Patents by Inventor Min JING

Min JING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10994501
    Abstract: A method for molding a hollow vehicle part, the hollow vehicle part and an automobile. The method includes: a. preparing an inflatable core mold matching a target vehicle part on a geometrical shape in an inflated state, coating curable thermoplastic resin on the surface of the inflatable core mold in the inflated state, and performing shaping; b. braiding fibers on the surface of the shaped core mold to form at least one braided layer; c. conveying the preform into a curing agent passage, and sequentially passing through a heating section and a coating section; and d. conveying the preform mixed with curing agent into a curing passage for curing and molding, then deflating and taking out the inflatable core mold. The method has a high processing automation degree and can meet large-scale production. The produced hollow vehicle part has good mechanical properties, low cost and remarkable lightweight effect.
    Type: Grant
    Filed: May 25, 2017
    Date of Patent: May 4, 2021
    Inventors: Yingtao Duan, Fanzhong Kong, Na Li, Yongbin Shan, Wenbo Li, Min Jing, Xinglong Zhang
  • Publication number: 20190337243
    Abstract: A method for molding a hollow vehicle part, the hollow vehicle part and an automobile. The method includes: a. preparing an inflatable core mold matching a target vehicle part on a geometrical shape in an inflated state, coating curable thermoplastic resin on the surface of the inflatable core mold in the inflated state, and performing shaping; b. braiding fibers on the surface of the shaped core mold to form at least one braided layer; c. conveying the preform into a curing agent passage, and sequentially passing through a heating section and a coating section; and d. conveying the preform mixed with curing agent into a curing passage for curing and molding, then deflating and taking out the inflatable core mold. The method has a high processing automation degree and can meet large-scale production. The produced hollow vehicle part has good mechanical properties, low cost and remarkable lightweight effect.
    Type: Application
    Filed: May 25, 2017
    Publication date: November 7, 2019
    Inventors: Yingtao DUAN, Fanzhong KONG, Na LI, Yongbin SHAN, Wenbo LI, Min JING, Xinglong ZHANG
  • Publication number: 20140292105
    Abstract: A static transfer switch circuit for high reliability uninterruptible power supply system comprises a first switch unit which includes at least two switch sets connected in parallel and at least one second switch unit. Each of the switch sets has two controllable semiconductor switch elements connected in parallel reversely. The first switch unit includes one end connected to a bypass power source and another end connected to a load end. The second switch unit includes at least two switch sets or electromagnetic switches connected in series, and has one end connected to an output end of an uninterruptible power supply system main unit and another end connected to the load end. The static transfer switch circuit thus formed is simpler in structure and can enhance the reliability of static transfer switches used on a single machine or multi-machine uninterruptible power supply system.
    Type: Application
    Filed: December 17, 2013
    Publication date: October 2, 2014
    Inventor: MIN-JING HSIEH
  • Patent number: 6944066
    Abstract: A data path including a local input/output (LIO) line and a global input/output (GIO) line coupled together through an input/output (IO) line coupling circuit. The coupling circuit is coupled to an internal voltage supply, and couples and decouples signal lines of the GIO line from the supply terminal according to read data coupled to the LIO line. The GIO line is coupled to a current sense amplifier to generate output voltage signals that are coupled to an output buffer. An example of a current sense amplifier coupled to the GIO line includes first and second load circuits and first and second n-channel MOS (NMOS) transistors coupled to a respective load circuit. The gates of NMOS transistors are cross coupled, and input current signals are coupled to source terminals of the NMOS transistors and the output voltage signals are coupled from the drain terminals of the NMOS transistors.
    Type: Grant
    Filed: April 29, 2004
    Date of Patent: September 13, 2005
    Assignee: Micron Technology, Inc.
    Inventor: Chul Min Jing