Patents by Inventor Min Jae Lee

Min Jae Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11271777
    Abstract: A node includes: a communication circuit; a processor operatively connected to the communication circuit; and a memory operatively connected to the processor and storing a target application and an access control application, wherein the memory stores instructions that when executed by the processor, cause the node to: detect a network access event of the target application to a destination network through the access control application, identify whether a tunnel corresponding to identification information of the target application and the destination network and authorized by an external server exists, transmit a data packet of the target application through the authorized tunnel using the communication circuit, when the authorized tunnel exists, and drop the data packet of the target application, when the authorized tunnel does not exist.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: March 8, 2022
    Assignee: PRIBIT Technology, Inc.
    Inventors: Young Rang Kim, Min Jae Lee, Pil Ho Song, Joo Tae Kim
  • Publication number: 20210376215
    Abstract: A thermoelectric module is provided. The thermoelectric module includes: a first thermoelectric material unit including a first unit thermoelectric material disposed in a first direction; and a second thermoelectric material unit electrically connected to the first thermoelectric material unit and including a second unit thermoelectric material disposed in a second direction that intersects the first direction.
    Type: Application
    Filed: September 4, 2020
    Publication date: December 2, 2021
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Min Jae LEE, Dong Ju KO, Seo Ha KANG, Jae Hyun SONG, Hyun Sub LEE, Byung Wook KIM
  • Patent number: 11165008
    Abstract: A thermoelectric module includes a first thermoelectric material, a second thermoelectric material spaced apart from the first thermoelectric material, and a stretching element selectively connected between the first thermoelectric material and the second thermoelectric material, wherein the stretching element is stretchable.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: November 2, 2021
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Min Jae Lee, Jin Woo Kwak, Woo Ju Lee, Byung Wook Kim, Hoo Dam Lee, Na Kyong Yun
  • Publication number: 20210328830
    Abstract: A node includes: a communication circuit; a processor operatively connected to the communication circuit; and a memory operatively connected to the processor and storing a target application and an access control application, wherein the memory stores instructions that when executed by the processor, cause the node to: detect a network access event of the target application to a destination network through the access control application, identify whether a tunnel corresponding to identification information of the target application and the destination network and authorized by an external server exists, transmit a data packet of the target application through the authorized tunnel using the communication circuit, when the authorized tunnel exists, and drop the data packet of the target application, when the authorized tunnel does not exist.
    Type: Application
    Filed: June 28, 2021
    Publication date: October 21, 2021
    Inventors: Young Rang Kim, Min Jae Lee, Pil Ho Song, Joo Tae Kim
  • Publication number: 20210320039
    Abstract: A semiconductor device includes a semiconductor die, a defect detection structure and an input-output circuit. The semiconductor die includes a central region and a peripheral region surrounding the central region. The peripheral region includes a left-bottom corner region, a left-upper corner region, a right-upper corner region and a right-bottom corner region. The defect detection structure is formed in the peripheral region. The defect detection structure includes a first conduction loop in the left-bottom corner region, a second conduction loop in the right-bottom corner region, a third conduction loop in the left-bottom corner region and the left-upper corner region and a fourth conduction loop in the right-bottom corner region and the right-upper corner region. The input-output circuit is electrically connected to end nodes of the first conduction loop, the second conduction loop, the third conduction loop and the fourth conduction loop.
    Type: Application
    Filed: June 23, 2021
    Publication date: October 14, 2021
    Inventors: Min-Jae LEE, Sang-Lok KIM, Byung-Hoon JEONG, Tae-Sung LEE, Jeong-Don IHM, Jae-Yong JEONG, Young-Don CHOI
  • Patent number: 11133449
    Abstract: A thermoelectric material includes a lower part from a bottom surface of the thermoelectric material to a point of 30% of an average thickness of the thermoelectric material and having an average content of carbon atoms of 40 at% or more in the thermoelectric material, and an upper part corresponding to a remaining 70% of the average thickness of the thermoelectric material and having an average content of carbon atoms of 20 at% or less in the thermoelectric material.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: September 28, 2021
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Hoo Dam Lee, Byung Wook Kim, Jin Woo Kwak, Min Jae Lee, Woo Ju Lee, Yoon Jin Kim, Young Sun Kim
  • Patent number: 11082256
    Abstract: A node includes: a communication circuit; a processor operatively connected to the communication circuit; and a memory operatively connected to the processor and storing a target application and an access control application, wherein the memory stores instructions that when executed by the processor, cause the node to: detect a network access event of the target application to a destination network through the access control application, identify whether a tunnel corresponding to identification information of the target application and the destination network and authorized by an external server exists, transmit a data packet of the target application through the authorized tunnel using the communication circuit, when the authorized tunnel exists, and drop the data packet of the target application, when the authorized tunnel does not exist.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: August 3, 2021
    Assignee: PRIBIT Technology, Inc.
    Inventors: Young Rang Kim, Min Jae Lee, Pil Ho Song, Joo Tae Kim
  • Patent number: 11062966
    Abstract: A semiconductor device includes a semiconductor die, a defect detection structure and an input-output circuit. The semiconductor die includes a central region and a peripheral region surrounding the central region. The peripheral region includes a left-bottom corner region, a left-upper corner region, a right-upper corner region and a right-bottom corner region. The defect detection structure is formed in the peripheral region. The defect detection structure includes a first conduction loop in the left-bottom corner region, a second conduction loop in the right-bottom corner region, a third conduction loop in the left-bottom corner region and the left-upper corner region and a fourth conduction loop in the right-bottom corner region and the right-upper corner region. The input-output circuit is electrically connected to end nodes of the first conduction loop, the second conduction loop, the third conduction loop and the fourth conduction loop.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: July 13, 2021
    Inventors: Min-Jae Lee, Sang-Lok Kim, Byung-Hoon Jeong, Tae-Sung Lee, Jeong-Don Ihm, Jae-Yong Jeong, Young-Don Choi
  • Publication number: 20210175403
    Abstract: A thermoelectric module is disclosed. The thermoelectric module includes a first thermoelectric material unit, a second thermoelectric material unit connected in series to the first thermoelectric material unit, and a bypass circuit connected in parallel to the first thermoelectric material unit and the second thermoelectric material unit and configured to selectively divert current that is applied to the first thermoelectric material unit to the second thermoelectric material unit, thereby obtaining advantageous effects of improved stability and reliability.
    Type: Application
    Filed: February 26, 2020
    Publication date: June 10, 2021
    Inventors: Woo Ju Lee, Min Jae Lee, Hoo Dam Lee, Byung Wook Kim
  • Publication number: 20210175405
    Abstract: A thermoelectric material includes a lower part from a bottom surface of the thermoelectric material to a point of 30% of an average thickness of the thermoelectric material and having an average content of carbon atoms of 40 at % or more in the thermoelectric material, and an upper part corresponding to a remaining 70% of the average thickness of the thermoelectric material and having an average content of carbon atoms of 20 at % or less in the thermoelectric material.
    Type: Application
    Filed: September 28, 2020
    Publication date: June 10, 2021
    Inventors: Hoo Dam Lee, Byung Wook Kim, Jin Woo Kwak, Min Jae Lee, Woo Ju Lee, Yoon Jin Kim, Young Sun Kim
  • Publication number: 20210175404
    Abstract: A thermoelectric module includes a first thermoelectric material, a second thermoelectric material spaced apart from the first thermoelectric material, and a stretching element selectively connected between the first thermoelectric material and the second thermoelectric material, wherein the stretching element is stretchable.
    Type: Application
    Filed: April 24, 2020
    Publication date: June 10, 2021
    Inventors: Min Jae Lee, Jin Woo Kwak, Woo Ju Lee, Byung Wook Kim, Hoo Dam Lee, Na Kyong Yun
  • Publication number: 20210167461
    Abstract: A separator sealing apparatus for bonding an upper separator and a lower separator with an electrode plate being interposed therebetween and a separator sealing method is provided. The separator sealing apparatus includes a first sealing unit configured to seal a first region specified as an outer edge along a width direction of the electrode plate, among portions where the upper separator and the lower separator face each other; and a second sealing unit configured to seal a second region specified as an outer edge along a length direction of the electrode plate, among the portions where the upper separator and the lower separator face each other.
    Type: Application
    Filed: April 14, 2020
    Publication date: June 3, 2021
    Applicant: LG CHEM, LTD.
    Inventors: Min-Jae LEE, Jong-Hun KIM, Sung-Min HWANG
  • Patent number: 11015819
    Abstract: An oven with an enhanced structure to improve cooking performance is provided. The oven includes a main body, a cooking chamber arranged inside the main body, the cooking chamber including an open front, a door arranged to open or close the front of the cooking chamber, a circulation fan arranged to circulate air in the cooking chamber, a suction port formed on a wall of the cooking chamber facing the circulation fan, a turn table arranged on a bottom plate of the cooking chamber, the turn table being rotatable around a rotating shaft, and a discharging port formed on the bottom plate of the cooking chamber, the discharging port for discharging air that has passed through the suction port into the cooking chamber, the discharging port being located under the turn table.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: May 25, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jung Hak Lee, Sang-Jin Lee, Yeon Hee Kook, Myoung Keun Kwon, Mee Ran Cho, Min Jae Lee, Jin Ho Jeong
  • Patent number: 11004801
    Abstract: In one example, a semiconductor device comprises a substrate, a first electronic component on a top side of the substrate, a second electronic component on the top side of the substrate, an encapsulant on the top side of the substrate, contacting a lateral side of the first electronic component and a lateral side of the second electronic component, a conformal shield on a top side of the encapsulant over the first electronic component and having a side shield contacting a lateral side of the encapsulant, and a compartment wall between the first electronic component and the second electronic component and contacting the conformal shield to define a compartment containing the first electronic component and excluding the second electronic component. Other examples and related methods are also disclosed herein.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: May 11, 2021
    Assignee: Amkor Technology Singapore Holding PTE. Ltd.
    Inventors: Ji Hoon Oh, Dong Hyun Bang, Soo Jin Shin, Young Ik Kwon, Tae Kyeong Hwang, Min Jae Lee
  • Publication number: 20210119237
    Abstract: The present disclosure relates to a polymer electrolyte membrane for medium and high temperature, a preparation method thereof and a high-temperature polymer electrolyte membrane fuel cell including the same, more particularly to a technology of preparing a composite membrane including an inorganic phosphate nanofiber incorporated into a phosphoric acid-doped polybenzimidazole (PBI) polymer membrane by adding an inorganic precursor capable of forming a nanofiber in a phosphoric acid solution when preparing phosphoric acid-doped polybenzimidazole and using the same as a high-temperature polymer electrolyte membrane which is thermally stable even at high temperatures of 200-300° C. without degradation of phosphoric acid and has high ion conductivity.
    Type: Application
    Filed: April 27, 2020
    Publication date: April 22, 2021
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: So Young LEE, Seung Ju LEE, Min Jae LEE, Hyun Seo PARK, Jong Hyun JANG, Hyoung-Juhn KIM, Suk Woo NAM, Young Suk JO, Yeong Cheon KIM
  • Patent number: 10984749
    Abstract: A display apparatus includes a first circuit configured to process a signal between a first top voltage and a first bottom voltage, a second circuit configured to process a signal between a second top voltage and a second bottom voltage, and a second circuit power source configured to receive a current provided by the first circuit and provide the second top voltage to the second circuit.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: April 20, 2021
    Assignee: ACONIC INC.
    Inventors: Hwi-Cheol Kim, Min Jae Lee
  • Publication number: 20210091976
    Abstract: A node includes: a communication circuit; a processor operatively connected to the communication circuit; and a memory operatively connected to the processor and storing a target application and an access control application, wherein the memory stores instructions that when executed by the processor, cause the node to: detect a network access event of the target application to a destination network through the access control application, identify whether a tunnel corresponding to identification information of the target application and the destination network and authorized by an external server exists, transmit a data packet of the target application through the authorized tunnel using the communication circuit, when the authorized tunnel exists, and drop the data packet of the target application, when the authorized tunnel does not exist.
    Type: Application
    Filed: September 24, 2020
    Publication date: March 25, 2021
    Inventors: Young Rang Kim, Min Jae Lee, Pil Ho Song, Joo Tae Kim
  • Publication number: 20210070718
    Abstract: The present invention relates to a novel phenylsulfonyl oxazole derivative and a use thereof and specifically, to a compound represented by Chemical Formula 1 in the present specification or a pharmaceutically acceptable salt thereof, and to a use thereof for prevention, treatment, or improvement of neurodegenerative disease.
    Type: Application
    Filed: January 10, 2019
    Publication date: March 11, 2021
    Inventors: Jae Sung BAE, Hee Kyung JIN, Myung Shik LEE, Hye Jin LIM, Jin Hee AHN, Haushabhau Shivaji PAGIRE, Min Jae Lee
  • Publication number: 20210066206
    Abstract: In one example, a semiconductor device comprises a substrate comprising a conductive structure, a first electronic component over the substrate, an encapsulant over the substrate and contacting a lateral side of the first electronic component, a shield over the encapsulant and contacting a lateral side of the encapsulant and a portion of a lateral side of the substrate, and a communication structure coupled with the substrate. The substrate comprises a vertical groove side and a horizontal groove side defining a groove in the substrate, wherein a portion of the groove is uncovered by the shield. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: August 25, 2020
    Publication date: March 4, 2021
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Ji Hoon Oh, Dong Hyun Bang, Soo Jin Shin, Young Ik Kwon, Tae Kyeong Hwang, Min Jae Lee, Min Jae Kong
  • Publication number: 20210066204
    Abstract: In one example, a semiconductor device comprises a substrate, a first electronic component on a top side of the substrate, a second electronic component on the top side of the substrate, an encapsulant on the top side of the substrate, contacting a lateral side of the first electronic component and a lateral side of the second electronic component, a conformal shield on a top side of the encapsulant over the first electronic component and having a side shield contacting a lateral side of the encapsulant, and a compartment wall between the first electronic component and the second electronic component and contacting the conformal shield to define a compartment containing the first electronic component and excluding the second electronic component. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: August 28, 2019
    Publication date: March 4, 2021
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Ji Hoon Oh, Dong Hyun Bang, Soo Jin Shin, Young Ik Kwon, Tae Kyeong Hwang, Min Jae Lee