Patents by Inventor Min-Jer Lin

Min-Jer Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20060006529
    Abstract: A semiconductor package positioned on a first substrate includes a second substrate having a first surface and a second surface, a chip positioned on the first surface of the second substrate, a plurality of first bonding balls positioned on the second surface of the second substrate and arranged in a line along a first direction for connecting the second substrate to the first substrate, and at least a dummy bonding bar positioned on the second surface of the second substrate for connecting the second substrate to the first substrate and preventing the semiconductor package from inclining to one side.
    Type: Application
    Filed: July 8, 2004
    Publication date: January 12, 2006
    Inventor: Min-Jer Lin