Abstract: A method for generating Bessel beams includes the steps of: utilizing a light source to generate an incident beam to a phase modulation module; utilizing the phase modulation module to rectify the incident beam into a circular beam, and to modulate a phase of the circular beam into an asymmetric phase so as to form an asymmetric collimated circular beam provided to a scanning module; utilizing the scanning module to compensate the asymmetric collimated circular beam, and utilizing the asymmetric collimated circular beam to scan at different angles and then enter a focusing element; and, utilizing the focusing element to focus and interfere the asymmetric collimated circular beam into form a Bessel beam for machining.

Abstract: A cutting method for forming a chamfered corner includes a step of selecting a light pattern-adjusting module according to a pre-cut chamfer angle, a step of the light pattern-adjusting module emitting a laser beam to a substrate and thus forming a modified region extending in a thickness direction at the substrate, a step of the light pattern-adjusting module adjusting an axial energy distribution of a light pattern of the laser beam to vary an appearance of the modified region so as to form the modified region fulfilling the pre-cut chamfer angle, and a step of etching the substrate having the modified region to form a chamfered surface on the substrate by cutting the modified region from the substrate.

Abstract: A laser cleaning apparatus and a laser cleaning method are furnished, for switching the wavelengths of laser beams furnished by a single laser module using a wavelength switching module and cleaning a test piece using the laser beams having wavelengths and energy suitable for manufacturing needs. The laser cleaning method includes: creating a laser beam; switching the wavelength output by the laser based on process requirements; propagating the laser beam via an optical path propagating module for laser cleaning the test piece; and removing debris. A transfer platform allows movements of the laser beams with respect to the test piece to achieve cleaning of the entire test piece. A control module controls the wavelength switching unit, the laser beam regulating module, and the transfer platform. Total laser cleaning with improved laser cleaning quality is achieved by using these laser beams with the appropriate wavelengths and energy.

Abstract: A laser uniformly machining apparatus and method thereof are provided. The apparatus includes a laser unit, a shaping element, a collimating element, a scaling element and a focusing element. The laser unit provides a laser beam for machining. The shaping element shapes the laser beam into an annular beam. The collimating element modifies the direction of the annular beam in accordance with the direction of an optical axis to turn the annular beam into a collimated annular beam. The scaling element adjusts the collimated annular beam in accordance with a scaling ratio to produce a scaled annular beam. The focusing element focuses the scaled annular beam. The scaled annular beam is produced by the scaling element to form a focused beam having a uniformly distribution of light intensity in the direction of the optical axis.

Abstract: A light emitting method includes passing a laser beam through at least one offset assembly and a focusing assembly in sequence, and actuating, by a control-manipulating mechanism, the offset assembly to cause the laser beam to be offset, so that the laser beam can quickly produce a controllable opening of any shape in a drilling process.

Abstract: A cutting method for forming a chamfered corner includes a step of selecting a light pattern-adjusting module according to a pre-cut chamfer angle, a step of the light pattern-adjusting module emitting a laser beam to a substrate and thus forming a modified region extending in a thickness direction at the substrate, a step of the light pattern-adjusting module adjusting an axial energy distribution of a light pattern of the laser beam to vary an appearance of the modified region so as to form the modified region fulfilling the pre-cut chamfer angle, and a step of etching the substrate having the modified region to form a chamfered surface on the substrate by cutting the modified region from the substrate.

Abstract: A laser cleaning apparatus and a laser cleaning method are furnished, for switching the wavelengths of laser beams furnished by a single laser module using a wavelength switching module and cleaning a test piece using the laser beams having wavelengths and energy suitable for manufacturing needs. The laser cleaning method includes: creating a laser beam; switching the wavelength output by the laser based on process requirements; propagating the laser beam via an optical path propagating module for laser cleaning the test piece; and removing debris. A transfer platform allows movements of the laser beams with respect to the test piece to achieve cleaning of the entire test piece. A control module controls the wavelength switching unit, the laser beam regulating module, and the transfer platform. Total laser cleaning with improved laser cleaning quality is achieved by using these laser beams with the appropriate wavelengths and energy.

Abstract: A light emitting method includes passing a laser beam through at least one offset assembly and a focusing assembly in sequence, and actuating, by a control-manipulating mechanism, the offset assembly to cause the laser beam to be offset, so that the laser beam can quickly produce a controllable opening of any shape in a drilling process.

Abstract: A laser uniformly machining apparatus and method thereof are provided. The apparatus includes a laser unit, a shaping element, a collimating element, a scaling element and a focusing element. The laser unit provides a laser beam for machining. The shaping element shapes the laser beam into an annular beam. The collimating element modifies the direction of the annular beam in accordance with the direction of an optical axis to turn the annular beam into a collimated annular beam. The scaling element adjusts the collimated annular beam in accordance with a scaling ratio to produce a scaled annular beam. The focusing element focuses the scaled annular beam. The scaled annular beam is produced by the scaling element to form a focused beam having a uniformly distribution of light intensity in the direction of the optical axis.

Abstract: A laser machining device includes a laser generating component, a light moving component, a gas source and a laser machining scrap removal device. The laser generating component generates a laser beam passing through an optical channel. The light moving component is positioned along a path of the laser beam to make the laser beam move along an annular machining path. The laser machining scrap removal device utilizes an internal flow path of the nozzle to increase the speed of the ejected airflow and reduce the pressure of a suction area. The gas source provides an airflow and is located on the laser machining scrap removal device in communication with the internal flow path of the nozzle. The laser machining scrap removal device induces suction on the laser processed area to assist in laser cutting/drilling processes by removing large areas of scrap, thereby improving the production speed and hole quality.

Abstract: A visual error calibration method configured to calibrate visual positioning errors of a laser processing apparatus is provided. The method includes: providing an alignment mark having at least one alignment point; locating a preset point of the alignment mark at a first preset position of a working area, and locating a preset image point at a preset position of the visible area; locating the alignment point at one of the second preset positions in the working area; adjusting parameters of a scanning module to locate an alignment image point at the preset position; relatively moving the alignment image point to positions of the visible area in sequence; recording the positions of the alignment image point in the visible area, the positions of the alignment point in the working area and the parameters of the scanning module, so as to produce an alignment table.

Abstract: A beam diffusing module including a light incident terminal, a light emitting terminal, a first reflective plate and a second reflective plate is provided. The first reflective plate and the second reflective plate are disposed on a transmission path of a laser beam. At least one of the first reflective plate and the second reflective plate has a plurality of reflective micorstructures. The reflective micorstructures are arranged along a second direction from the light incident terminal towards the light emitting terminal. At least a part of the laser beam enters the beam diffusing module through the light incident terminal and emerges from the light emitting terminals after being reflected repeatedly by the first reflective plate and the second reflective plate to cause an M squared of the laser beam to be redistributed along a first direction. A beam generating system is also provided.

Abstract: A three-dimension laser processing apparatus including a laser source, a zoom lens set, a scanning mirror module, a visual module unit and a control unit is provided. The laser source provides a laser beam. The zoom lens set and the scanning mirror module are both located on the transmitting path of the laser beam. The visual module unit has a visible area. The control unit is electrically connected with and adjusts the zoom lens set and the scanning mirror module to make the laser beam focused on a plurality of reference surfaces in a three-dimension working space and make a plurality of positions of an image in the three-dimension working space focused on a center of the visible area correspondingly through the zoom lens set and an image lens set of the visual module unit. Besides, a positioning error correction method is provided.

Abstract: A programmable laser trigger device and the method for controlling the same are disclosed. The programmable laser trigger device comprises: an external signal module and a command executing module. The external signal module is capable of interfacing the inputs and outputs of waveform command and signals. The command executing module further comprises: a waveform command memory, for storing the waveform command; a waveform command decoder; a waveform generator; and a buffer memory, acting as a waveform trigger parameter buffer between the waveform command decoder and the waveform generator; wherein the waveform command decoder accesses the waveform command stored in the memory for pre-decoding an executing code while generating a sequence of waveform trigger parameters to be stored in the buffer memory, which provides the waveform generator with the sequence of waveform trigger parameters to be transformed into a pulse-width modulation (PWM) pulse train.

Abstract: A beam diffusing module including a light incident terminal, a light emitting terminal, a first reflective plate and a second reflective plate is provided. The first reflective plate and the second reflective plate are disposed on a transmission path of a laser beam. At least one of the first reflective plate and the second reflective plate has a plurality of reflective micorstructures. The reflective micorstructures are arranged along a second direction from the light incident terminal towards the light emitting terminal. At least a part of the laser beam enters the beam diffusing module through the light incident terminal and emerges from the light emitting terminals after being reflected repeatedly by the first reflective plate and the second reflective plate to cause an M squared of the laser beam to be redistributed along a first direction. A beam generating system is also provided.

Abstract: A visual error calibration method configured to calibrate visual positioning errors of a laser processing apparatus is provided. The method includes: providing an alignment mark having at least one alignment point; locating a preset point of the alignment mark at a first preset position of a working area, and locating a preset image point at a preset position of the visible area; locating the alignment point at one of the second preset positions in the working area; adjusting parameters of a scanning module to locate an alignment image point at the preset position; relatively moving the alignment image point to positions of the visible area in sequence; recording the positions of the alignment image point in the visible area, the positions of the alignment point in the working area and the parameters of the scanning module, so as to produce an alignment table.

Abstract: A beam generating apparatus includes a laser light source, a speckle suppressing module, a light homogenizing module and a driving unit. The laser light source outputs a laser beam. The speckle suppressing module includes two biconic lenses and a diffuser. The first biconic lens is disposed on a transmission path of the laser beam. The diffuser is located on the transmission path of the laser beam between the first and second biconic lenses. The light homogenizing module is disposed on the transmission path of the laser beam from the second biconic lens. The driving unit drives the diffuser to move with respect to the laser beam so that the ratio of the M2 of the laser beam exiting from the second biconic lens in a first direction to the M2 thereof in a second direction is greater than 2, wherein the two directions are substantially perpendicular to each other.

Abstract: A beam generating apparatus includes a laser light source, a speckle suppressing module, a light homogenizing module and a driving unit. The laser light source outputs a laser beam. The speckle suppressing module includes two biconic lenses and a diffuser. The first biconic lens is disposed on a transmission path of the laser beam. The diffuser is located on the transmission path of the laser beam between the first and second biconic lenses. The light homogenizing module is disposed on the transmission path of the laser beam from the second biconic lens. The driving unit drives the diffuser to move with respect to the laser beam so that the ratio of the M2 of the laser beam exiting from the second biconic lens in a first direction to the M2 thereof in a second direction is greater than 2, wherein the two directions are substantially perpendicular to each other.

Abstract: A laser scanning device includes a laser output unit, a scanner, a light splitting unit, an imaging compensation unit, a detection unit, and a control unit. A scanning focusing unit included in the scanner focuses a laser beam emitted by the laser output unit to scan an object. A visible light beam received by the canning focusing unit is reflected by the light splitting unit and is incident into the imaging compensation unit. Next, the detection unit receives the visible light beam passing through the imaging compensation unit, and outputs a detection signal. The control unit adjusts the detection signal according to the wavelength of the visible light beam, the wavelength of the laser beam, the scanning focusing unit, and the imaging compensation unit. Therefore, the laser scanning device may compensate the aberration and the dispersion caused when the visible light beam passes through the scanning focusing unit.

Abstract: The present invention provides an apparatus and a system for improving depth of focus (DOF), wherein an optical lens for optical processing is actuated to vibrate whereby the DOF of the optical processing is increased due to the variation of focal point. In the embodiment of the present invention, an actuator is coupled to the optical lens for providing vibration energy wherein the optical lens is actuated by the vibration energy so as to vibrate on an optical axis thereof so as to increase the DOF during the optical processing, thereby improving the quality and efficiency of optical processing.