Abstract: In one example, a semiconductor device comprises a substrate comprising a conductive structure, a first electronic component over the substrate, an encapsulant over the substrate and contacting a lateral side of the first electronic component, a shield over the encapsulant and contacting a lateral side of the encapsulant and a portion of a lateral side of the substrate, and a communication structure coupled with the substrate. The substrate comprises a vertical groove side and a horizontal groove side defining a groove in the substrate, wherein a portion of the groove is uncovered by the shield. Other examples and related methods are also disclosed herein.

Abstract: A non-volatile memory chip comprises a cell region that includes a first surface, a second surface opposite to the first surface, a first cell structure, and a second cell structure spaced apart from the first cell structure; a peripheral circuit region on the first surface of the cell region, and that includes a first peripheral circuit connected to the first cell structure, a second peripheral circuit connected to the second cell structure, and a connection circuit between the first and second peripheral circuits; a through via between the first and second cell structures and that extends from the second surface of the cell region to the connection circuit of the peripheral circuit region; a redistribution layer that covers the through via on the second surface of the cell region, is connected to the through via, and extends along the second surface; and a chip pad connected to the redistribution layer.

Abstract: A method of preparing a conductive composite includes immersing a porous base material in a conductive coating solution, and drying the conductive coating solution on the porous base material to form a conductive coating layer on the porous base material. The conductive coating solution includes conductive particles and a solvent, and the surface tension of the solvent is lower than the surface tension of the porous base material by 8 mN/m or more, and a conductive composite is prepared therefrom.

Abstract: An embodiment laminate for radiative cooling includes a first light reflecting layer, a second light reflecting layer on the first light reflecting layer, and an infrared radiating layer on the second light reflecting layer, wherein the first light reflecting layer has a reflectance equal to or higher than 80% for near-infrared light with a wavelength in a range from 780 to 1,300 nm and a transmittance equal to or higher than 70% for visible light with a wavelength in a range from 400 to 780 nm, and wherein a first metal protective layer, a metal layer, and a second metal protective layer are sequentially stacked in the second light reflecting layer.

Abstract: In an embodiment a laminate includes a porous base layer having a spherical pore derived from an inorganic particle for forming a pore and a coating layer located on one surface of the porous base layer and having a repeated pattern.

Abstract: An embodiment laminate for color radiative cooling includes a transparent colored layer including a first thermoplastic resin, an ultraviolet ray and visible ray reflective layer on the transparent colored layer and including a polyolefin-based polymer, a first far-infrared ray emissive layer on the ultraviolet ray and visible ray reflective layer and including a second thermoplastic resin, a near-infrared ray reflective layer on the first far-infrared ray emissive layer and including a metal, and a second far-infrared ray emissive layer on the near-infrared ray reflective layer and including a third thermoplastic resin.

Abstract: An embodiment laminate for color radiative cooling includes a colored layer including a thermoplastic resin, a far-infrared ray emissive layer on the colored layer, wherein a first layer including an aromatic polyester and a second layer including a non-aromatic poly (ether-ester) copolymer are alternately stacked in the far-infrared ray emissive layer, and a near-infrared ray reflective layer on the far-infrared ray emissive layer and including a metal.

Abstract: In an embodiment a method for preparing a laminate includes forming a cured film by coating a source material composition including a polymer for a base layer and an inorganic particle for forming a pore, obtaining a porous base layer having a spherical pore derived from the inorganic particle by removing the inorganic particle from the cured film through an etching process and forming a coating layer, which has a repeated pattern, on a surface of the porous base layer.

Abstract: An embodiment ramp apparatus for a vehicle includes a housing mounted on a vehicle body, a ramp assembly movable between a stowed position in which the ramp assembly is stowed in a cavity of the housing and a deployed position in which the ramp assembly is deployed or extended from the cavity of the housing, the ramp assembly including one or more ramp platforms telescopically connected to each other, and a front cover bridging between a leading end portion of the housing and a trailing end portion of the ramp assembly in a state in which the ramp assembly is in the deployed position.

Abstract: A transparent laminate for radiative cooling comprises a first near-infrared reflective layer including a first layer containing a first polymer and a second layer containing a second polymer stacked alternately, where the first near-infrared reflective layer reflects a near-infrared ray with a wavelength in a range from 740 to 1,400 nm, a second near-infrared reflective layer formed on the first near-infrared reflective layer and reflecting a near-infrared ray with a wavelength in a range from 1,500 to 2,000 nm, and an infrared emissive layer formed on the second near-infrared reflective layer and containing polycarbonate, and a radiative cooling material including the same.

Abstract: In an embodiment a ramp apparatus for a vehicle includes a housing mounted on a vehicle body, a first ramp platform telescopically moving with respect to the housing, a second ramp platform telescopically moving with respect to the first ramp platform and an upper sub-platform pivotally mounted between the first ramp platform and the second ramp platform.

Abstract: An embodiment ramp apparatus for a vehicle includes a housing mounted on a vehicle body, a first ramp platform telescopically movable with respect to the housing, a second ramp platform telescopically movable with respect to the first ramp platform, a third ramp platform configured movable with respect to the second ramp platform, a hinge mechanism configured to move the first ramp platform between a stowed position and a deployed position and to allow the first ramp platform to pivot with respect to the housing in a state in which the first ramp platform is in the deployed position, and a drive mechanism configured to move the second ramp platform and the third ramp platform.

Abstract: An embodiment ramp apparatus for a vehicle includes a housing mounted on a vehicle body, a ramp assembly movable between a stowed position in which the ramp assembly is stowed in a cavity of the housing and a deployed position in which the ramp assembly is deployed or extended from the cavity of the housing, the ramp assembly including one or more ramp platforms telescopically connected to each other, a hinge mechanism including a moving body movably mounted in the housing and a hinge shaft pivotally connecting the ramp assembly to the moving body, and a guide mechanism configured to guide pivoting of the ramp assembly.

Abstract: A vacuum freeze-dryer for freeze-drying a sample in a pressure state of below the triple point of water according to an embodiment of the disclosure includes a freeze-drying chamber that is sealed and in which the sample is arranged, a first pump comprising an inlet connected to the freeze-drying chamber and configured to suck water vapor vaporized from the sample, an outlet configured to discharge the water vapor sucked, a storage tank having an inlet and an outlet formed therein and accommodating oil for maintaining seal during when the water vapor sucked from the inlet is moved to the outlet, an apparatus for separating moisture from oil connected to the first pump and separating moisture from the oil in the first pump, and a second pump connected to the apparatus for separating moisture from oil and generating a negative pressure in the apparatus for separating moisture from oil.

Abstract: The present invention relates to a resistance-based on-chip temperature sensor which may autonomously operate in a chip. A resistance-based on-chip temperature sensor according to an exemplary embodiment of the present invention includes: a first RC oscillator having an in-chip first resistor as a component; a second RC oscillator having an in-chip second resistor as the component; and a control unit determining the temperature of the chip according to what difference between the numbers of clocks output from the first and second RC oscillators, respectively is for the same time.

Abstract: An embodiment is a ramp apparatus for a vehicle, the ramp apparatus including a first ramp platform, a second ramp platform configured to telescopically move with respect to the first ramp platform, a third ramp platform configured to telescopically move with respect to the second ramp platform, and a drive mechanism configured to move the second ramp platform and the third ramp platform, wherein the drive mechanism includes a drive sprocket, a driven sprocket spaced apart from the drive sprocket, a chain connecting the drive sprocket and the driven sprocket, a motor configured to drive the drive sprocket, a drive pinion coupled to the drive sprocket, a drive rack gear meshing with the drive pinion, a driven pinion coupled to the driven sprocket, and a driven rack gear meshing with the driven pinion.

Abstract: An embodiment is a ramp apparatus for a vehicle, the ramp apparatus including a housing mounted on a vehicle body, a ramp assembly configured to move between a stowed position in which the ramp assembly is stowed in the housing and an extended position in which the ramp assembly is extended out from the housing, wherein the ramp assembly is configured to be moved telescopically to be extended and retracted. The ramp apparatus may further include a hinge mechanism configured to allow the ramp assembly to pivot when the ramp assembly is deployed from the housing, wherein the hinge mechanism includes a moving body connected to the ramp assembly through a hinge shaft, and a hinge drive unit mounted on the moving body.

Abstract: Disclosed are a cooling device and a vehicle including the same. The cooling device according to one aspect of the present disclosure includes a housing part having a first hole formed at one side thereof and a second hole formed at the other side thereof, a heat exchange part accommodated in an internal space of the housing part and having one side communicating with the first hole and the other side communicating with the second hole, a thermoelectric element part provided above the heat exchange part, and a radiational cooling part provided above the thermoelectric element part and at least partially exposed to the outside.

Abstract: According to an embodiment, provided is a direct current/direct current converter comprising: a first switch unit located between a direct current link capacitor and a bridge circuit unit; a second switch unit connected in parallel with the first switch unit; a sensing unit for sensing a voltage across both ends of an inverter and a voltage across both ends of a second switch; and a control unit which controls an on-off operation of the first switch unit and the second switch unit, and determines whether a short circuit or a disconnection occurs by using the voltage across both ends of the inverter and the voltage across both ends of the second switch unit, wherein the control unit determines whether a short circuit or a disconnection occurs by using a voltage across both ends of the inverter and a voltage across both ends of the second switch unit, which are measured when the first switch unit is in an on state and the second switch unit is in an off state, and determines whether a disconnection occurs by us

Abstract: A separator sealing apparatus for bonding an upper separator and a lower separator with an electrode plate being interposed therebetween and a separator sealing method is provided. The separator sealing apparatus includes a first sealing unit configured to seal a first region specified as an outer edge along a width direction of the electrode plate, among portions where the upper separator and the lower separator face each other; and a second sealing unit configured to seal a second region specified as an outer edge along a length direction of the electrode plate, among the portions where the upper separator and the lower separator face each other.