
Publication number: 20210197023Abstract: An exercise sensing method, an exercise sensing apparatus and an exercise sensing system are provided. The exercise sensing system includes a computing device, a storage device and at least one biophysical quantity sensor disposed on at least one muscle portion of a user. In the method, a current muscle strength of the muscle portion when the user performs an exercise is monitored by the biophysical quantity sensor. An exercise history of the user is accessed to obtain a muscle strength reference value of the muscle portion when the user previously performed the exercise. The current muscle strength is compared with the muscle strength reference value so as to adjust an exercise intensity of the exercise.Type: ApplicationFiled: April 8, 2020Publication date: July 1, 2021Applicant: Industrial Technology Research InstituteInventors: Min-Hsiung Liang, Yun-Yi Huang, Tzu-Yang Ting, Yu-Jhen Yang, Tzu-Hao Yu
-
Patent number: 10709956Abstract: A multiplayer sports formation arrangement prompting method adapted to monitor, by a computing device, a formation of a plurality of athletes participating in a multiplayer sport to prompt each of the athletes to adjust a position is provided, in which at least two wind sensors and a positioning device are disposed on or around each of the athletes.Type: GrantFiled: March 14, 2019Date of Patent: July 14, 2020Assignee: Industrial Technology Research InstituteInventors: Min-Hsiung Liang, Yen-Ting Wu, Wei-Yuan Cheng, Ming-Huan Yang