Abstract: A water-cooled heat dissipation module assembly capable of cooling a power module of a vehicle driving inverter system using a battery or fuel cell. The water-cooled heat dissipation module assembly includes a housing unit provided in the form of a housing having an opening portion at least partially opened at one side thereof. The housing unit and at least a part of a rim region of the cooling unit are made of a plastic material, and the housing unit and the cooling unit are joined to each other by plastic welding using a laser.

Abstract: A driver assistance system for vehicles, which is capable of preventing driver carelessness from causing a vehicle accident when a vehicle stops while traveling, includes a vehicle sensor unit configured to detect driver state data, a driver assistance unit operated to assist a driver when driver carelessness about vehicle driving is detected when a vehicle stops while traveling, and a control unit configured to identify whether the driver is careless based on the driver state data when the vehicle stops while traveling, and to operate the driver assistance unit when the driver carelessness is detected, preventing the vehicle from driving.

Abstract: A free motion headform (FMH) impact performance prediction device using artificial intelligence includes a data processing processor configured to generate an image by extracting a pre-processed test target image, generated by pre-processing test target design data, using a pre-trained model and generate a pre-processed test target distance value by pre-processing the test target design data. The FMH input performance prediction device also includes a machine learning processor configured to concatenate the image generated by extraction on the basis of the pre-trained model and the pre-processed test target distance value and to predict impact performance using a neural network in which parameters are updated by learning based on an image obtained by pre-processing existing design data and existing impact amount data corresponding to the existing design data. The FMH input performance prediction device further includes an output processor configured to output a value learned by the machine learning processor.

Abstract: An organic light emitting diode (OLED) includes an emissive layer with at least one emitting part includes at least one emitting material layer, a first electron transport layer and a second electron transport layer disposed sequentially between two facing electrodes, wherein the first electron transport layer includes a first electron transporting material of a benzimidazole-based compound substituted with at least one spiro-structured fluorenyl group and the second electron transport layer includes a second electron transporting material of a benzimidazole-based compound substituted with at least one anthracenyl group. The first electron transport including the first electron transport material with excellent thermal stability is disposed adjacently to the emitting material layer so that the OLED can maintain good luminescent intensity in an environment of high temperature and implement beneficial luminous properties.

Abstract: A touch sensing method includes: generating respective oscillation signals having a resonant frequency, the respective oscillation signals being changeable according to a plurality of touch inputs applied to a first touch switch unit and a second touch switch unit, formed in a housing of an electronic device; analyzing the applied plurality of touch inputs, based on a change in the resonant frequency of the generated oscillation signals; and discerning and sensing a type of a touch operation according to a pattern of the plurality of touch inputs, based on results of the analyzing of the applied plurality of touch inputs.

Abstract: There are provided a fan-out sensor package and an optical fingerprint sensor module including the same. The fan-out sensor package includes: a connection member having a 5 through-hole; an image sensor disposed in the through-hole of the connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the connection member, the image sensor, and 10 an optical lens; and a redistribution layer disposed on the connection member, the image sensor, and the optical lens. The connection member includes a wiring layer, and the redistribution layer electrically connects the wiring layer and the connection pads to each other.

Abstract: There are provided a fan-out sensor package and an optical fingerprint sensor module including the same. The fan-out sensor package includes: a connection member having a 5 through-hole; an image sensor disposed in the through-hole of the connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the connection member, the image sensor, and 10 an optical lens; and a redistribution layer disposed on the connection member, the image sensor, and the optical lens. The connection member includes a wiring layer, and the redistribution layer electrically connects the wiring layer and the connection pads to each other.

Abstract: There are provided a fan-out sensor package and an optical fingerprint sensor module including the same. The fan-out sensor package includes: a connection member having a through-hole; an image sensor disposed in the through-hole of the connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the connection member, the image sensor, and an optical lens; and a redistribution layer disposed on the connection member, the image sensor, and the optical lens. The connection member includes a wiring layer, and the redistribution layer electrically connects the wiring layer and the connection pads to each other.

Abstract: A fan-out component package includes: a core member having a through-hole and including wiring layers and one or more connection vias; one or more first electronic components disposed in the through-hole; a first encapsulant covering at least portions of the core member and the first electronic components and filling at least a portion of the through-hole; a connection member disposed on the core member and the first electronic components and including one or more redistribution layers electrically connected to the wiring layers and the first electronic components; one or more second electronic components disposed on the connection member and electrically connected to the redistribution layers; and a second encapsulant disposed on the connection member and encapsulating the second electronic components, wherein an upper surface of the connection member and a lower surface of the second encapsulant are spaced apart from each other by a predetermined interval.

Abstract: A fan-out fingerprint sensor package includes a first connection member having a through-hole, a fingerprint sensor disposed in the through-hole, an encapsulant encapsulating at least portions of the first connection member and the fingerprint sensor, and a second connection member disposed on the first connection member and an active surface of the fingerprint sensor. The first connection member includes a distribution layer. The second connection member includes a first insulating layer disposed on the distribution layer and the active surface, a redistribution layer disposed on the first insulating layer, a first via connecting the redistribution layer to a connection pad of the fingerprint sensor, and a second via connecting the redistribution layer to the distribution layer. The first via passes through the first insulating layer and at least a portion of the encapsulant, and the second via passes through the first insulating layer.

Abstract: A fan-out sensor package includes: an image sensor chip including an integrated circuit (IC) for an image sensor having a first surface having first connection pads disposed thereon, a second surface opposing the first surface and having second connection pads disposed thereon, and through-silicon-vias (TSVs) penetrating between the first surface and the second surface and electrically connecting the first and second connection pads to each other and an optical portion disposed on the first surface of the IC for an image sensor and having a plurality of lens layers; an encapsulant covering at least portions of the second surface of the IC for an image sensor; a redistribution layer disposed on the encapsulant; and vias penetrating through at least portions of the encapsulant and electrically connecting the redistribution layer and the second connection pads to each other.

Abstract: A fan-out fingerprint sensor package includes a first connection member having a through-hole, a fingerprint sensor disposed in the through-hole, an encapsulant encapsulating at least portions of the first connection member and the fingerprint sensor, and a second connection member disposed on the first connection member and an active surface of the fingerprint sensor. The first connection member includes a distribution layer. The second connection member includes a first insulating layer disposed on the distribution layer and the active surface, a redistribution layer disposed on the first insulating layer, a first via connecting the redistribution layer to a connection pad of the fingerprint sensor, and a second via connecting the redistribution layer to the distribution layer. The first via passes through the first insulating layer and at least a portion of the encapsulant, and the second via passes through the first insulating layer.

Abstract: There are provided a fan-out sensor package and an optical fingerprint sensor module including the same. The fan-out sensor package includes: a connection member having a through-hole; an image sensor disposed in the through-hole of the connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the connection member, the image sensor, and an optical lens; and a redistribution layer disposed on the connection member, the image sensor, and the optical lens. The connection member includes a wiring layer, and the redistribution layer electrically connects the wiring layer and the connection pads to each other.

Abstract: An amusement park management system may include at least one portable terminal apparatus including identification information and providing the identification information using a preset wireless communications scheme, a plurality of repeaters receiving the identification information provided from the portable terminal apparatus and detecting distance information of the portable terminal apparatus providing the identification information, and a server apparatus receiving the distance information provided from the plurality of repeaters and detecting coordinate information of the portable terminal apparatus providing the identification information.