Abstract: A semiconductor device package includes a resin unit having a first through hole and a second through hole, a conductive body disposed on the resin unit and having a cavity that is concave in a first direction from a top surface of the conductive body toward a bottom surface thereof, and a light-emitting device disposed in the cavity, wherein the conductive body includes a first protrusion and a second protrusion, which protrude in the first direction from the bottom surface of the conductive body, and the first protrusion is disposed inside the first through hole, the second protrusion is disposed inside the second through hole, and a top surface of the resin unit is in contact with the bottom surface of the conductive body.

Abstract: An embodiment relates to a light emitting module, a flash module, and a terminal including the same. The light emitting module according to an embodiment comprises: a semiconductor layer; a phosphor layer arranged on one surface of the semiconductor layer; a plurality of light emitting chips including a plurality of electrodes arranged on a surface facing one surface of the semiconductor layer; a first partition arranged at one side of the plurality of light emitting chips, and a second partition arranged at the other side of the plurality of light emitting chips so as to face the first partition; and an opaque molding part, which encompasses the plurality of light emitting chips such that the upper surface of the phosphor layer and the bottom surfaces of the plurality of electrodes are exposed to the outside, and is arranged on the inner side of the first and second partitions.

Abstract: An embodiment relates to a light emitting module, a flash module, and a terminal including the same. The light emitting module according to an embodiment comprises: a semiconductor layer; a phosphor layer arranged on one surface of the semiconductor layer; a plurality of light emitting chips including a plurality of electrodes arranged on a surface facing one surface of the semiconductor layer; a first partition arranged at one side of the plurality of light emitting chips, and a second partition arranged at the other side of the plurality of light emitting chips so as to face the first partition; and an opaque molding part, which encompasses the plurality of light emitting chips such that the upper surface of the phosphor layer and the bottom surfaces of the plurality of electrodes are exposed to the outside, and is arranged on the inner side of the first and second partitions.

Abstract: An embodiment discloses a semiconductor device package comprising: a body including a cavity; a semiconductor device disposed in the cavity; a light transmitting member disposed in the cavity; and an adhesive layer for fixing the light transmitting member to the body, wherein the semiconductor device generates light in an ultraviolet wavelength band, and the adhesive layer comprises polymer resin and wavelength conversion particles which absorb the light in the ultraviolet wavelength band and generate light in a visible wavelength band.

Abstract: An embodiment discloses a semiconductor device package, comprising: a body including a cavity; a plurality of electrodes disposed inside the body; a semiconductor device disposed in the cavity of the body; and a transparent member disposed on the cavity, wherein the body comprises: a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface facing each other; a first corner area formed by the first side surface and the third side surface; a second corner area formed by the first side surface and the fourth side surface; a third corner area formed by the second side surface and the fourth side surface; and a fourth corner area formed by the second side surface and the third side surface, and wherein the plurality of electrodes comprises a first electrode on which the semiconductor device is disposed, wherein the first electrode comprises: a fifth side surface and a sixth side surface facing each other; a seventh side surface connecting the fifth side sur

Abstract: An embodiment may have a substrate (110) including a predetermined cavity (C); a plurality of light emitting chips (120) spaced apart from the cavity (C) of the substrate (110); a frame (130), disposed on the substrate (110) including a support portion (132) and a guide portion (134) including a predetermined through hole (H1); and a lens unit (140) disposed in the through hole (H1) of the guide portion (134).

Abstract: An embodiment may have a substrate (110) including a predetermined cavity (C); a plurality of light emitting chips (120) spaced apart from the cavity (C) of the substrate (110); a frame (130), disposed on the substrate (110) including a support portion (132) and a guide portion (134) including a predetermined through hole (H1); and a lens unit (140) disposed in the through hole (H1) of the guide portion (134).

Abstract: A semiconductor device package includes a resin unit having a first through hole and a second through hole, a conductive body disposed on the resin unit and having a cavity that is concave in a first direction from a top surface of the conductive body toward a bottom surface thereof, and a light-emitting device disposed in the cavity, wherein the conductive body includes a first protrusion and a second protrusion, which protrude in the first direction from the bottom surface of the conductive body, and the first protrusion is disposed inside the first through hole, the second protrusion is disposed inside the second through hole, and a top surface of the resin unit is in contact with the bottom surface of the conductive body.

Abstract: A light emitting device package of one embodiment includes a base, a light emitting device disposed on the base and having a first refractive index, a wavelength conversion portion disposed on the light emitting device and having a second refractive index, and a buffering layer disposed between the light emitting device and the wavelength conversion portion and having a third refractive index between the first refractive index and the second refractive index.

Abstract: A back light unit includes a bottom cover, a plurality of light source modules mounted on the bottom cover, and an optical sheet unit over the light source modules, wherein each of the light source module includes a PCB having the plurality of light source modules mounted thereon, a diffusing plate spaced a distance from the LED light sources and surrounding the PCB fully for diffusing a light incident thereon from the LED light sources throughout a surface thereof uniformly, and a diffusing plate supporter for securing the diffusing plate to the PCB, and the diffusing plate includes a flat plate portion, a side wall portion extended from opposite edges of the plate portion to the diffusing plate supporter, and a plurality of light diffusing units each projected from a surface facing the LED light source on the plate portion at a position matched to the LED light source, thereby enabling to make effective response to fabrication of thinner liquid crystal display device and improve a light uniformity, and impr

Abstract: A back light unit includes a bottom cover, a plurality of light source modules mounted on the bottom cover, and an optical sheet unit over the light source modules, wherein each of the light source module includes a PCB having the plurality of light source modules mounted thereon, a diffusing plate spaced a distance from the LED light sources and surrounding the PCB fully for diffusing a light incident thereon from the LED light sources throughout a surface thereof uniformly, and a diffusing plate supporter for securing the diffusing plate to the PCB, and the diffusing plate includes a flat plate portion, a side wall portion extended from opposite edges of the plate portion to the diffusing plate supporter, and a plurality of light diffusing units each projected from a surface facing the LED light source on the plate portion at a position matched to the LED light source, thereby enabling to make effective response to fabrication of thinner liquid crystal display device and improve a light uniformity, and impr