Abstract: The present invention provides a polishing pad. The polishing pad comprises a transparent part and a high molecular weight layer. The transparent part has an uneven side surface and the profile of the uneven side surface is selected from a group consisting of a serrated shape, a wavy shape and a toothed shape. The high molecular weight layer encircles the transparent part.

Abstract: A foamed plastic is cut to form a single-layer polishing pad having a desired rigidity and compressibility. A polishing surface of the polishing pad has a higher density than a mounting surface of the polishing pad. The polishing surface and the mounting surface may have different areas having different densities for achieving desired rigidity and compressibility property. Furthermore, methods of making such single-layer polishing pads are also disclosed.

Abstract: A foamed plastic is cut to form a single-layer polishing pad having a desired rigidity and compressibility. A polishing surface of the polishing pad has a higher density than a mounting surface of the polishing pad. The polishing surface and the mounting surface may have different areas having different densities for achieving desired rigidity and compressibility property. Furthermore, methods of making such single-layer polishing pads are also disclosed.

Abstract: A method of manufacturing a polishing pad is described. A mold having a mold cavity therein is provided. At least a strip is buried in the mold. A polymer foam material is injected into the mold cavity of the mold. The polymer foam material is cured to mold the polymer foam material into a molding polymer article. A mold release process is performed to obtain the molding polymer article. The strip on the molding article is removed to form a polishing pad having at least one groove thereon.

Abstract: A polishing pad having grooved window therein is provided. The polishing pad comprises a polishing layer and a window, wherein the polishing layer has at least one first groove therein and the window has at least one second groove therein. More particularly, the first groove is deeper than the second groove. The polishing pad having a grooved window therein has advantages of providing precise endpoint detection and thereby reducing or resolving defect problems.

Abstract: The present invention provides a method of fabricating a polishing pad having a detection window thereon. A mold having a cavity therein and a transparent thermosetting plastic part that is incompletely hardened are provided. The transparent thermosetting plastic part is disposed in the mold and a high molecular weight foam is injected into the cavity of the mold. The transparent thermosetting plastic part and the high molecular weight foam are hardened at the same time. After the step of demolding is performed, a polishing pad having a detection window thereon is formed. Moreover, the transparent thermosetting plastic part can be designed to have the central portion thicker than its peripheral portion for preventing deformation that is caused by the material difference of the detection window and other portions of the polishing pad.

Abstract: A foamed plastic is cut to form a single-layer polishing pad having a desired rigidity and compressibility. A polishing surface of the polishing pad has a higher density than a mounting surface of the polishing pad. The polishing surface and the mounting surface may have different areas having different densities for achieving desired rigidity and compressibility property. Furthermore, methods of making such single-layer polishing pads are also disclosed.

Abstract: A polishing pad having a polishing surface, a back surface and a sidewall is provided. The sidewall is connected to the polishing surface and the back surface. The polishing pad includes a polishing region and a region neighboring to the polishing region. Wherein, at least one stress buffer pattern is designed in the neighboring region. The stress buffer pattern is formed to buffer the stress created during a polishing process to prevent the region from being protruded and thus prevent the surface of the region, once protruded, from rubbing against the wafer carrier to generate particles, so that contamination of the surface of the wafers can be avoided. On the other hand, at least one cambered surface can be designed on the sidewall of the polishing pad to prevent the sidewall from rubbing against the wafer carrier to generate particles, so that contamination can be avoided.

Abstract: A method of manufacturing a polishing pad is described. A mold having a mold cavity therein is provided. At least a strip is buried in the mold. A polymer foam material is injected into the mold cavity of the mold. The polymer foam material is cured to mold the polymer foam material into a molding polymer article. A mold release process is performed to obtain the molding polymer article. The strip on the molding article is removed to form a polishing pad having at least one groove thereon.

Abstract: The present invention provides a polishing pad. The polishing pad comprises a transparent part and a high molecular weight layer. The transparent part has an uneven side surface and the profile of the uneven side surface is selected from a group consisting of a serrated shape, a wavy shape and a toothed shape. The high molecular weight layer encircles the transparent part.

Abstract: The present invention provides a method of fabricating a polishing pad having a detection window thereon. A mold having a cavity therein and a transparent thermosetting plastic part that is incompletely hardened are provided. The transparent thermosetting plastic part is disposed in the mold and a high molecular weight foam is injected into the cavity of the mold. The transparent thermosetting plastic part and the high molecular weight foam are hardened at the same time. After the step of demolding is performed, a polishing pad having a detection window thereon is formed. Moreover, the transparent thermosetting plastic part can be designed to have the central portion thicker than its peripheral portion for preventing deformation that is caused by the material difference of the detection window and other portions of the polishing pad.

Abstract: A foamed plastic is cut to form a single-layer polishing pad having a desired rigidity and compressibility. A polishing surface of the polishing pad has a higher density than a mounting surface of the polishing pad. The polishing surface and the mounting surface may have different areas having different densities for achieving desired rigidity and compressibility property. Furthermore, methods of making such single-layer polishing pads are also disclosed.

Abstract: A method of manufacturing a polishing pad is described. A mold having a mold cavity therein is provided. At least a strip is buried in the mold. A polymer foam material is injected into the mold cavity of the mold. The polymer foam material is cured to mold the polymer foam material into a molding polymer article. A mold release process is performed to obtain the molding polymer article. The strip on the molding article is removed to form a polishing pad having at least one groove thereon.

Abstract: A foamed plastic is cut to form a single-layer polishing pad having a desired rigidity and compressibility. A polishing surface of the polishing pad has a higher density than a mounting surface of the polishing pad. The polishing surface and the mounting surface may have different areas having different densities for achieving desired rigidity and compressibility property. Furthermore, methods of making such single-layer polishing pads are also disclosed.

Abstract: A polishing pad having grooved window therein is provided. The polishing pad comprises a polishing layer and a window, wherein the polishing layer has at least one first groove therein and the window has at least one second groove therein. More particularly, the first groove is deeper than the second groove. The polishing pad having a grooved window therein has advantages of providing precise endpoint detection and thereby reducing or resolving defect problems.

Abstract: A polishing pad having a polishing surface, a back surface and a sidewall is provided. The sidewall is connected to the polishing surface and the back surface. The polishing pad includes a polishing region and a region neighboring to the polishing region. Wherein, at least one stress buffer pattern is designed in the neighboring region. The stress buffer pattern is formed to buffer the stress created during a polishing process to prevent the region from being protruded and thus prevent the surface of the region, once protruded, from rubbing against the wafer carrier to generate particles, so that contamination of the surface of the wafers can be avoided. On the other hand, at least one cambered surface can be designed on the sidewall of the polishing pad to prevent the sidewall from rubbing against the wafer carrier to generate particles, so that contamination can be avoided.

Abstract: The present invention provides a method of fabricating a polishing pad having a detection window thereon. A mold having a cavity therein and a transparent thermosetting plastic part that is incompletely hardened are provided. The transparent thermosetting plastic part is disposed in the mold and a high molecular weight foam is injected into the cavity of the mold. The transparent thermosetting plastic part and the high molecular weight foam are hardened at the same time. After the step of demolding is performed, a polishing pad having a detection window thereon is formed. Moreover, the transparent thermosetting plastic part can be designed to have the central portion thicker than its peripheral portion for preventing deformation that is caused by the material difference of the detection window and other portions of the polishing pad.

Abstract: A method of manufacturing a polishing pad is described. A mold having a mold cavity therein is provided. At least a strip is buried in the mold. A polymer foam material is injected into the mold cavity of the mold. The polymer foam material is cured to mold the polymer foam material into a molding polymer article. A mold release process is performed to obtain the molding polymer article. The strip on the molding article is removed to form a polishing pad having at least one groove thereon.

Abstract: A method for manufacturing a PU (polyurethane) polishing pad is provided. Resins containing active hydrogen functional groups such as polyol resins, polyamine resins, and polythiol resins, and polyisocyanate resins containing —NCO functional groups are mixed to form a foamed PU polishing pad with excellent polishing properties by reaction injection-molding under high pressure, low temperature and auxiliary gas-adding. The PU polishing pad in accompany with an abrasive slurry can be widely used to polish high-level products such as wafers and optical glass.