Patents by Inventor Min Jin HAN
Min Jin HAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10910242Abstract: A temperature controller for semiconductor fabrication comprises a lower chiller connected with a lower chamber of a processing chamber and configured to adjust a temperature of the lower chamber, an electrostatic chuck disposed in the lower chamber and an upper chiller connected with an upper chamber of the processing chamber and configured to adjust a temperature of the upper chamber, a heater disposed in the upper chamber. In the temperature controller for semiconductor fabrication, the three-way valve may be installed on the cooling fluid supplying pipe, and the bypass pipe may be installed between the three-way valve and the cooling fluid collecting pipe to reduce the degree of bypass opening of the three-way valve.Type: GrantFiled: February 1, 2019Date of Patent: February 2, 2021Inventors: Yong Kyun Lim, Cheol Won Jang, Min Jin Han, Jae Geon Kim
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Publication number: 20190244840Abstract: A temperature controller for semiconductor fabrication comprises a lower chiller connected with a lower chamber of a processing chamber and configured to adjust a temperature of the lower chamber, an electrostatic chuck disposed in the lower chamber and an upper chiller connected with an upper chamber of the processing chamber and configured to adjust a temperature of the upper chamber, a heater disposed in the upper chamber. In the temperature controller for semiconductor fabrication, the three-way valve may be installed on the cooling fluid supplying pipe, and the bypass pipe may be installed between the three-way valve and the cooling fluid collecting pipe to reduce the degree of bypass opening of the three-way valve.Type: ApplicationFiled: February 1, 2019Publication date: August 8, 2019Inventors: Yong Kyun LIM, Cheol Won JANG, Min Jin HAN, Jae Geon KIM
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Patent number: 10163665Abstract: Provided is a temperature control system configured to mix a low temperature heating medium and a high temperature heating medium to supply the heating mediums at a temperature according to a process recipe to an electrostatic chuck (ESC) configured to maintain a temperature and support a wafer in a chamber in which a semiconductor wafer processing process is performed, and a heating medium obtained by mixing a heating medium cooled through a thermoelectric element and a heating medium heated through a heater to a desired target temperature according to a first ratio and a second ratio is provided to a load and recovered from the load, and the heating medium is distributed to the thermoelectric element and the heater according to the first ratio and the second ratio, which are ratios upon the mixing, optimizing power consumption for cooling or heating.Type: GrantFiled: February 25, 2016Date of Patent: December 25, 2018Assignee: TECHEST CO., LTD.Inventors: Min Jin Han, Jae Geon Kim
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Patent number: 10163666Abstract: Provided is a temperature control system configured to mix a low temperature heating medium and a high temperature heating medium to supply the heating mediums at a temperature according to a process recipe to an electrostatic chuck (ESC) configured to maintain a temperature and support a wafer in a chamber in which a semiconductor wafer processing process is performed, and a heating medium obtained by mixing a heating medium cooled through a thermoelectric element and a heating medium heated through a heater to a desired target temperature according to a first ratio and a second ratio is provided to a load and recovered from the load, and the heating medium is distributed to the thermoelectric element and the heater according to the first ratio and the second ratio, which are ratios upon the mixing, optimizing power consumption for cooling or heating.Type: GrantFiled: February 25, 2016Date of Patent: December 25, 2018Assignee: TECHEST. CO., LTD.Inventors: Min Jin Han, Jae Geon Kim
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Patent number: 9520308Abstract: Provided is a temperature control system configured to mix a low temperature heating medium and a high temperature heating medium to supply the heating mediums at a temperature according to a process recipe to an electrostatic chuck (ESC) configured to maintain a temperature and support a wafer in a chamber in which a semiconductor wafer processing process is performed, and a heating medium obtained by mixing a heating medium cooled through a thermoelectric element and a heating medium heated through a heater to a desired target temperature according to a first ratio and a second ratio is provided to a load and recovered from the load, and the heating medium is distributed to the thermoelectric element and the heater according to the first ratio and the second ratio, which are ratios upon the mixing, optimizing power consumption for cooling or heating.Type: GrantFiled: April 28, 2014Date of Patent: December 13, 2016Assignee: TECHEST CO., LTDInventors: Min Jin Han, Jae Geon Kim
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Patent number: 9395249Abstract: A wide range temperature control system for semiconductor manufacturing equipment uses a thermoelectric element applied to a chiller that is a temperature control device for semiconductor manufacturing equipment. The refrigerant circulated through a refrigerant tank passes through thermoelectric element block groups and is cooling and heating controlled, outputs of the thermoelectric element block groups are then supplied to a load, a heat exchanger using process cooling water (PCW) is configured in the refrigerant tank in which the refrigerant recirculated from a working load is stored, a heater for high temperature heating is further configured, some of the thermoelectric element block groups at a high temperature are bypassed through a variable valve, the polarity of a voltage is reversed in the thermoelectric element block groups through which a high-temperature refrigerant passes, and a part of an insulating element adjacent to the refrigerant is maintained at a lower temperature than the refrigerant.Type: GrantFiled: September 4, 2013Date of Patent: July 19, 2016Assignee: TECHEST CO., LTD.Inventors: Min Jin Han, Jae Geon Kim
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Publication number: 20160169563Abstract: Provided is a temperature control system configured to mix a low temperature heating medium and a high temperature heating medium to supply the heating mediums at a temperature according to a process recipe to an electrostatic chuck (ESC) configured to maintain a temperature and support a wafer in a chamber in which a semiconductor wafer processing process is performed, and a heating medium obtained by mixing a heating medium cooled through a thermoelectric element and a heating medium heated through a heater to a desired target temperature according to a first ratio and a second ratio is provided to a load and recovered from the load, and the heating medium is distributed to the thermoelectric element and the heater according to the first ratio and the second ratio, which are ratios upon the mixing, optimizing power consumption for cooling or heating.Type: ApplicationFiled: February 25, 2016Publication date: June 16, 2016Applicant: Techest. Co., LtdInventors: Min Jin HAN, Jae Geon KIM
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Publication number: 20160172219Abstract: Provided is a temperature control system configured to mix a low temperature heating medium and a high temperature heating medium to supply the heating mediums at a temperature according to a process recipe to an electrostatic chuck (ESC) configured to maintain a temperature and support a wafer in a chamber in which a semiconductor wafer processing process is performed, and a heating medium obtained by mixing a heating medium cooled through a thermoelectric element and a heating medium heated through a heater to a desired target temperature according to a first ratio and a second ratio is provided to a load and recovered from the load, and the heating medium is distributed to the thermoelectric element and the heater according to the first ratio and the second ratio, which are ratios upon the mixing, optimizing power consumption for cooling or heating.Type: ApplicationFiled: February 25, 2016Publication date: June 16, 2016Applicant: Techest. Co., LtdInventors: Min Jin HAN, Jae Geon KIM
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Publication number: 20150107268Abstract: Provided is a temperature control system configured to mix a low temperature heating medium and a high temperature heating medium to supply the heating mediums at a temperature according to a process recipe to an electrostatic chuck (ESC) configured to maintain a temperature and support a wafer in a chamber in which a semiconductor wafer processing process is performed, and a heating medium obtained by mixing a heating medium cooled through a thermoelectric element and a heating medium heated through a heater to a desired target temperature according to a first ratio and a second ratio is provided to a load and recovered from the load, and the heating medium is distributed to the thermoelectric element and the heater according to the first ratio and the second ratio, which are ratios upon the mixing, optimizing power consumption for cooling or heating.Type: ApplicationFiled: April 28, 2014Publication date: April 23, 2015Applicant: TECHEST. CO., LTDInventors: Min Jin HAN, Jae Geon KIM
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Publication number: 20140072015Abstract: A wide range temperature control system for semiconductor manufacturing equipment uses a thermoelectric element applied to a chiller that is a temperature control device for semiconductor manufacturing equipment. The refrigerant circulated through a refrigerant tank passes through thermoelectric element block groups and is cooling and heating controlled, outputs of the thermoelectric element block groups are then supplied to a load, a heat exchanger using process cooling water (PCW) is configured in the refrigerant tank in which the refrigerant recirculated from a working load is stored, a heater for high temperature heating is further configured, some of the thermoelectric element block groups at a high temperature are bypassed through a variable valve, the polarity of a voltage is reversed in the thermoelectric element block groups through which a high-temperature refrigerant passes, and a part of an insulating element adjacent to the refrigerant is maintained at a lower temperature than the refrigerant.Type: ApplicationFiled: September 4, 2013Publication date: March 13, 2014Applicant: TECHEST CO., LTD.Inventors: Min Jin HAN, Jae Geon KIM