Patents by Inventor Min Ji Lee

Min Ji Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130060920
    Abstract: An apparatus and a method for setting a ping interval in a portable terminal are provided. The method includes transmitting a ping message to a server after a predefined time period corresponding to a set ping interval and determining whether a response message is received from the server, so as to determine whether a ping test succeeds, determining whether a short interval count value of the set ping interval is 0 by referring to a count table when the ping test is determined to be successful, and resetting the ping interval, and determining whether the short interval count value of the set ping interval is 0 by referring to the count table when the ping test fails, and resetting the ping interval.
    Type: Application
    Filed: August 30, 2012
    Publication date: March 7, 2013
    Applicant: SAMSUNG ELECTRONICS CO. LTD.
    Inventors: Yong-Seok PARK, Min-Ji LEE
  • Publication number: 20110300102
    Abstract: The present invention relates to a composition for skin regeneration, using a culture medium or a secretion in the culture of an embryonic stem cell-derived endothelial progenitor cell, and to the use thereof. As the present invention uses the secretion in the culture as a medicine and not the embryonic stem cell-derived endothelial progenitor cell itself, the risk of teratoma formation is prevented, and angiogenic activity is promoted to achieve improved effectiveness in healing wounds and burn wounds. The composition of the present invention, when used as a material in cosmetics, increases collagen synthesis and thus prevents skin aging. Particularly, the composition of the present invention in which the secretion in the culture is concentrated into a high concentration provides superior wound-healing effects as compared to a conventional human growth hormone (hGH).
    Type: Application
    Filed: February 23, 2010
    Publication date: December 8, 2011
    Applicant: CHA BIO & DIOSTECH CO., LTD.
    Inventors: Hyung Min Chung, Ji Mi Kim, Min Ji Lee, Ki Sung Hong, Jong Hyuk Sung
  • Patent number: 7985697
    Abstract: Provided are a wafer level package in which a communication line can be readily formed between an internal device and the outside of the package, and a method of fabricating the wafer level package. The wafer level package includes a first substrate having a cavity in which a first internal device is disposed, an Input/Output (I/O) pad formed on the first substrate and electrically connected with the first internal device, a second substrate disposed over the first substrate and from which a part corresponding to the I/O pad is removed, and a solder bonding the first and second substrates. According to the wafer level package and the method of fabricating the same, upper and lower substrates are sawed to different cutting widths, or a hole is formed in the upper substrate, such that a communication line of an internal device can be readily formed without a via process which penetrates a substrate.
    Type: Grant
    Filed: September 11, 2008
    Date of Patent: July 26, 2011
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Jong Tae Moon, Yong Sung Eom, Min Ji Lee, Hyun Kyu Yu
  • Publication number: 20090261481
    Abstract: Provided are a wafer level package in which a communication line can be readily formed between an internal device and the outside of the package, and a method of fabricating the wafer level package. The wafer level package includes a first substrate having a cavity in which a first internal device is disposed, an Input/Output (I/O) pad formed on the first substrate and electrically connected with the first internal device, a second substrate disposed over the first substrate and from which a part corresponding to the I/O pad is removed, and a solder bonding the first and second substrates. According to the wafer level package and the method of fabricating the same, upper and lower substrates are sawed to different cutting widths, or a hole is formed in the upper substrate, such that a communication line of an internal device can be readily formed without a via process which penetrates a substrate.
    Type: Application
    Filed: September 11, 2008
    Publication date: October 22, 2009
    Applicant: ELECRTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Jong Tae MOON, Yong Sung Eom, Min Ji Lee, Hyun Kyu Yu
  • Publication number: 20080101769
    Abstract: A reproduction method is disclosed that creates an index file including start point and termination point information connected with user designated specified section of a motion picture file (MPF), and MPF storage location. According to index file selection and related reproduction request, the specified section of the corresponding MPF is reproduced with reference to above information stored in the index file, allowing convenient viewing of the specified section of the MPF.
    Type: Application
    Filed: October 31, 2007
    Publication date: May 1, 2008
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Min-Ji LEE
  • Publication number: 20080019440
    Abstract: An apparatus and a method for transmitting and receiving moving picture data, which can stream the moving picture through the near narrowband communication network in real time by using a portable terminal having a near field communication module like a Bluetooth module. The apparatus transmits some of audio visual data stored in the form of a file which is prescribed by Moving Picture Experts Group to the portable terminal connected to the near field communication network to allow the portable terminal to replay the audio visual data. Then, the apparatus divides the residual data into files with a desired size and transmits the files to the portable terminal, so the portable terminal can simultaneously receive and replay the moving picture.
    Type: Application
    Filed: May 10, 2007
    Publication date: January 24, 2008
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Seung-Cheol Lee, Sang-Bong Lee, Sang-Wook Woo, Hyun-II Park, Min-Ji Lee