Abstract: An electronic device includes a substrate having a conductive structure with a substrate outward terminal at a second side of the substrate. A dielectric structure with an opening is adjacent to the second side. An electronic component is coupled to the substrate and an encapsulant encapsulates the electronic component. The substrate outward terminal comprises a multi-via terminal or a multi-stage via. The multi-via terminal includes pad conductive vias in the opening, a pad dielectric via interposed between the pad conductive vias, and a conductor comprising a conductor top side with micro dimples over the pad conductive vias and the pad dielectric via. The multi-stage terminal includes a pad base within the opening having a top side recessed below an upper surface the dielectric and a pad head coupled to the pad base within the opening, the pad head having a top side with a micro dimple.

Abstract: An electronic device includes a substrate having a conductive structure with a substrate outward terminal at a second side of the substrate. A dielectric structure with an opening is adjacent to the second side. An electronic component is coupled to the substrate and an encapsulant encapsulates the electronic component. The substrate outward terminal comprises a multi-via terminal or a multi-stage via. The multi-via terminal includes pad conductive vias in the opening, a pad dielectric via interposed between the pad conductive vias, and a conductor comprising a conductor top side with micro dimples over the pad conductive vias and the pad dielectric via. The multi-stage terminal includes a pad base within the opening having a top side recessed below an upper surface the dielectric and a pad head coupled to the pad base within the opening, the pad head having a top side with a micro dimple.

Abstract: In one example, an electronic device includes a substrate having a conductive structure. The conductive structure includes a substrate inward terminal at a first side of the substrate and a substrate outward terminal at a second side of the substrate. The substrate includes a dielectric structure with a first opening is at the second side. An electronic component is at the first side of the substrate and is electrically coupled to the substrate inward terminal, and an encapsulant encapsulates the electronic component. The substrate outward terminal comprises one of a multi-via terminal or a multi-stage via. The multi-via terminal includes pad conductive vias in the first opening a pad dielectric via interposed between the pad conductive vias in the first opening and a conductor comprising a conductor top side with micro dimples over the pad conductive vias and the pad dielectric via.

Abstract: In one example, an electronic device includes a substrate having a conductive structure. The conductive structure includes a substrate inward terminal at a first side of the substrate and a substrate outward terminal at a second side of the substrate. The substrate includes a dielectric structure with a first opening is at the second side. An electronic component is at the first side of the substrate and is electrically coupled to the substrate inward terminal, and an encapsulant encapsulates the electronic component. The substrate outward terminal comprises one of a multi-via terminal or a multi-stage via. The multi-via terminal includes pad conductive vias in the first opening a pad dielectric via interposed between the pad conductive vias in the first opening and a conductor comprising a conductor top side with micro dimples over the pad conductive vias and the pad dielectric via.