Patents by Inventor Min Kong

Min Kong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7858993
    Abstract: Disclosed is an LED package. The LED package comprises a body comprising a cavity at one side thereof, at least one of lead frames comprising a bottom frame and a sidewall frame in the cavity, and a light emitting device electrically connected with the lead frames.
    Type: Grant
    Filed: April 17, 2008
    Date of Patent: December 28, 2010
    Assignee: LG Innotek Co., Ltd.
    Inventors: Sung Min Kong, Choong Youl Kim, Hee Seok Choi
  • Patent number: 7786554
    Abstract: The present invention relates to a stress-free lead frame (1) for a semiconductor. The stress-free lead frame (1) is provided with a stress-relief means (15) and an interlocking means (16) at the outer periphery. The stress-relief means (15) is capable of accommodating expansion and compression while the interlocking means (16) take care of shock and vibration during handling to thereby eliminate delamination of the lead frame (10).
    Type: Grant
    Filed: October 5, 2007
    Date of Patent: August 31, 2010
    Assignee: Carsem (M) Sdn. Bhd.
    Inventors: Lee Kock Huat, Chan Boon Meng, Cheong Mun Tuck, Lee Huan Sin, Phuah Kian Keung, Araventhan Eturajulu, Liow Eng Keng, Thum Min Kong, Chen Choon Hing
  • Publication number: 20100180562
    Abstract: Disclosed herein is a method for preparing a silicon carbide segment for a honeycomb ceramic filter as a diesel particulate filter (DPF) by conducting drying, perforating, plugging, and sintering processes for an extruded body cut into a segment having a predetermined size, wherein a sealant, which will melt and adhere to corners of cells in the sintering process, to seal the cell corners, is applied to partition walls of the segment at opposite ends of the segment in the plugging process.
    Type: Application
    Filed: October 27, 2007
    Publication date: July 22, 2010
    Inventors: Young Min Kong, Dae Gon Han
  • Patent number: 7753983
    Abstract: A ceramic filter and method for preparing the same. The method for preparing the ceramic filter according to the present invention is characterized in comprising the steps of: (a) coating firstly a ceramic green paper prepared by using a slurry solution comprising ceramic fiber of 0.1-10 mm length, with an aluminum silicate solution and drying the firstly coated paper; (b) coating secondly the dried ceramic green paper with an aluminum phosphate solution and drying the secondly coated paper; and (c) calcining the dried ceramic green paper obtained from the step (b). The ceramic filter according to the present invention has excellent mechanical strength since the bonding strength between ceramic fibers is very high, and shows good porosity, gas permeability, and efficiency for capturing microparticles since the pores between the ceramic fibers are less blocked, and thus can be very usefully applied to gas exhaustion system for automobile.
    Type: Grant
    Filed: July 17, 2006
    Date of Patent: July 13, 2010
    Assignee: LG Chem, Ltd.
    Inventors: Jong Sik Choi, Young Min Kong, Hoon Ahn, Sun Joo Kim, Seong Moon Jung, Dae Gon Han
  • Publication number: 20100171144
    Abstract: Provided is a light emitting device package. The light emitting device package comprises a housing, first and second lead frames, and a light emitting device. The housing comprises a front opening and side openings. The first and second lead frames pass through the housing to extend to an outside. A portion of each lead frame being exposed through the front opening. The light emitting device is in the front opening and electrically connected to the first and second lead frames. A protrusion protruding in a direction of the side opening is formed on an inner surface of the side opening.
    Type: Application
    Filed: June 19, 2008
    Publication date: July 8, 2010
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Sung Min Kong, Myung Gi Kim, Hyeong Seok Im
  • Patent number: 7741161
    Abstract: A method for making an IC package with transparent encapsulant includes providing a leadframe, where the leadframe includes a first die pad and a second die pad, disposing a first die on the first die pad and a second die on the second die pad, forming a cavity on the leadframe, where the cavity includes the first die pad and the second die pad, injecting an encapsulant material into the cavity and cutting the injected encapsulant material and the leadframe to form a first IC package and a second IC package. The encapsulant material is transparent for visible wavelengths. The injection of the encapsulant material is performed at an encapsulant temperature ranging from 140° C. to 160° C.
    Type: Grant
    Filed: June 30, 2008
    Date of Patent: June 22, 2010
    Assignee: Carsem (M) Sdn. Bhd.
    Inventors: Ah Lek Khor, Kock Huat Lee, Boon Meng Chan, Min Kong Thum, Hong Mun Tung, Mun Tuck Cheong
  • Publication number: 20100102345
    Abstract: Disclosed is an LED package. The LED package comprises a body comprising a cavity at one side thereof, at least one of lead frames comprising a bottom frame and a sidewall frame in the cavity, and a light emitting device electrically connected with the lead frames.
    Type: Application
    Filed: April 17, 2008
    Publication date: April 29, 2010
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Sung Min Kong, Choong Youl Kim, Hee Seok Choi
  • Publication number: 20100096644
    Abstract: Disclosed are a light emitting device package and a light emitting apparatus. The light emitting device package comprises a package body comprising a light emitting surface inclined at an oblique angle with respect to a bottom surface, a plurality of lead electrodes in the package body, and at least one light emitting device electrically connected to the lead electrodes.
    Type: Application
    Filed: September 15, 2009
    Publication date: April 22, 2010
    Inventor: SUNG MIN KONG
  • Publication number: 20090206729
    Abstract: Disclosed are phosphor, coating phosphor composition, a method for preparing the phosphor, and a light emitting device. A silicate-based phosphor is expressed in a chemical formula of (4-x-y-z)SrO.xBaO.zCaO.aMgO.2(SiO2).bM2O3: yEU, wherein M is at least one of Y, Ce, La, Nd, Gd, Tb, Yb or Lu, in which 0<x=3.95, 0<y=1, 0=z<3.95, x+y+z<4, 0<a<2, and 0<b<1.
    Type: Application
    Filed: December 27, 2007
    Publication date: August 20, 2009
    Applicants: LG INNOTEK CO., LTD, FORCE4 CORP.
    Inventors: Choong Youl Kim, Sung Min Kong, Hee Seok Choi, Seung Hyok Park, Ho Shin Yoon, Chang Hee Lee
  • Publication number: 20080286901
    Abstract: A method for making an IC package with transparent encapsulant includes providing a leadframe, where the leadframe includes a first die pad and a second die pad, disposing a first die on the first die pad and a second die on the second die pad, forming a cavity on the leadframe, where the cavity includes the first die pad and the second die pad, injecting an encapsulant material into the cavity and cutting the injected encapsulant material and the leadframe to form a first IC package and a second IC package. The encapsulant material is transparent for visible wavelengths. The injection of the encapsulant material is performed at an encapsulant temperature ranging from 140° C. to 160° C.
    Type: Application
    Filed: June 30, 2008
    Publication date: November 20, 2008
    Applicant: Carsem (M) Sdn. Bhd.
    Inventors: Ah Lek Khor, Kock Huat Lee, Boon Meng Chan, Min Kong Thum, Hong Mun Tung, Mun Tuck Cheong
  • Publication number: 20070262332
    Abstract: Embodiments of a light emitting device and a method for fabricating the same are provided. The light emitting device comprises a cavity and one or more light emitting elements. The cavity is formed to a depth of 450 ?m or less, and the light emitting elements are installed in the cavity. A fabricating method includes forming a package body having a cavity with a depth of 250 ?m to 450 ?m and at least one lead frame disposed at the bottom surface of the cavity, mounting at least one light emitting element on the lead frame, and molding a molding member in the cavity.
    Type: Application
    Filed: May 10, 2007
    Publication date: November 15, 2007
    Inventor: Sung Min Kong
  • Patent number: 7288833
    Abstract: The present invention relates to a stress-free lead frame (1) for a semiconductor. The stress-free lead frame (1) is provided with a stress-relief means (15) and an interlocking means (16) at the outer periphery. The stress-relief means (15) is capable of accommodating expansion and compression while the interlocking means (16) take care of shock and vibration during handling to thereby eliminate delamination of the lead frame (10).
    Type: Grant
    Filed: December 23, 2004
    Date of Patent: October 30, 2007
    Assignee: Carsem (M) Sdn. Bhd.
    Inventors: Lee Kock Huat, Chan Boon Meng, Cheong Mun Tuck, Lee Huan Sin, Phuah Kian Keung, Araventhan Eturajulu, Liow Eng Keng, Thum Min Kong, Chen Choon Hing
  • Patent number: 7212671
    Abstract: A method for extracting a shape variation descriptor from image sequence data for content-based image retrieval is disclosed. The method for extracting the shape variation descriptor from image sequence data for content-based image retrieval, image sequence data representing variation of object through a plurality of frames, the method includes the steps of creating a frame including variation information and shape information by accumulating the plurality of frames, the centroid of object regions in each frame aligned; and extracting shape descriptor from the frame.
    Type: Grant
    Filed: June 19, 2002
    Date of Patent: May 1, 2007
    Assignees: KT Corporation
    Inventors: Whoi-Yul Kim, Min-Seok Choi, Young-Min Kong
  • Patent number: D566664
    Type: Grant
    Filed: November 21, 2006
    Date of Patent: April 15, 2008
    Assignee: LG Innotek Co., Ltd.
    Inventor: Sung Min Kong
  • Patent number: D573549
    Type: Grant
    Filed: November 21, 2006
    Date of Patent: July 22, 2008
    Assignee: LG Innotek Co., Ltd.
    Inventor: Sung Min Kong
  • Patent number: D589909
    Type: Grant
    Filed: August 17, 2007
    Date of Patent: April 7, 2009
    Assignee: LG Innotek Co., Ltd.
    Inventor: Sung Min Kong
  • Patent number: D599306
    Type: Grant
    Filed: September 12, 2008
    Date of Patent: September 1, 2009
    Assignee: LG Innotek Co., Ltd.
    Inventor: Sung Min Kong
  • Patent number: D607853
    Type: Grant
    Filed: February 27, 2009
    Date of Patent: January 12, 2010
    Assignee: LG Innotek Co., Ltd.
    Inventor: Sung Min Kong
  • Patent number: D630785
    Type: Grant
    Filed: October 14, 2009
    Date of Patent: January 11, 2011
    Inventors: Min Kong Kim, Min Sup Yoon
  • Patent number: D631179
    Type: Grant
    Filed: October 14, 2009
    Date of Patent: January 18, 2011
    Inventors: Min Kong Kim, Min Sup Yoon