Patents by Inventor Min Joon SEO

Min Joon SEO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for recovering valuable metal from waste electrode material of lithium secondary battery by using lithium carbonate
    Patent number: 11987861
    Abstract: A method according to an embodiment is for recovering a valuable metal from a waste electrode material of a lithium secondary battery by using lithium carbonate. An anode-cathode mixed electrode material that has been separated by draining, crushing, screening, and sorting a waste lithium secondary battery is preprocessed. A precipitation operation performed by adding lithium carbonate (Li2CO3) to a metal melt acquired by performing sulfuric acid dissolution using sulfuric acid. A valuable metal such as nickel, cobalt, manganese, aluminum, and copper is recovered as a residue in the form of a carbonate composite, and a lithium sulfate (Li2SO4) aqueous solution including lithium is recovered as a filtrate.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: May 21, 2024
    Assignee: ECOPRO INNOVATION CO., LTD.
    Inventors: Suk Joon Park, Myung Gyu Lee, Jeong Sik Hong, So Yeong Byun, Gwang Seok Lee, Jong Sun Park, Beom Seok Seo, Min Woo Lee, Da Mo A Kim, Hui Sang Kim, A Ram Park
  • Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same
    Patent number: 11639438
    Abstract: An epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the epoxy resin composition, the epoxy resin composition including an epoxy resin; a curing agent; an inorganic filler; and a curing catalyst, the epoxy resin including an epoxy resin represented by Formula 1:
    Type: Grant
    Filed: September 20, 2021
    Date of Patent: May 2, 2023
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Yong Yeop Park, Dong Hwan Lee, Kyoung Chui Bae, Min Joon Seo, Chui Ho Lee
  • EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME
    Publication number: 20220145066
    Abstract: An epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the epoxy resin composition, the epoxy resin composition including an epoxy resin; a curing agent; an inorganic filler; and a curing catalyst, the epoxy resin including an epoxy resin represented by Formula 1:
    Type: Application
    Filed: September 20, 2021
    Publication date: May 12, 2022
    Inventors: Yong Yeop PARK, Dong Hwan LEE, Kyoung Chul BAE, Min Joon SEO, Chul Ho LEE