Abstract: The invention provides a method for labeling an optical fiber wavelength, including: deploying a spreading code on each of a transmit end and a receive end; transmitting a message code, and spreading the message code by using the spreading code of the transmit end; and performing envelope modulation on an optical signal by using the spread message code, transmitting the optical signal after the envelope modulation to the receive end, choosing, the spreading code of the receive end to despread the message code to obtain the original message code of the transmit end, and obtaining a corresponding wavelength according to the spreading code of the receive end. A spreading code having a correspondence with a wavelength is used to spread and despread a message code, and a modulation depth of an amplitude modulated signal may be greatly reduced to nearly prevent an envelope modulated signal from affecting a main signal.

Abstract: A battery pack includes a main body, and a handle rotatably connected to the main body. The handle is integrally formed by a steel wire. A related garden tool includes a working head, a power driving device for driving the working head to work, and the battery pack.

Abstract: Embodiments of the present disclosure disclose a lamp which comprises a driving plate, a hanging plate, and a main lamp. The driving plate comprises an elastic probe. Each of the hanging plate and the main lamp comprises a contact piece for electrically connecting with the elastic probe. The driving plate is in buckle connection with the hanging plate and the main lamp. The elastic probe on the driving plate is electrically connected to the contact piece on the hanging plate when the driving plate is engaged with the hanging plate. The elastic probe on the driving plate is electrically connected to the contact piece on the main lamp when the driving plate is engaged with the main lamp. A feasible dual-purpose panel lamp which enables more convenient installation can be provided by embodiments of the present disclosure.

Abstract: The invention discloses a connection structure of a frame assembly and a cover. When assembling the cover and the frame assembly, only the two side edges of the cover are respectively fitted into first slots of the two side frames of the frame and the two top edges of the cover are respectively fitted into second slots of the two top frames of the frame, and then the cover and the frame can be snap-fitted. Finally the cover and the beam can be fixed by screws to complete the connection of the frame assembly and the cover. The invention makes the connection structure of the frame assembly and the cover plate simple and convenient to assemble. The connection structure between the cover and the frame assembly is simplified, and it is more convenient to assemble the cover and the frame assembly.

Abstract: A battery pack includes a main body, and a handle rotatably connected to the main body. The handle is integrally formed by a steel wire. A related garden tool includes a working head, a power driving device for driving the working head to work, and the battery pack.

Abstract: Embodiments of the present disclosure disclose a lamp which comprises a driving plate, a hanging plate, and a main lamp. The driving plate comprises an elastic probe. Each of the hanging plate and the main lamp comprises a contact piece for electrically connecting with the elastic probe. The driving plate is in buckle connection with the hanging plate and the main lamp. The elastic probe on the driving plate is electrically connected to the contact piece on the hanging plate when the driving plate is engaged with the hanging plate. The elastic probe on the driving plate is electrically connected to the contact piece on the main lamp when the driving plate is engaged with the main lamp. A feasible dual-purpose panel lamp which enables more convenient installation can be provided by embodiments of the present disclosure.

Abstract: A method for preparing a grounding substrate for a semiconductor device, the method including: 1) polishing the surface of a matrix of a grounding substrate to remove a carbon layer therefrom, and washing the surface of the matrix with anhydrous ethanol; 2) providing a cold spray system including a spraying device, a spray chamber, and a special fixture disposed in the spray chamber; and disposing the matrix on the special fixture; 3) using the cold spray system to spray a compressed gas carrying aluminum powder on the surface of the matrix at the supersonic speed to form an aluminum coating, thus obtaining the grounding substrate; 4) disposing the grounding substrate in a heat treatment furnace, raising the temperature therein to between 100 and 500° C., and maintaining the temperature for between 1 and 5 hrs; and 5) wet polishing the grounding substrate.

Abstract: An integrated circuit and an apparatus are provided. The integrated circuit comprises a bias circuit, an LC resonator circuit, and a current mode logic (CML) frequency divider. The bias circuit generates first and second bias voltages. The LC resonator circuit generates an oscillation signal having an oscillation frequency. The CML frequency divider, coupled to the bias circuit and the LC resonator circuit, biased by the first and second bias voltages, receives the oscillation signal to generate an output signal having an output frequency with a fractional rate of the oscillation frequency. The oscillation signal comprises AC and DC components, the CML frequency divider receives the AC component to determine an injected frequency and reuses the DC component to provide tail currents to determine a natural frequency of the CML frequency divider. The output frequency is determined by the injected frequency and the natural frequency.

Abstract: An integrated circuit and an apparatus are provided. The integrated circuit comprises a bias circuit, an LC resonator circuit, and a current mode logic (CML) frequency divider. The bias circuit generates first and second bias voltages. The LC resonator circuit generates an oscillation signal having an oscillation frequency. The CML frequency divider, coupled to the bias circuit and the LC resonator circuit, biased by the first and second bias voltages, receives the oscillation signal to generate an output signal having an output frequency with a fractional rate of the oscillation frequency. The oscillation signal comprises AC and DC components, the CML frequency divider receives the AC component to determine an injected frequency and reuses the DC component to provide tail currents to determine a natural frequency of the CML frequency divider. The output frequency is determined by the injected frequency and the natural frequency.

Abstract: The present invention relates to a method of surface treatment of metallic materials, more particularly, to a method of the surface self-nanocrystallization of metallic materials by the bombarding of supersonic fine particles. The method comprises the step of bombarding the surface of metallic substrate material with fine particles at supersonic speed of 300-1200 m/s carried by a compressed gas, which is ejected from a nozzle. The present method can be used for the surface self-nanocrystallization of metallic parts with a complicated structure or a large area, and the nanometer layer obtained is homogeneous. In addition, it can be operated in a simple way with low energy consumption, low cost, high efficiency of production and high surface nanocrystallization rate of from 1 cm2 to 10 cm2/min.

Abstract: A high-speed phase-frequency detection module is described to function at very high frequencies and to produce very low jitter. In one embodiment, high-speed phase-frequency detection module includes a PFD with edge-triggered asynchronous-reset true-single-phase-clocking (“TSPC”) D flip-flops that have very short CLK to Q and Reset to Q time delays. In one embodiment, the high-speed phase-frequency detection module includes a charge pump, without replica or feedback, that can respond to the very narrow pulses from the PFD and produce output voltages with small ripple, thus leading to low VCO output jitter.

Abstract: A high-speed phase-frequency detection module is described to function at very high frequencies and to produce very low jitter. In one embodiment, high-speed phase-frequency detection module includes a PFD with edge-triggered asynchronous-reset true-single-phase-clocking (“TSPC”) D flip-flops that have very short CLK to Q and Reset to Q time delays. In one embodiment, the high-speed phase-frequency detection module includes a charge pump, without replica or feedback, that can respond to the very narrow pulses from the PFD and produce output voltages with small ripple, thus leading to low VCO output jitter.

Abstract: The present invention relates to a method of surface treatment of metallic materials, more particularly, to a method of the surface self-nanocrystallization of metallic materials by the bombarding of supersonic fine particles. The method comprises the step of bombarding the surface of metallic substrate material with fine particles at supersonic speed of 300-1200 m/s carried by a compressed gas, which is ejected from a nozzle. The present method can be used for the surface self-nanocrystallization of metallic parts with a complicated structure or a large area, and the nanometer layer obtained is homogeneous. In addition, it can be operated in a simple way with low energy consumption, low cost, high efficiency of production and high surface nanocrystallization rate of from 1 cm2 to 10 cm2/min.

Abstract: The present invention discloses the use of quaternary compounds as stabilizing agents for highly-sensitive fluorescent nucleic acid stains in aqueous solvents, their use in gels to give increased usable shelf life, and in compositions of solvents, providing ready-to-use stain solutions.