Abstract: A method of warpage-aware floorplanning for heterogeneous integration structure is proposed, which is executed by a computer, the method comprising using the computer to perform the following: performing a performing a layout partitioning to divide a layout into a plurality of grids; performing an initial floorplanning by assigning first geometric relations between a plurality of dies such that an effective material of each grid of the plurality of grids is determined; performing a global floorplanning to change the first geometric relations between the plurality of dies to second geometric relations to optimize warpage effect of the heterogeneous integration structure; and performing a detailed floorplanning to determine die order of placement based on material differences between the plurality of dies and an interposer.