Patents by Inventor MINKI JEON

MINKI JEON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE
    Publication number: 20240136311
    Abstract: Disclosed is a semiconductor package comprising lower and upper structure. The lower structure includes a first semiconductor substrate, first through vias vertically penetrating the first semiconductor substrate, first signal pads connected to the first through vias, first dummy pads between the first signal pads and electrically separated from the first through vias, and a first dielectric layer surrounding the first signal pads and the first dummy pads. The upper structure includes a second semiconductor substrate, second signal pads and second dummy pads, and a second dielectric layer surrounding the second signal pads and the second dummy pads. The first signal pad is in contact with one of the second signal pads. The first dummy pad is in contact with one of the second dummy pads. A first interval between the first dummy pads is 0.5 to 1.5 times a second interval between the first signal pads.
    Type: Application
    Filed: August 15, 2023
    Publication date: April 25, 2024
    Inventors: GWANGJAE JEON, MINKI KIM, Hyungchul SHIN, WON IL LEE, HYUEKJAE LEE, Enbin JO
  • Data transmitting and receiving apparatus and method, and solid state drive including the same
    Patent number: 8983379
    Abstract: A data transmitting and receiving apparatus includes a coil configured to transmit and receive data through inductive coupling, where a voltage drop across the coil constitutes a sensing signal. The apparatus further includes an input unit configured to generate transmission data and a replica signal in accordance with an input data signal, the transmission data being supplied to the coil. The apparatus still further includes a replica unit configured to generate a compensation signal in accordance with the replica signal, and an output unit configured to extract reception data from the sensing signal using the compensation signal.
    Type: Grant
    Filed: September 6, 2012
    Date of Patent: March 17, 2015
    Assignees: Samsung Electronics Co., Ltd., Industry-University Cooperation Foundation Hanyang University
    Inventors: Chul Bum Kim, Jangwoo Lee, Changsik Yoo, Minki Jeon
  • DATA TRANSMITTING AND RECEIVING APPARATUS AND METHOD, AND SOLID STATE DRIVE INCLUDING THE SAME
    Publication number: 20130143490
    Abstract: A data transmitting and receiving apparatus includes a coil configured to transmit and receive data through inductive coupling, where a voltage drop across the coil constitutes a sensing signal. The apparatus further includes an input unit configured to generate transmission data and a replica signal in accordance with an input data signal, the transmission data being supplied to the coil. The apparatus still further includes a replica unit configured to generate a compensation signal in accordance with the replica signal, and an output unit configured to extract reception data from the sensing signal using the compensation signal.
    Type: Application
    Filed: September 6, 2012
    Publication date: June 6, 2013
    Applicants: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIV, SAMSUNG ELECTRONICS CO., LTD.
    Inventors: CHUL BUM KIM, JANGWOO LEE, CHANGSIK YOO, MINKI JEON