Abstract: A method of manufacturing an overlay mark is provided. Two first X-direction isolation structures, two first Y-direction isolation structures, two second X-direction isolation structures, and two second Y-direction isolation structures are formed in a substrate, where the first X-direction isolation structures and the first Y-direction isolation structures are arranged to a first rectangle, and the second X-direction isolation structures and the second Y-direction isolation structures are arranged to a second rectangle. The second rectangle is located in the first rectangle. A first dielectric layer and a conductive layer are formed sequentially on the substrate. A planarization process is performed to remove a portion of the conductive layer till the isolation structures are exposed. A second dielectric layer is formed on the substrate. A rectangle pattern is formed on the second dielectric layer. The sides of the rectangle pattern are located above the isolation structures.

Abstract: A method of manufacturing an overlay mark is provided. Two first X-direction isolation structures, two first Y-direction isolation structures, two second X-direction isolation structures, and two second Y-direction isolation structures are formed in a substrate, where the first X-direction isolation structures and the first Y-direction isolation structures are arranged to a first rectangle, and the second X-direction isolation structures and the second Y-direction isolation structures are arranged to a second rectangle. The second rectangle is located in the first rectangle. A first dielectric layer and a conductive layer are formed sequentially on the substrate. A planarization process is performed to remove a portion of the conductive layer till the isolation structures are exposed. A second dielectric layer is formed on the substrate. A rectangle pattern is formed on the second dielectric layer. The sides of the rectangle pattern are located above the isolation structures.

Abstract: The present invention relates to a method for configuring a Peripheral Component Interconnect Express (PCIE). A plurality of PCIE parameters are stored in a storage unit. When a computer system starts up, a North Bridge chip is driven to read the PCIE parameters in the storage unit for configuring the PCIE. According to the configuration method of the present invention, when the computer system starts up, the North Bridge chip and the storage unit are enabled first. Then, the North Bridge chip is driven to read the PCIE parameters. Finally, the North Bridge chip proceeds with initialization according to the PCIE parameters to configure PCIE.

Abstract: The present invention relates to a method for configuring a Peripheral Component Interconnect Express (PCIE). A plurality of PCIE parameters are stored in a storage unit. When a computer system starts up, a North Bridge chip is driven to read the PCIE parameters in the storage unit for configuring the PCIE. According to the configuration method of the present invention, when the computer system starts up, the North Bridge chip and the storage unit are enabled first. Then, the North Bridge chip is driven to read the PCIE parameters. Finally, the North Bridge chip proceeds with initialization according to the PCIE parameters to configure PCIE.

Abstract: A processing method, a chip set and a controller for supporting message signaled interrupt. A memory write transaction on a PCI bus is monitored. When the address of the system memory specified in the interrupt message of the write transaction is located at a range of a reserved interrupt address, the interrupting service sequence is performed. The reserved interrupt address is located in an address of a system memory. Thus, the data to be processed and the system-specified message are written in the buffer and arranged in sequence. The problem of “write buffer latency” is resolved, and is irrelevant to the level of the PCI bus. Many system specified messages can be stored in the system memory, so that multiple system message signaled interrupts issue from different peripheral components can be processed in the same interrupt service routine.

Abstract: A processing method, a chip set and a controller for supporting message signaled interrupt. A memory write transaction on a PCI bus is monitored. When the address of the system memory specified in the interrupt message of the write transaction is located at a range of a reserved interrupt address, the interrupting service sequence is performed. The reserved interrupt address is located in an address of a system memory. Thus, the data to be processed and the system-specified message are written in the buffer and arranged in sequence. The problem of “write buffer latency” is resolved, and is irrelevant to the level of the PCI bus. Many system specified messages can be stored in the system memory, so that multiple system message signaled interrupts issue from different peripheral components can be processed in the same interrupt service routine.