Abstract: A semiconductor device includes: a substrate includes an active area; a first landing pad connected to the active area and disposed on the substrate; a second landing pad connected to the active area, and spaced apart from the first landing pad, wherein the second landing pad is disposed on the substrate; a first lower electrode disposed on the first landing pad and extending in a direction substantially perpendicular to the substrate; a second lower electrode disposed on the second landing pad and extending in the direction substantially perpendicular to the substrate; a dielectric layer extending along the first lower electrode and the second lower electrode; and an upper electrode disposed on the dielectric layer, wherein a first upper surface of the first landing pad is disposed below a second upper surface of the second landing pad with respect to a lower surface of the substrate.

Abstract: Disclosed are wood preforming devices for manufacturing a crash pad for a vehicle including a real wood sheet. A wood preforming device for manufacturing a crash pad for a vehicle includes a real wood sheet includes a lower press mold comprising a debossed portion provided on a portion on which a product is formed, and a support portion configured to support an upper press mold, in response to the lower press mold and the upper press mold pressing each other, the support portion having a protrusion for fixing a real wood sheet, the upper press mold having an embossed portion corresponding to the debossed portion of the lower press mold, and a movable core provided on the debossed portion of the lower press mold and being configured to guide the real wood sheet by moving upward from the debossed portion, in response to the upper press mold moving downward.

Abstract: A water-cooled heat dissipation module assembly capable of cooling a power module of a vehicle driving inverter system using a battery or fuel cell. The water-cooled heat dissipation module assembly includes a housing unit provided in the form of a housing having an opening portion at least partially opened at one side thereof. The housing unit and at least a part of a rim region of the cooling unit are made of a plastic material, and the housing unit and the cooling unit are joined to each other by plastic welding using a laser.

Abstract: A free motion headform (FMH) impact performance prediction device using artificial intelligence includes a data processing processor configured to generate an image by extracting a pre-processed test target image, generated by pre-processing test target design data, using a pre-trained model and generate a pre-processed test target distance value by pre-processing the test target design data. The FMH input performance prediction device also includes a machine learning processor configured to concatenate the image generated by extraction on the basis of the pre-trained model and the pre-processed test target distance value and to predict impact performance using a neural network in which parameters are updated by learning based on an image obtained by pre-processing existing design data and existing impact amount data corresponding to the existing design data. The FMH input performance prediction device further includes an output processor configured to output a value learned by the machine learning processor.

Abstract: An organic light emitting diode (OLED) includes an emissive layer with at least one emitting part includes at least one emitting material layer, a first electron transport layer and a second electron transport layer disposed sequentially between two facing electrodes, wherein the first electron transport layer includes a first electron transporting material of a benzimidazole-based compound substituted with at least one spiro-structured fluorenyl group and the second electron transport layer includes a second electron transporting material of a benzimidazole-based compound substituted with at least one anthracenyl group. The first electron transport including the first electron transport material with excellent thermal stability is disposed adjacently to the emitting material layer so that the OLED can maintain good luminescent intensity in an environment of high temperature and implement beneficial luminous properties.

Abstract: Provided is an etchant composition for a silicon nitride film, and more particularly, to an etchant composition with a high selectivity to a silicon nitride film, which is used to etch away a silicon nitride film in semiconductor process and which selectively has a high etching rate for the silicon nitride film compared to a silicon oxide film in a high temperature etch process, in which the etchant composition with the high selectivity selectively etches the silicon nitride film at a selectivity of 2000:1 or higher between the silicon nitride film and the silicon oxide film which are in a stack structure, and minimizes damages to the silicon oxide film and etching rate, and does not cause re-growth of the silicon oxide film over the process time.

Abstract: Provided is an etchant composition for a silicon nitride film, and more particularly, to an etchant composition with a high selectivity to a silicon nitride film, which is used to etch away a silicon nitride film in semiconductor process and which selectively has a high etching rate for the silicon nitride film compared to a silicon oxide film in a high temperature etch process, in which the etchant composition with the high selectivity selectively etches the silicon nitride film at a selectivity of 2000:1 or higher between the silicon nitride film and the silicon oxide film which are in a stack structure, and minimizes damages to the silicon oxide film and etching rate, and does not cause re-growth of the silicon oxide film over the process time.