Patents by Inventor Min Ji Ko

Min Ji Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11956998
    Abstract: A display device includes: a first substrate including a pixel area and a transmissive area; a thin-film transistor on the first substrate; a planarization layer on the thin-film transistor; a first light emitting electrode on the planarization layer; a bank covering a part of the first light emitting electrode; a light emitting layer on the first light emitting electrode; and a second light emitting electrode on the light emitting layer and the bank. The transmissive area includes a transmissive hole penetrating the bank and the planarization layer.
    Type: Grant
    Filed: January 4, 2023
    Date of Patent: April 9, 2024
    Assignee: Samsung Display Co., Ltd.
    Inventors: Se Wan Son, Moo Soon Ko, Rae Young Gwak, Jin Seock Ma, Min Jeong Park, Ki Bok Yoo, So La Lee, Jin Goo Jung, Jong Won Chae, Ye Ji Han
  • Publication number: 20230114186
    Abstract: The present invention relates to a flexible skin patch equipped with an ultra-thin LED assembly that emits light in a specific wavelength range and an invention for manufacturing the same, and is related to an invention capable of providing a flexible skin patch that has the excellent effect of promoting vitamin D production in a localized area of the skin, and has the effect of alleviating or treating local skin psoriasis, fungi, fungal tumors and eczema, and has excellent antiviral effect, and is easy to attach and detach.
    Type: Application
    Filed: August 2, 2022
    Publication date: April 13, 2023
    Applicant: KOOKMIN UNIVERSITY INDUSTRY ACADEMY COOPERATION FOUNDATION
    Inventors: Young Rag DO, Min Ji KO
  • Publication number: 20180360986
    Abstract: The present invention relates to an antibody-drug conjugate comprising a drug conjugated to an antibody, a preparation method thereof and the use thereof.
    Type: Application
    Filed: August 9, 2018
    Publication date: December 20, 2018
    Inventors: Young Min Kim, Min Ji Ko, Jae Yong Kim, Ju Hee Kim, Kyung Duk Moon, Dae Hae Song, Jae Hyun Eom, Jin Won Jung
  • Patent number: 10071170
    Abstract: The present invention relates to an antibody-drug conjugate comprising a drug conjugated to an antibody, a preparation method thereof and the use thereof.
    Type: Grant
    Filed: June 24, 2014
    Date of Patent: September 11, 2018
    Assignee: ABLBIO
    Inventors: Young Min Kim, Min Ji Ko, Jae Yong Kim, Ju Hee Kim, Kyung Duk Moon, Dae Hae Song, Jae Hyun Eom, Jin Won Jung
  • Publication number: 20160136300
    Abstract: The present invention relates to an antibody-drug conjugate comprising a drug conjugated to an antibody, a preparation method thereof and the use thereof.
    Type: Application
    Filed: June 24, 2014
    Publication date: May 19, 2016
    Applicant: Hanwha Chemical Corporation
    Inventors: Young Min Kim, Min Ji Ko, Jae Yong Kim, Ju Hee Kim, Kyung Duk Moon, Dae Hae Song, Jae Hyun Eom, Jin Won Jung
  • Patent number: 7994084
    Abstract: Provided are a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The dielectric composition includes a main component, BaTiO3 of about 80 wt % or more, and an accessory component, CuBi2O4 and ZnO—B2O3—SiO2-based glass of about 20 wt % or less.
    Type: Grant
    Filed: November 26, 2008
    Date of Patent: August 9, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Soo Hyun Lyoo, Jong Myeon Lee, Ho Sung Choo, Min Ji Ko, Beom Joon Cho, Myung Whun Chang
  • Publication number: 20110064952
    Abstract: A method of fabricating a ceramic substrate includes: preparing a firing theta; forming a ceramic laminated body comprising at least one internal confinement layer on the ceramic theta; providing a temperature-compensation ceramic layer on at least one of a top surface of the ceramic laminated body and a bottom surface of the ceramic laminated body contacting the firing theta, the temperature-compensation ceramic layer having a different initial firing shrinkage temperature than the ceramic laminated body; and firing the ceramic laminated body.
    Type: Application
    Filed: December 31, 2009
    Publication date: March 17, 2011
    Inventors: Min Ji Ko, Yong Seok Choi
  • Publication number: 20110034606
    Abstract: Disclosed herein is a composite dielectric composition having a small variation of capacitance with temperature, comprising a combination of a polymer matrix exhibiting a positive or negative variation of capacitance with temperature and a ceramic filler exhibiting a negative or positive variation of capacitance with temperature which is reciprocal to that of the polymer matrix; and a signal-matching embedded capacitor prepared by using the same composition. Particularly, the present invention provides a composite dielectric composition comprising a polymer matrix exhibiting a positive or negative variation of capacitance with temperature and a ceramic filler exhibiting a variation of capacitance which is reciprocal to that of the polymer matrix; and a signal-matching embedded capacitor formed of the same composition and having a variation of capacitance with temperature, ?C/C×100(%), of not more than 5%.
    Type: Application
    Filed: October 18, 2010
    Publication date: February 10, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Eun Tae PARK, Yul Kyo Chung, Seung Hyun Sohn, Min Ji Ko
  • Patent number: 7567426
    Abstract: Disclosed herein is a polymer-ceramic dielectric composition. The dielectric composition comprises a polymer and a ceramic dispersed in the polymer wherein the ceramic is composed of a material having a perovskite structure represented by ABO3 and a metal oxide dopant and has an electrically charged surface. According to the dielectric composition, the surface of the ceramic is electrically charged to induce space-charge polarization (or interfacial polarization) at the polymer/ceramic interface, resulting in an increase in dielectric constant. Since the dielectric composition has a high dielectric constant particularly in a low-frequency range, it can be suitably used to produce decoupling capacitors.
    Type: Grant
    Filed: November 1, 2006
    Date of Patent: July 28, 2009
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Min Ji Ko, Eun Tae Park
  • Publication number: 20090159179
    Abstract: A method of manufacturing a multilayer ceramic substrate according to an aspect of the invention may include: manufacturing a ceramic laminate including a glass component; laminating constraining layers on upper and lower parts of the ceramic laminate; performing primary firing within a first temperature range that does not allow crystallization of the glass component included in the ceramic laminate; removing the constraining layers and forming an external electrode on the ceramic laminate after the primary firing is completed; and performing secondary firing of the ceramic laminate having the external electrode formed thereon within a second temperature range higher than the first temperature range.
    Type: Application
    Filed: December 19, 2008
    Publication date: June 25, 2009
    Inventors: Eun Tae Park, Min Ji Ko
  • Publication number: 20090141427
    Abstract: Provided are a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The dielectric composition includes a main component, BaTiO3 of about 80 wt % or more, and an accessory component, CuBi2O4 and ZnO—B2O3—SiO2-based glass of about 20 wt % or less.
    Type: Application
    Filed: November 26, 2008
    Publication date: June 4, 2009
    Inventors: Soo Hyun Lyoo, Jong Myeon Lee, Ho Sung Choo, Min Ji Ko, Beom Joon Cho, Myung Whun Chang
  • Patent number: 7531112
    Abstract: Disclosed is a composition for forming a dielectric, which is applied to an embedded capacitor with a high dielectric constant, a capacitor produced using the composition, and a PCB provided with the capacitor. The composition includes 40 to 99 vol % of thermoplastic or thermosetting resin, and 1 to 60 vol % of semiconductive filler. Alternatively, the composition includes 40 to 95 vol % of thermoplastic or thermosetting resin, and 5 to 60 vol % of semiconductive ferroelectric substance. Furthermore, the present invention provides the capacitor, produced using the composition, and the PCB provided with the capacitor. Therefore, the dielectric, which is produced using the composition including the semiconductive filler or semiconductive ferroelectric substance, is advantageous in that the dielectric constant is high and a dielectric loss is low. The dielectric is usefully applied to produce an embedded capacitor with the high dielectric constant and the PCB provided with the embedded capacitor.
    Type: Grant
    Filed: June 25, 2004
    Date of Patent: May 12, 2009
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyo Soon Shin, Jin Ho Kim, Jeong Joo Kim, Min Ji Ko
  • Publication number: 20090114434
    Abstract: There is provided a method of manufacturing a non-shrinkage ceramic substrate, and a non-shrinkage ceramic substrate using the same.
    Type: Application
    Filed: November 4, 2008
    Publication date: May 7, 2009
    Applicant: SAMSUNG ELECTRO-MECHNICS CO., LTD.
    Inventors: Min Ji Ko, Jong Myeon Lee, Eun Tae Park
  • Publication number: 20090114433
    Abstract: There is provided a multi-layered ceramic board and a method of manufacturing the same. A multi-layered ceramic board according to an aspect of the invention may include: an internal layer having a plurality of first dielectric sheets laminated, each of the first dielectric sheets prepared by mixing glass powder with a predetermined amount of alumina powder; and an external layer having at least one second dielectric sheet laminated on the surface of the internal layer, the second dielectric sheet prepared by mixing glass powder with alumina powder in a smaller amount than the first dielectric sheet, wherein via hole conductors and internal electrodes provided in the internal layer are electrically connected to a surface electrode provided on the surface of the external layer, and the internal layer, the external layer, the via hole conductors, the internal layer, and the surface electrode are fired at a predetermined temperature.
    Type: Application
    Filed: November 4, 2008
    Publication date: May 7, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Min Ji KO, Eun Tae Park, Yong Seok Choi, Soo Hyun Lyoo