Abstract: Disclosed is a medical intervention apparatus. The medical intervention apparatus includes a needle rotation unit configured to include a first needle rotation member, a second needle rotation member that is disposed to be separated from the first needle rotation member, and a first driver that drives the first and second needle rotation members to rectilinearly move in opposite directions and a needle insertion unit configured to insert a needle, which is inserted between the first needle rotation member and the second needle rotation member, into a target.

Abstract: Disclosed is a medical intervention apparatus. The medical intervention apparatus includes a needle rotation unit configured to include a first needle rotation member, a second needle rotation member that is disposed to be separated from the first needle rotation member, and a first driver that drives the first and second needle rotation members to rectilinearly move in opposite directions and a needle insertion unit configured to insert a needle, which is inserted between the first needle rotation member and the second needle rotation member, into a target.

Abstract: Disclosed is a medical intervention apparatus. The medical intervention apparatus includes a needle rotation unit configured to include a first needle rotation member, a second needle rotation member that is disposed to be separated from the first needle rotation member, and a first driver that drives the first and second needle rotation members to rectilinearly move in opposite directions and a needle insertion unit configured to insert a needle, which is inserted between the first needle rotation member and the second needle rotation member, into a target.

Abstract: Disclosed is a medical intervention apparatus. The medical intervention apparatus includes a needle rotation unit configured to include a first needle rotation member, a second needle rotation member that is disposed to be separated from the first needle rotation member, and a first driver that drives the first and second needle rotation members to rectilinearly move in opposite directions and a needle insertion unit configured to insert a needle, which is inserted between the first needle rotation member and the second needle rotation member, into a target.

Abstract: In one embodiment, a miniaturized solid-state imaging apparatus includes a body having a cavity for mounting a semiconductor chip therein. The body has an overhanging portion extending toward the cavity. Further, a lead is disposed within the body. The lead has one end exposed through a top surface of the body and the other end exposed through a bottom surface of the body for electrical connection thereof.

Abstract: In one embodiment, a miniaturized solid-state imaging apparatus includes a body having a cavity for mounting a semiconductor chip therein. The body has an overhanging portion extending toward the cavity. Further, a lead is disposed within the body. The lead has one end exposed through a top surface of the body and the other end exposed through a bottom surface of the body for electrical connection thereof.

Abstract: In one embodiment, a miniaturized solid-state imaging apparatus includes a body having a cavity for mounting a semiconductor chip therein. The body has an overhanging portion extending toward the cavity. Further, a lead is disposed within the body. The lead has one end exposed through a top surface of the body and the other end exposed through a bottom surface of the body for electrical connection thereof.

Abstract: An image pickup device and a manufacturing method thereof. A digital signal processing (DSP) chip is attached on a first surface of a substrate. A CMOS image sensor (CIS) chip is attached on an active surface of the DSP chip. The DSP chip and the CIS chip may be electrically connected to the substrate by wire bonding. A housing kit having a lens configured to transmit an image to the DSP chip may be mounted on the substrate. An inner space between the housing kit and the substrate is not molded, thereby simplifying a manufacturing process and providing a thinner and/or lighter image pickup device.

Abstract: In one embodiment, a miniaturized solid-state imaging apparatus includes a body having a cavity for mounting a semiconductor chip therein. The body has an overhanging portion extending toward the cavity. Further, a lead is disposed within the body. The lead has one end exposed through a top surface of the body and the other end exposed through a bottom surface of the body for electrical connection thereof.

Abstract: An image pickup device and a manufacturing method thereof. A digital signal processing (DSP) chip is attached on a first surface of a substrate. A CMOS image sensor (CIS) chip is attached on an active surface of the DSP chip. The DSP chip and the CIS chip may be electrically connected to the substrate by wire bonding. A housing kit having a lens configured to transmit an image to the DSP chip may be mounted on the substrate. An inner space between the housing kit and the substrate is not molded, thereby simplifying a manufacturing process and providing a thinner and/or lighter image pickup device.

Abstract: A wafer level chip package has a redistrubution substrate, at least one lower semiconductor chip stacked on the redisctribution substrate, and an uppermost semiconductor chip. The redistribution substrate has a redistribution layer and substrate pads connected to the redistribution layer. The lower semiconductor chip is stacked on the redistribution layer and may have through holes for partially exposing the redistribution layer, the through holes corresponding to the substrate pads, and having conductive filling material filling the through holes. The uppermost semiconductor chip may have the same elements as the lower semiconductor chip, and may be flip chip bonded to the through holes. The package may further have a filling layer for filling areas between chips, a metal lid for coating most of the external surfaces, and external connection terminals formed on and electrically connected to the exposed redistribution layer from the first dielectric layer of the redistribution substrate.

Abstract: A wafer level chip package has a redistrubution substrate, at least one lower semiconductor chip stacked on the redisctribution substrate, and an uppermost semiconductor chip. The redistribution substrate has a redistribution layer and substrate pads connected to the redistribution layer. The lower semiconductor chip is stacked on the redistribution layer and may have through holes for partially exposing the redistribution layer, the through holes corresponding to the substrate pads, and having conductive filling material filling the through holes. The uppermost semiconductor chip may have the same elements as the lower semiconductor chip, and may be flip chip bonded to the through holes. The package may further have a filling layer for filling areas between chips, a metal lid for coating most of the external surfaces, and external connection terminals formed on and electrically connected to the exposed redistribution layer from the first dielectric layer of the redistribution substrate.

Abstract: The present invention is directed to a semiconductor chip package that can effectively remove heat from a semiconductor chip, and a method of fabricating the package. In accordance with an embodiment of the invention, the package includes: a substrate having bonding pads; a semiconductor chip having conductive bumps on the front side thereof, the conductive bump contacting the bonding pads; a heat slug bonded to the backside of the semiconductor chip; and a solder film which makes the bonding between the heat slug and the backside of the semiconductor chip. The heat slug can be shaped such that a portion of the heat slug is attached to the substrate by an adhesive.