Patents by Inventor Min Kyoung Kwon

Min Kyoung Kwon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9956354
    Abstract: Disclosed is a nozzle device and a minimally invasive injection device, and the nozzle device for a minimally invasive injection device according to an exemplary embodiment includes an outlet to generate a microjet of a liquid, and an injection part of a micro-scale size connected to the outlet and adapted to be inserted into a skin tissue to a preset depth.
    Type: Grant
    Filed: July 12, 2013
    Date of Patent: May 1, 2018
    Assignee: AMOREPACIFIC CORPORATION
    Inventors: Jin Woo Park, Min Kyoung Kwon, Ji Hye Jang, Joon Ho Bae, Jin Kyu Choi
  • Publication number: 20150157809
    Abstract: Disclosed is a nozzle device and a minimally invasive injection device, and the nozzle device for a minimally invasive injection device according to an exemplary embodiment includes an outlet to generate a microjet of a liquid, and an injection part of a micro-scale size connected to the outlet and adapted to be inserted into a skin tissue to a preset depth.
    Type: Application
    Filed: July 12, 2013
    Publication date: June 11, 2015
    Applicant: AMOREPACIFIC CORPORATION
    Inventors: Jin Woo Park, Min Kyoung Kwon, Ji Hye Jang, Joon Ho Bae, Jin Kyu Choi
  • Patent number: 7570199
    Abstract: There is provided a device and method for detecting an overlap of pulse signals, capable of easily detecting a point where reference and delayed pulse signals overlap each other, and an apparatus for estimating a distance using the same. The device for detecting an overlap of pulse signals, the device detecting a point where first and second pulse signals having different frequencies begin to overlap each other, the device including: a duty adjustor generating a third pulse signal by increasing a duty of the second pulse signal; a pulse signal calculator multiplying the first and second pulse signals by the third pulse signal, respectively and adding respective results together to output a signal; and an overlap determiner determining a middle of a pulse with a greatest width in the signal outputted from the pulse signal calculator as a point where the first and second pulse signals overlap each other.
    Type: Grant
    Filed: October 26, 2007
    Date of Patent: August 4, 2009
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang Yub Lee, Chang Soo Yang, Min Kyoung Kwon, Seung Heon Han
  • Patent number: 7149072
    Abstract: Disclosed herein is a multilayered chip capacitor array, including a capacitor body having a plurality of dielectric layers, a plurality of pairs of first and second inner electrodes which are formed on the plurality of dielectric layers such that one electrode of one pair of inner electrodes faces the other electrode of the one pair of inner electrodes with one of the plurality of dielectric layers interposed therebetween, at least one first outer terminal and a plurality of second outer terminals formed on at least one surface of a top surface and a bottom surface of the capacitor body, and at least one first conductive via and a plurality of second conductive vias formed in a stacking direction of the capacitor body and connected to the first outer terminal and the second outer terminal, respectively.
    Type: Grant
    Filed: November 1, 2005
    Date of Patent: December 12, 2006
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Byoung Hwa Lee, Hiroki Sato, Chang Hoon Shim, Sang Soo Park, Hae Suk Chung, Dong Seok Park, Min Cheol Park, Hyun Ju Yi, Min Kyoung Kwon, Seung Heon Han
  • Patent number: 7035079
    Abstract: The present invention provides an MLCC and an MLCC array. The MLCC has desirably low ESL properties by forming the first and second internal electrodes to be spaced apart from each other on the same dielectric layer while overlapping with other first and second internal electrodes on the neighboring dielectric layers, and connecting the first and second internal electrodes to the external terminals provided on the top surface or the bottom surface of the capacitor body through conductive via holes formed in the capacitor body in a stacking direction of the capacitor body.
    Type: Grant
    Filed: October 11, 2005
    Date of Patent: April 25, 2006
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang Soo Park, Dong Seok Park, Byoung Hwa Lee, Min Cheol Park, Hyun Ju Yi, Min Kyoung Kwon, Hae Suk Chung, Chang Hoon Shim, Seung Heon Han