Abstract: An apparatus for detecting shaking of stroke of a linear compressor and a method are provided. A linear compressor mis-operates due to change in an external voltage or noise because the shaking of the stroke is detected by the amounts of change in the stroke or current.

Abstract: In an apparatus and a method for controlling a compressor, by setting a stroke reference value so as to be smaller than a maximum stroke value in a maximum load state and operating the reciprocating compressor stably, damage of a reciprocating compressor can be prevented, a cost in a motor design can be reduced, and a size of a motor can be decreased in designing of the motor.

Abstract: Disclosed is a circuit for driving a linear compressor enabling to reduce a cost in detecting voltage and current applied to a linear compressor by decreasing he number of precision resistors.

Abstract: An apparatus and method for determining a washing pattern of a direct drive inverter-type washing machine.

Abstract: A one system module in which a ceramic PCB and an epoxy PCB are disposed inside a module body and a power element and a signal element are respectively mounted at the upper portion of each PCB, wherein a groove is made at the lower side surface and at the middle side surface of the module body to support the ceramic PCB and the epoxy PCB formed in a two-story structure, and a power pin for receiving a power signal from an external source is mounted on the ceramic PCB and a signal pin for receiving various signals from an external source is mounted on the epoxy PCB. With this one system module, the ceramic PCB and the epoxy PCB can be firmly supported by the groove made on the module body. And, since the power pin and the signal pin are separately disposed on the two PCBs, use of the socket is reduced, so that the area utility of the PCB is increased as well as acquiring a compact module.

Abstract: Disclosed is a single module system for an electric/electronic appliance. The single module system comprises a first module section having a first PCB which is made of a ceramic or metal-based material and exothermic devices which are located on the first PCB; and a second module section having a second PCB which is made of an epoxy or phenol-based material and non-exothermic devices which are located on the second PCB.