Patents by Inventor Min-Jer Wang
Min-Jer Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11387683Abstract: An integrated circuit (IC) includes a first circuit layer that includes a first wireless power transfer (WPT) device, a first chip electrically connected to the first circuit layer, and a first tracking circuit disposed in the first chip. The first WPT device may be configured to extract energy from an electromagnetic signal and provide an output voltage. The first tracking circuit may be powered by the output voltage of the first WPT device and may output tracking data in response to an instruction extracted from the electromagnetic signal.Type: GrantFiled: September 9, 2020Date of Patent: July 12, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Min-Jer Wang, Ching-Nen Peng, Chewn-Pu Jou, Feng Wei Kuo, Hao Chen, Hung-Chih Lin, Huan-Neng Chen, Kuang-Kai Yen, Ming-Chieh Liu, Tsung-Hsiung Lee
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Publication number: 20210033663Abstract: A method of testing an integrated circuit includes connecting a conductive line to a ground voltage. The method further includes directly physically contacting the conductive line with a first conductive structure. The method further includes contacting the conductive line with a second conductive structure different from the first conductive structure. The method further includes supplying a first test voltage to the conductive line through the first conductive structure. The method further includes supplying a second test voltage to the conductive line through the second conductive structure. The method further includes generating a report indicating whether the first conductive structure is capable of carrying the first test voltage based on feedback from a first test circuit connected to the first conductive structure.Type: ApplicationFiled: October 21, 2020Publication date: February 4, 2021Inventors: Chewn-Pu JOU, Min-Jer WANG
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Publication number: 20210013748Abstract: An integrated circuit (IC) includes a first circuit layer that includes a first wireless power transfer (WPT) device, a first chip electrically connected to the first circuit layer, and a first tracking circuit disposed in the first chip. The first WPT device may be configured to extract energy from an electromagnetic signal and provide an output voltage. The first tracking circuit may be powered by the output voltage of the first WPT device and may output tracking data in response to an instruction extracted from the electromagnetic signal.Type: ApplicationFiled: September 9, 2020Publication date: January 14, 2021Inventors: MIN-JER WANG, CHING-NEN PENG, CHEWN-PU JOU, FENG WEI KUO, HAO CHEN, HUNG-CHIH LIN, HUAN-NENG CHEN, KUANG-KAI YEN, MING-CHIEH LIU, TSUNG-HSIUNG LEE
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Patent number: 10838001Abstract: An integrated circuit testing system is provided that includes a conductive line connected to a node configured to have a ground voltage. A plurality of conductive structures are coupled to the conductive line. A plurality of test circuits each is configured to supply a test voltage individually to a different conductive structure of the plurality of conductive structures for testing electrical connectivity of each of the different conductive structures. The conductive line is positioned between the node and the test circuits of the plurality of test circuits. A controller is coupled to each of the test circuits of the plurality of test circuits. The controller is configured to cause each of the test circuits of the plurality of test circuits to individually supply the test voltage to each of the different conductive structures of the plurality of conductive structures.Type: GrantFiled: July 22, 2019Date of Patent: November 17, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chewn-Pu Jou, Min-Jer Wang
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Patent number: 10790707Abstract: An integrated circuit (IC) includes a first circuit layer that includes a first wireless power transfer (WPT) device, a first chip electrically connected to the first circuit layer, and a first tracking circuit disposed in the first chip. The first WPT device may be configured to extract energy from an electromagnetic signal and provide an output voltage. The first tracking circuit may be powered by the output voltage of the first WPT device and may output tracking data in response to an instruction extracted from the electromagnetic signal.Type: GrantFiled: December 14, 2018Date of Patent: September 29, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Min-Jer Wang, Ching-Nen Peng, Chewn-Pu Jou, Feng Wei Kuo, Hao Chen, Hung-Chih Lin, Huan-Neng Chen, Kuang-Kai Yen, Ming-Chieh Liu, Tsung-Hsiung Lee
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Publication number: 20190339324Abstract: An integrated circuit testing system is provided that includes a conductive line connected to a node configured to have a ground voltage. A plurality of conductive structures are coupled to the conductive line. A plurality of test circuits each is configured to supply a test voltage individually to a different conductive structure of the plurality of conductive structures for testing electrical connectivity of each of the different conductive structures. The conductive line is positioned between the node and the test circuits of the plurality of test circuits. A controller is coupled to each of the test circuits of the plurality of test circuits. The controller is configured to cause each of the test circuits of the plurality of test circuits to individually supply the test voltage to each of the different conductive structures of the plurality of conductive structures.Type: ApplicationFiled: July 22, 2019Publication date: November 7, 2019Inventors: Chewn-Pu JOU, Min-Jer WANG
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Patent number: 10379156Abstract: An integrated circuit testing system includes a conductive structure, a conductive pad electrically connected with the conductive structure, a test circuit electrically connected with the conductive pad, a conductive line electrically connected with the conductive structure, the conductive line being configured to be connected with a ground, and a controller coupled with the test circuit. The controller is configured to selectively cause the test circuit to supply a voltage to the conductive structure via the conductive pad. The test circuit is configured to provide feedback to the controller indicative of whether the conductive structure is electrically connected with the conductive pad.Type: GrantFiled: July 31, 2015Date of Patent: August 13, 2019Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chewn-Pu Jou, Min-Jer Wang
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Publication number: 20190140488Abstract: An integrated circuit (IC) includes a first circuit layer that includes a first wireless power transfer (WPT) device, a first chip electrically connected to the first circuit layer, and a first tracking circuit disposed in the first chip. The first WPT device may be configured to extract energy from an electromagnetic signal and provide an output voltage. The first tracking circuit may be powered by the output voltage of the first WPT device and may output tracking data in response to an instruction extracted from the electromagnetic signal.Type: ApplicationFiled: December 14, 2018Publication date: May 9, 2019Inventors: MIN-JER WANG, CHING-NEN PENG, CHEWN-PU JOU, FENG WEI KUO, HAO CHEN, HUNG-CHIH LIN, HUAN-NENG CHEN, KUANG-KAI YEN, MING-CHIEH LIU, TSUNG-HSIUNG LEE
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Patent number: 10164480Abstract: An integrated circuit (IC) includes a first circuit layer that includes a first wireless power transfer (WPT) device, a first chip electrically connected to the first circuit layer, and a first tracking circuit disposed in the first chip. The first WPT device may be configured to extract energy from an electromagnetic signal and provide an output voltage. The first tracking circuit may be powered by the output voltage of the first WPT device and may output tracking data in response to an instruction extracted from the electromagnetic signal.Type: GrantFiled: May 8, 2017Date of Patent: December 25, 2018Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Min-Jer Wang, Ching-Nen Peng, Chewn-Pu Jou, Feng Wei Kuo, Hao Chen, Hung-Chih Lin, Huan-Neng Chen, Kuang-Kai Yen, Ming-Chieh Liu, Tsung-Hsiung Lee
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Publication number: 20170242071Abstract: An integrated circuit (IC) includes a first circuit layer that includes a first wireless power transfer (WPT) device, a first chip electrically connected to the first circuit layer, and a first tracking circuit disposed in the first chip. The first WPT device may be configured to extract energy from an electromagnetic signal and provide an output voltage. The first tracking circuit may be powered by the output voltage of the first WPT device and may output tracking data in response to an instruction extracted from the electromagnetic signal.Type: ApplicationFiled: May 8, 2017Publication date: August 24, 2017Inventors: Min-Jer WANG, Ching-Nen PENG, Chewn-Pu JOU, Feng Wei KUO, Hao CHEN, Hung-Chih LIN, Huan-Neng CHEN, Kuang-Kai YEN, Ming-Chieh LIU, Tsung-Hsiung LEE
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Publication number: 20170154843Abstract: A semiconductor device is provided which comprises a semiconductive substrate and an interconnect on the substrate. The interconnect comprises a dielectric in an upper most level of the interconnect and a plurality of conductive pads where each of the plurality of conductive pads is at least partially exposed from the dielectric. The interconnect further includes a current sensor electrically coupled with at least one of the plurality of conductive pads.Type: ApplicationFiled: November 30, 2015Publication date: June 1, 2017Inventors: HAO CHEN, CHEN-HSIANG HSU, HUNG-CHIH LIN, CHING-NEN PENG, MIN-JER WANG
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Patent number: 9653927Abstract: A composite integrated circuit (IC) includes a first circuit layer, a second circuit layer having a first chip and a second chip, and a first wireless power transfer (WPT) device in the first chip or the first circuit layer. The first WPT device generates a power supply voltage by extracting energy from an electromagnetic signal. A first tracking circuit in the second chip or the first circuit layer is powered by the power supply voltage from the first WPT device and stores or outputs tracking data in response to an instruction extracted from the electromagnetic signal.Type: GrantFiled: July 20, 2015Date of Patent: May 16, 2017Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Min-Jer Wang, Ching-Nen Peng, Chewn-Pu Jou, Feng Wei Kuo, Hao Chen, Hung-Chih Lin, Huan-Neng Chen, Kuang-Kai Yen, Ming-Chieh Liu, Tsung-Hsiung Lee
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Publication number: 20160349313Abstract: An integrated circuit testing system includes a conductive structure, a conductive pad electrically connected with the conductive structure, a test circuit electrically connected with the conductive pad, a conductive line electrically connected with the conductive structure, the conductive line being configured to be connected with a ground, and a controller coupled with the test circuit. The controller is configured to selectively cause the test circuit to supply a voltage to the conductive structure via the conductive pad. The test circuit is configured to provide feedback to the controller indicative of whether the conductive structure is electrically connected with the conductive pad.Type: ApplicationFiled: July 31, 2015Publication date: December 1, 2016Inventors: Chewn-Pu JOU, Min-Jer WANG
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Publication number: 20150323589Abstract: A composite integrated circuit (IC) includes a first circuit layer, a second circuit layer having a first chip and a second chip, and a first wireless power transfer (WPT) device in the first chip or the first circuit layer. The first WPT device generates a power supply voltage by extracting energy from an electromagnetic signal. A first tracking circuit in the second chip or the first circuit layer is powered by the power supply voltage from the first WPT device and stores or outputs tracking data in response to an instruction extracted from the electromagnetic signal.Type: ApplicationFiled: July 20, 2015Publication date: November 12, 2015Inventors: Min-Jer Wang, Ching-Nen PENG, Chewn-Pu JOU, Feng Wei KUO, Hao CHEN, Hung-Chih LIN, Huan-Neng CHEN, Kuang-Kai YEN, Ming-Chieh LIU, Tsung-Hsiung LEE