Patents by Inventor Min-Il Kim

Min-Il Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor chip package having an adhesive tape attached on bonding wires
    Patent number: 7410832
    Abstract: The invention provides a semiconductor chip package, and a means of forming such a semiconductor chip package, in which one or more semiconductor chips are electrically connected to a mounting substrate by wire bonding in which an adhesive tape is provided on the active surface of the semiconductor chips for encapsulating at least an upper portion of the bonding wires adjacent the active surfaces to improve the stability of the bonding wires during subsequent processing.
    Type: Grant
    Filed: March 26, 2007
    Date of Patent: August 12, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-Yeop Lee, Min-Il Kim
  • Semiconductor chip package having an adhesive tape attached on bonding wires
    Publication number: 20070190693
    Abstract: The invention provides a semiconductor chip package, and a means of forming such a semiconductor chip package, in which one or more semiconductor chips are electrically connected to a mounting substrate by wire bonding in which an adhesive tape is provided on the active surface of the semiconductor chips for encapsulating at least an upper portion of the bonding wires adjacent the active surfaces to improve the stability of the bonding wires during subsequent processing.
    Type: Application
    Filed: March 26, 2007
    Publication date: August 16, 2007
    Inventors: Sang-Yeop Lee, Min-Il Kim
  • Semiconductor chip package having an adhesive tape attached on bonding wires
    Patent number: 7227086
    Abstract: The invention provides a semiconductor chip package, and a means of forming such a semiconductor chip package, in which one or more semiconductor chips are electrically connected to a mounting substrate by wire bonding in which an adhesive tape is provided on the active surface of the semiconductor chips for encapsulating at least an upper portion of the bonding wires adjacent the active surfaces to improve the stability of the bonding wires during subsequent processing.
    Type: Grant
    Filed: January 4, 2006
    Date of Patent: June 5, 2007
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Sang-Yeop Lee, Min-Il Kim
  • Apparatus for bonding a chip using an insulating adhesive tape
    Patent number: 7096914
    Abstract: In an embodiment of the invention an apparatus is configured to stack a plurality of semiconductor chips having the same or similar size. The apparatus includes a tape providing unit for providing an insulating adhesive tape, a tape attaching device for attaching the insulating adhesive tape to an area between electrode pads of a first chip, and a chip attaching device for attaching a second chip to the insulating adhesive tape.
    Type: Grant
    Filed: July 29, 2003
    Date of Patent: August 29, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong-Kuk Kim, Min-Il Kim, Sang-Yeop Lee, Chang-Cheol Lee
  • Semiconductor chip package having an adhesive tape attached on bonding wires
    Publication number: 20060108138
    Abstract: The invention provides a semiconductor chip package, and a means of forming such a semiconductor chip package, in which one or more semiconductor chips are electrically connected to a mounting substrate by wire bonding in which an adhesive tape is provided on the active surface of the semiconductor chips for encapsulating at least an upper portion of the bonding wires adjacent the active surfaces to improve the stability of the bonding wires during subsequent processing.
    Type: Application
    Filed: January 4, 2006
    Publication date: May 25, 2006
    Inventors: Sang-Yeop Lee, Min-Il Kim
  • Semiconductor chip package having an adhesive tape attached on bonding wires
    Patent number: 7005577
    Abstract: The invention provides a semiconductor chip package, and a means of forming such a semiconductor chip package, in which one or more semiconductor chips are electrically connected to a mounting substrate by wire bonding in which an adhesive tape is provided on the active surface of the semiconductor chips for encapsulating at least an upper portion of the bonding wires adjacent the active surfaces to improve the stability of the bonding wires during subsequent processing.
    Type: Grant
    Filed: June 11, 2003
    Date of Patent: February 28, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-Yeop Lee, Min-Il Kim
  • Semiconductor chip package having an adhesive tape attached on bonding wires
    Publication number: 20040050571
    Abstract: The invention provides a semiconductor chip package, and a means of forming such a semiconductor chip package, in which one or more semiconductor chips are electrically connected to a mounting substrate by wire bonding in which an adhesive tape is provided on the active surface of the semiconductor chips for encapsulating at least an upper portion of the bonding wires adjacent the active surfaces to improve the stability of the bonding wires during subsequent processing.
    Type: Application
    Filed: June 11, 2003
    Publication date: March 18, 2004
    Inventors: Sang-Yeop Lee, Min-Il Kim