Abstract: A chemical mechanical polishing pad conditioner includes a bottom substrate, an intermediate substrate and a diamond film. The intermediate substrate is arranged on the bottom substrate; the intermediate substrate includes a hollow portion and an annular portion surrounding the hollow portion; the annular portion includes a plurality of first polishing areas arranged at intervals along an annular area and a plurality of second polishing areas arranged among the first polishing areas; and the first polishing areas extend along a radial direction on the intermediate substrate. The diamond film is arranged on the intermediate substrate, and the diamond film overlays the first polishing areas and the second polishing areas. The diamond film is provided with a plurality of first surfaces and a plurality of second surfaces, and first polishing tips protruding from the first surfaces and second polishing tips protruding from the second surface are formed on the diamond film.

Abstract: The present invention relates to a polishing pad conditioner and a manufacturing method thereof. The polishing pad conditioner includes a substrate, an abrasive layer and a protective layer. The abrasive layer covers the surface of the substrate. The abrasive layer includes a bonding layer and a plurality of abrasive particles embedded in the bonding layer. Each of the abrasive particles has a protrusion exposed out of the bonding layer, and the protrusion is insulated. The protective layer covers the surface of the bonding layer, and the protrusion is exposed out of the protective layer. The polishing pad conditioner of the present invention can protect the bonding layer from being damaged by abrasion and hold the abrasive particles, avoid the abrasive particles from falling off or out of position, and maintain the polishing effect and service life of the polishing pad conditioner.