Abstract: A substrate inspection apparatus includes a light source unit, a pulsed beam matching unit, a substrate support unit, an incidence angle adjusting unit, and a detecting unit. The light source unit emits a first laser beam having a first wavelength and a second laser beam having a second wavelength. The pulsed beam matching unit matches the first laser beam and the second laser beam to superimpose a pulse of the first laser beam on a pulse of the second laser beam in time and space. The substrate support unit supports a substrate to be inspected. The incidence angle adjusting unit adjusts angles of incidence of the matched first laser beam and second laser beams to irradiate the first laser beam and the second laser beam on the substrate, and mixes the first laser beam and the second laser beam to generate an evanescent wave on the substrate. The evanescent wave generates scattered light due to a defect of the substrate.

Abstract: An apparatus monitoring semiconductor manufacturing equipment includes; an optical detector, a light generator generating light along a first optical path towards a semiconductor substrate, wherein upon irradiating the semiconductor substrate, the light becomes reflected light along a second optical path away from the semiconductor substrate and towards the optical detector, a first grating reticle between the light generator and the semiconductor substrate and including first slits having a first pitch and second slits having a second pitch different from the first pitch, a second grating reticle between the semiconductor substrate and the optical detector and including third slits having a third pitch different from the first pitch and the second pitch, wherein the optical detector determines a positional attribute of the semiconductor substrate in relation to a first pattern and a second pattern, the first pattern corresponds to a first portion of light/reflected light sequentially passing through the firs

Abstract: Provided are a level sensor configured to detect a height level of a substrate, and a substrate processing apparatus including the level sensor. The level sensor includes a measurement light source configured to radiate measurement light toward the substrate, a prism configured to split reflected light of the measurement light into first polarized light and second polarized light and generate a first optical path length difference between the first polarized light and the second polarized light, an optical path length modulator configured to keep constant an optical path length of the first polarized light and periodically change an optical path length of the second polarized light, and a detector configured to detect the first optical path length difference based on an interference signal between the first polarized light and the second polarized light.

Abstract: Provided is a polarization measuring device including a stage on which a measurement target is provided, a light source assembly configured to emit incident light, a first polarimeter configured to polarize the incident light, a second polarimeter configured to polarize reflected light reflected from the measurement target that is irradiated by the incident light, a filter assembly configured to remove noise from the reflected light, and a detector configured to receive the reflected light and measure an intensity of the reflected light and a phase of the reflected light.

Abstract: The optical device includes an illuminator configured to emit illumination light in a first horizontal direction, a polarizing prism configured to polarize the illumination light incident thereto through a first surface thereof in the first horizontal direction, a first reflector and a second reflector, each configured to reflect the illumination light from the polarizing prism, and a first lens and a second lens configured to condense the illumination light reflected from the first and second reflectors, respectively.

Abstract: The present invention provides nano-patterning based on flow of an ion current within an ionic conductor to bring ions in proximity to a microscope probe tip touching a surface of the conductor. These ions are then electrochemically reduced to form one or more features on the surface. Ion current flow and the electrochemical reaction are driven by an electrical potential difference between the tip and the ionic conductor. Such features can be erased by reversing the polarity of the potential difference. Indentations can be formed by mechanically removing features formed as described above. The ions in the ion current can be provided by the ionic conductor and/or by oxidation at a counter electrode.

Abstract: The present invention provides nano-patterning based on flow of an ion current within an ionic conductor to bring ions in proximity to a microscope probe tip touching a surface of the conductor. These ions are then electrochemically reduced to form one or more features on the surface. Ion current flow and the electrochemical reaction are driven by an electrical potential difference between the tip and the ionic conductor. Such features can be erased by reversing the polarity of the potential difference. Indentations can be formed by mechanically removing features formed as described above. The ions in the ion current can be provided by the ionic conductor and/or by oxidation at a counter electrode.