Patents by Inventor Min Kyoun Kim
Min Kyoun Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210284882Abstract: The present application relates to an epoxy-based adhesive composition, which may include (a) one or more epoxy resins, (b) a urethane resin having a weight average molecular weight (Mw) of 30,000 or less, and having a polytetrahydrofuran unit, (c) a core-shell rubber in the form of secondary particles in which two or more core-shell rubbers in the form of primary particles are aggregated and (d) one or more epoxy curing agents. The adhesive composition of the present application can provide excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.Type: ApplicationFiled: July 25, 2019Publication date: September 16, 2021Applicant: LG Chem, Ltd.Inventors: Min Jin Ko, Jae Ho Jung, Min A Yu, Min Kyoun Kim, Byung Kyu Cho, Taek Yong Lee, Dong Yong Kim
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Publication number: 20210284885Abstract: An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.Type: ApplicationFiled: July 25, 2019Publication date: September 16, 2021Applicant: LG Chem, Ltd.Inventors: Min Jin Ko, Jae Ho Jung, Min A Yu, Min Kyoun Kim, Byung Kyu Cho, Taek Yong Lee, Dong Yong Kim
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Publication number: 20210284884Abstract: An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.Type: ApplicationFiled: July 25, 2019Publication date: September 16, 2021Applicant: LG Chem, Ltd.Inventors: Min Jin Ko, Jae Ho Jung, Min A Yu, Min Kyoun Kim, Byung Kyu Cho, Taek Yong Lee, Dong Yong Kim
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Publication number: 20210269689Abstract: An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesive strength and impact strength uniformly over a wide temperature range.Type: ApplicationFiled: July 25, 2019Publication date: September 2, 2021Applicant: LG Chem, Ltd.Inventors: Min Jin Ko, Jae Ho Jung, Min A Yu, Min Kyoun Kim, Byung Kyu Cho, Taek Yong Lee, Dong Yong Kim
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Publication number: 20210238462Abstract: An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesive strength and impact strength uniformly over a wide temperature range. In addition, the adhesive composition of the present application may have a level of viscosity capable of ensuring excellent processability.Type: ApplicationFiled: July 25, 2019Publication date: August 5, 2021Applicant: LG Chem, Ltd.Inventors: Min Jin Ko, Jae Ho Jung, Min A Yu, Min Kyoun Kim, Byung Kyu Cho, Taek Yong Lee, Dong Yong Kim
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Patent number: 10090219Abstract: The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.Type: GrantFiled: January 28, 2015Date of Patent: October 2, 2018Assignee: LG CHEM, LTD.Inventors: Min Jin Ko, Kyung Mi Kim, Jae Ho Jung, Bum Gyu Choi, Min Kyoun Kim
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Patent number: 9870970Abstract: The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.Type: GrantFiled: January 28, 2015Date of Patent: January 16, 2018Assignee: LG CHEM, LTD.Inventors: Min Jin Ko, Kyung Mi Kim, Jae Ho Jung, Bum Gyu Choi, Min Kyoun Kim
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Patent number: 9837329Abstract: The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.Type: GrantFiled: January 28, 2015Date of Patent: December 5, 2017Assignee: LG CHEM, LTD.Inventors: Min Jin Ko, Kyung Mi Kim, Jae Ho Jung, Bum Gyu Choi, Min Kyoun Kim
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Patent number: 9805999Abstract: The present application relates to a cured product and the use thereof. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. The cured product has excellent transparency, moisture resistance, mechanical properties, and cracking resistance, etc. The cured product, for example, may be applied as an encapsulant or an adhesive material of a semiconductor device to provide a device having high long-term reliability.Type: GrantFiled: January 28, 2015Date of Patent: October 31, 2017Assignee: LG CHEM, LTD.Inventors: Min Jin Ko, Kyung Mi Kim, Jae Ho Jung, Bum Gyu Choi, Min Kyoun Kim
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Patent number: 9624345Abstract: Provided are a curable composition and its use. The curable composition exhibits excellent processability and workability before curing, and excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability, and adhesiveness after curing. In addition, the curable composition may provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions, and does not causing whitening and surface stickiness.Type: GrantFiled: January 27, 2015Date of Patent: April 18, 2017Assignee: LG CHEM, LTD.Inventors: Min Jin Ko, Bum Gyu Choi, Jae Ho Jung, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
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Patent number: 9598542Abstract: Provided is a curable composition and its use. The curable composition may exhibit excellent processibility and workability. The curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property after curing. The curable composition may provide a cured product exhibiting stable durability and reliability under severe conditions for a long time and having no whitening and surface stickiness.Type: GrantFiled: December 18, 2013Date of Patent: March 21, 2017Assignee: LG CHEM, LTD.Inventors: Bum Gyu Choi, Min Jin Ko, Myung Sun Moon, Jae Ho Jung, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
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Publication number: 20160336248Abstract: The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.Type: ApplicationFiled: January 28, 2015Publication date: November 17, 2016Applicant: LG CHEM, Ltd.Inventors: Min Jin KO, Kyung Mi KIM, Jae Ho JUNG, Bum Gyu CHOI, Min Kyoun KIM
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Publication number: 20160322546Abstract: The present application relates to a cured product and the use thereof. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. The cured product has excellent transparency, moisture resistance, mechanical properties, and cracking resistance, etc. The cured product, for example, may be applied as an encapsulant or an adhesive material of a semiconductor device to provide a device having high long-term reliability.Type: ApplicationFiled: January 28, 2015Publication date: November 3, 2016Applicant: LG CHEM, LTD.Inventors: Min Jin KO, Kyung Mi KIM, Jae Ho JUNG, Bum Gyu CHOI, Min Kyoun KIM
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Publication number: 20160315026Abstract: The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.Type: ApplicationFiled: January 28, 2015Publication date: October 27, 2016Applicant: LG CHEM, LTD.Inventors: Min Jin KO, Kyung Mi KIM, Jae Ho JUNG, Bum Gyu CHOI, Min Kyoun KIM
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Patent number: 9455210Abstract: Provided are a curable composition and its use. The curable composition can exhibit excellent processibility and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability, and that does not cause whitening and surface stickiness even under harsh conditions.Type: GrantFiled: July 29, 2013Date of Patent: September 27, 2016Assignee: LG CHEM, LTD.Inventors: Min Jin Ko, Bum Gyu Choi, Jae Ho Jung, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
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Publication number: 20160257788Abstract: The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.Type: ApplicationFiled: January 28, 2015Publication date: September 8, 2016Applicant: LG CHEM, LTD.Inventors: Min Jin KO, Kyung Mi KIM, Jae Ho JUNG, Bum Gyu CHOI, Min Kyoun KIM
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Patent number: 9410018Abstract: The present application relates to a curable composition. A curable composition may be provided; which shows excellent processability and workability; which shows excellent light extraction efficiency, crack resistance, hardness, thermal shock resistance and adhesive strength after curing; and which has excellent reliability and long-term reliability under high-temperature and/or high-moisture conditions. Also, turbidity and surface stickiness may be prevented in the cured product.Type: GrantFiled: December 27, 2013Date of Patent: August 9, 2016Assignee: LG CHEM, LTD.Inventors: Min Jin Ko, Myung Sun Moon, Jae Ho Jung, Bum Gyu Choi, Dae Ho Kang, Min Kyoun Kim
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Patent number: 9379296Abstract: A silicone resin is provided. The silicone resin may be effectively used to encapsulate a semiconductor element, for example, a light-emitting element of a light-emitting diode.Type: GrantFiled: December 30, 2013Date of Patent: June 28, 2016Assignee: LG Chem, Ltd.Inventors: Min Jin Ko, Myung Sun Moon, Jae Ho Jung, Bum Gyu Choi, Dae Ho Kang, Min Kyoun Kim
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Patent number: 9362468Abstract: Provided are a curable composition and its use. The curable composition having excellent processability, workability, heat resistance, and light resistance, and having no problem of discoloring despite using for a long time may be provided. The curable composition which may scatter light and disperse linearity of light when used as an encapsulant of an optical semiconductor such as an LED may be provided.Type: GrantFiled: January 27, 2015Date of Patent: June 7, 2016Assignee: LG CHEM, LTD.Inventors: Min Jin Ko, Jae Ho Jung, Bum Gyu Choi, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
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Patent number: 9355926Abstract: Provided are a curable composition and its use. The curable composition can exhibit excellent processability and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability, and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions and that does not cause whitening or surface stickiness.Type: GrantFiled: September 18, 2013Date of Patent: May 31, 2016Assignee: LG CHEM, LTD.Inventors: Min Jin Ko, Bum Gyu Choi, Jae Ho Jung, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho