Patents by Inventor Min Jae SEONG
Min Jae SEONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240021486Abstract: A printed circuit board includes a first insulating layer, a wiring pattern disposed in an upper side of the first insulating layer, a second insulating layer disposed on an upper surface of the first insulating layer and having a cavity exposing the wiring pattern, and an insulating pattern disposed between the first and second insulating layers, and having a side surface partially exposed by the cavity, while having an upper surface entirely covered by the second insulating layer.Type: ApplicationFiled: May 9, 2023Publication date: January 18, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Myeong Hui Jung, Sang Hoon Kim, Kee Su Jeon, Ki Eun Cho, Min Jae Seong
-
Publication number: 20230199974Abstract: A printed circuit board including: a first insulating layer; a first wiring layer disposed on an upper surface of the first insulating layer, and including a first wiring portion and a second wiring portion; and a second insulating layer disposed on the upper surface of the first insulating layer, having a cavity exposing an upper surface of the second wiring portion, and including a first insulating portion covering the first wiring portion and a second insulating portion whose upper surface is exposed from the cavity, wherein one or more gaps are provided between the second wiring portion and the second insulating portion.Type: ApplicationFiled: March 18, 2022Publication date: June 22, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chan Hoon KO, Kee Su JEON, Ki Eun CHO, Min Jae SEONG
-
Patent number: 11382213Abstract: A printed circuit board includes: a first insulating layer; a first wiring layer at least partially buried in the first insulating layer; a second insulating layer disposed on an upper surface of the first insulating layer; a second wiring layer at least partially buried in the second insulating layer; and a cavity penetrating through the second insulating layer and a portion of the first insulating layer and exposing a portion of the upper surface of the first insulating layer as a bottom surface of the cavity. The first wiring layer includes a wiring pattern at least partially exposed from the first insulating layer by the cavity, an upper surface of the wiring pattern has a step structure with the upper surface of the first insulating layer exposed by the cavity, and a lower surface of the wiring pattern is coplanar with a lower surface of the first insulating layer.Type: GrantFiled: February 8, 2021Date of Patent: July 5, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Kee Su Jeon, Sang Hoon Kim, Yong Duk Lee, Min Jae Seong
-
Publication number: 20220141953Abstract: A printed circuit board includes: a first insulating layer; a first wiring layer at least partially buried in the first insulating layer; a second insulating layer disposed on an upper surface of the first insulating layer; a second wiring layer at least partially buried in the second insulating layer; and a cavity penetrating through the second insulating layer and a portion of the first insulating layer and exposing a portion of the upper surface of the first insulating layer as a bottom surface of the cavity. The first wiring layer includes a wiring pattern at least partially exposed from the first insulating layer by the cavity, an upper surface of the wiring pattern has a step structure with the upper surface of the first insulating layer exposed by the cavity, and a lower surface of the wiring pattern is coplanar with a lower surface of the first insulating layer.Type: ApplicationFiled: February 8, 2021Publication date: May 5, 2022Inventors: Kee Su Jeon, Sang Hoon Kim, Yong Duk Lee, Min Jae Seong
-
Patent number: 10950587Abstract: A printed circuit board includes an insulating material with a bump pad buried in one surface, an adhesive layer stacked on the one surface of the insulating material, an insulating layer stacked on the adhesive layer, and a cavity passing through both of the adhesive layer and the insulating layer to expose the bump pad, wherein the cavity has a cross-sectional area decreasing in a direction toward the insulating material.Type: GrantFiled: October 24, 2019Date of Patent: March 16, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Kee-Su Jeon, Min-Jae Seong
-
Publication number: 20200144234Abstract: A printed circuit board includes an insulating material with a bump pad buried in one surface, an adhesive layer stacked on the one surface of the insulating material, an insulating layer stacked on the adhesive layer, and a cavity passing through both of the adhesive layer and the insulating layer to expose the bump pad, wherein the cavity has a cross-sectional area decreasing in a direction toward the insulating material.Type: ApplicationFiled: October 24, 2019Publication date: May 7, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Kee-Su JEON, Min-Jae SEONG
-
Patent number: 10064291Abstract: A circuit board and a method of manufacturing the same are disclosed. The circuit board includes an insulating part, a thermally conductive structure comprising a first structure and a second structure, and an insulator configured to insulate the first structure from the second structure, wherein the first structure and the second structure are composed of thermally conductive material, and at least a part of the thermally conductive structure is inserted to the insulating part.Type: GrantFiled: December 28, 2015Date of Patent: August 28, 2018Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Tae-Hong Min, Myung-Sam Kang, Young-Gwan Ko, Min-Jae Seong
-
Patent number: 9992865Abstract: A circuit board and an assembly including the circuit board are provided. The circuit board includes a first insulation layer, a first conductive pattern disposed on the first insulation layer, an insulation film disposed on the first conductive pattern, and a second conductive pattern disposed on the insulation film. The insulation film includes an insulation thin film contacting the first conductive pattern, and a function film disposed on the insulation thin film and contacting the second conductive pattern.Type: GrantFiled: February 17, 2016Date of Patent: June 5, 2018Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Tae-Hong Min, Myung-Sam Kang, Young-Gwan Ko, Min-Jae Seong
-
Patent number: 9793250Abstract: There are provided a package board, a method for manufacturing the same, and a package on package having the same. The package board according to an exemplary embodiment of the present disclosure includes a first insulating layer formed with a cavity having a penetrating shape; and a first connection pad formed to penetrate through the first insulating layer and formed at one side of the cavity.Type: GrantFiled: April 21, 2015Date of Patent: October 17, 2017Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Myung Sam Kang, Young Gwan Ko, Hye Jin Kim, Hye Won Jung, Min Jae Seong
-
Patent number: 9699885Abstract: Disclosed herein is a circuit board. According to an exemplary embodiment of the present disclosure, a circuit board has a structure in which at least a portion of a first heat transfer structure in which a metal layer and an insulating layer are alternately stacked is inserted into an insulating part.Type: GrantFiled: September 30, 2015Date of Patent: July 4, 2017Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Tae Hong Min, Myung Sam Kang, Young Gwan Ko, Min Jae Seong
-
Publication number: 20160249457Abstract: A circuit board and an assembly including the circuit board are provided. The circuit board includes a first insulation layer, a first conductive pattern disposed on the first insulation layer, an insulation film disposed on the first conductive pattern, and a second conductive pattern disposed on the insulation film. The insulation film includes an insulation thin film contacting the first conductive pattern, and a function film disposed on the insulation thin film and contacting the second conductive pattern.Type: ApplicationFiled: February 17, 2016Publication date: August 25, 2016Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Tae-Hong MIN, Myung-Sam KANG, Young-Gwan KO, Min-Jae SEONG
-
Publication number: 20160192471Abstract: A circuit board and a method of manufacturing the same are disclosed. The circuit board includes an insulating part, a thermally conductive structure comprising a first structure and a second structure, and an insulator configured to insulate the first structure from the second structure, wherein the first structure and the second structure are composed of thermally conductive material, and at least a part of the thermally conductive structure is inserted to the insulating part.Type: ApplicationFiled: December 28, 2015Publication date: June 30, 2016Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Tae-Hong MIN, Myung-Sam KANG, Young-Gwan KO, Min-Jae SEONG
-
Publication number: 20160095203Abstract: Disclosed herein is a circuit board including a heat transfer structure formed of a highly thermal conductive material, wherein a part of the heat transfer structure excluding an air cooling unit exposed to outside of an insulation unit is inserted into an insulation unit, and the air cooling unit has a shape having a high non-surface area such as a wrinkled or uneven shape.Type: ApplicationFiled: September 30, 2015Publication date: March 31, 2016Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Tae Hong MIN, Myung Sam KANG, Young Gwan KO, Min Jae SEONG, Jin Hyuk JANG
-
Publication number: 20160095198Abstract: Disclosed herein is a circuit board. According to an exemplary embodiment of the present disclosure, a circuit board has a structure in which at least a portion of a first heat transfer structure in which a metal layer and an insulating layer are alternately stacked is inserted into an insulating part.Type: ApplicationFiled: September 30, 2015Publication date: March 31, 2016Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Tae Hong MIN, Myung Sam KANG, Young Gwan KO, Min Jae SEONG
-
Publication number: 20160081182Abstract: There are provided a package board, a method for manufacturing the same, and a package on package having the same. The package board according to an exemplary embodiment of the present disclosure includes a first insulating layer formed with a cavity having a penetrating shape; and a first connection pad formed to penetrate through the first insulating layer and formed at one side of the cavity.Type: ApplicationFiled: April 21, 2015Publication date: March 17, 2016Inventors: Myung Sam KANG, Young Gwan KO, Hye Jin KIM, Hye Won JUNG, Min Jae SEONG
-
Publication number: 20150342046Abstract: A printed circuit board connected to one surface of a substrate and a first electronic component is mounted on the one surface. The printed circuit board includes at least one insulating layer and the insulating layer has a cavity accommodating at least a portion of the first electronic component formed therein, and the cavity has an internal surface made of an insulating material.Type: ApplicationFiled: May 21, 2015Publication date: November 26, 2015Inventors: Hye Jin KIM, Hye Won JUNG, Myung Sam KANG, Kang Wook BONG, Young Gwan KO, Min Jae SEONG