Abstract: A multi-slot die coater includes a first slot and a second slot to extrude and coat a coating solution on a surface of a continuously moving substrate through at least one of the first slot or the second slot, and includes a first outer die block; an intermediate die block positioned on the first outer die block such that the first slot is formed between the intermediate die block and the first outer die block; and a second outer die block positioned on the intermediate die block such that the second slot is formed between the second outer die block and the intermediate die block, wherein the die-coater includes contact surfaces between the first outer die block, the intermediate die block and the second die block that are inclined relative to a first plane and a fastener is fastened substantially perpendicular to one of the inclined contact surfaces.

Abstract: A dual slot die coater according to the present disclosure is a dual slot die coater including a lower slot and an upper slot, for extrusion coating of an electrode active material slurry on a surface of a continuously moving current collector through at least one of the lower slot or the upper slot, and the dual slot die coater includes a lower plate, an intermediate plate positioned on the lower plate and an upper plate positioned on the intermediate plate, the lower slot being formed between the lower plate and the intermediate plate, and the upper slot being formed between the intermediate plate and the upper plate, wherein the lower plate, the intermediate plate and the upper plate have a lower die lip, an intermediate die lip and an upper die lip, each forming an front end with respect to the current collector, respectively, and a thickness of the lower die lip is larger than a thickness of the upper die lip and a thickness of the intermediate die lip.

Abstract: Disclosed is a method for producing an anti-adhesion film. The method for producing an anti-adhesion film may include: a discharge step of separately electrospinning a biodegradable polymer solution filled in a first syringe and a crosslinking agent solution filled in a second syringe; and a film forming step of forming an anti-adhesion film by crosslinking of the biodegradable polymer by contact between the biodegradable polymer solution discharged in the form of fibers in the discharge step and the crosslinking agent solution discharged in the form of droplets in the discharge step.

Abstract: Provided is a method of preparing L-homoserine, the method including contacting an L-homoserine derivative with a solid acid catalyst.

Abstract: Disclosed are a Mn—Bi—Sb-based magnetic substance and a method of manufacturing the same. Particularly, the Mn—Bi—Sb-based magnetic substance includes Mn and Bi forming a hexagonal crystal structure, and a portion of Bi elements forming the crystal structure is substituted with Sb so as to improve the magnetic properties thereof.

Abstract: There is provided a dual slot die coater that is easy to adjust a coating gap and can control a widthwise deviation of coating gap. The dual slot die coater of the present disclosure includes a plate member including a lower plate, an intermediate plate positioned on the lower plate and an upper plate positioned on the intermediate plate, wherein a lower slot is formed between the intermediate plate and the lower plate, and an upper slot is formed between the upper plate and the intermediate plate; a block provided on a rear surface of the plate member, wherein the block can be separated from or coupled to the plate member, or integrally formed with at least one plate of the plate member; a first bolt to push at least one plate of the plate member from the block as the first bolt passes through the block; and a second bolt to pull the at least one plate of the plate member toward the block as the second bolt passes through the block.

Abstract: A multi-slot die coater includes a first slot and a second slot to extrude and coat a coating solution on a surface of a continuously moving substrate through at least one of the first slot or the second slot, and includes a first outer die block; an intermediate die block positioned on the first outer die block such that the first slot is formed between the intermediate die block and the first outer die block; and a second outer die block positioned on the intermediate die block such that the second slot is formed between the second outer die block and the intermediate die block, wherein the die-coater includes contact surfaces between the first outer die block, the intermediate die block and the second die block that are inclined relative to a first plane and a fastener is fastened substantially perpendicular to one of the inclined contact surfaces.

Abstract: The present disclosure provides a multi-slot die coater which fastens a contact surface between die blocks using bolts whose position is set to minimize the loading deviation. According to the present disclosure, it is possible to reduce deformation or twist of the die block having structural vulnerability, and thereby uniformly form a coating layer, in particular, an electrode active material layer at a desired thickness, and it is possible to coat at least two types of electrode active material slurries at the same time, thereby achieving high performance and productivity.

Abstract: A multi-slot die coater has improved a deviation in a width direction of a slot gap caused by a structural feature including a thin die block. The multi-slot die coater including a lower slot and an upper slot includes a lower die block; an intermediate die block disposed on the lower die block to form the lower slot therebetween; and an upper die block disposed on the intermediate die block to form the upper slot therebetween, wherein the intermediate die block comprises a manifold that accommodates a coating solution, and is communicatively connected to the upper slot, and wherein a shortest distance from distances from any points on a bottom surface of the manifold to any points on the second surface is equal to or greater than 10 mm.

Abstract: Provided is a method of preparing L-homoserine, the method including contacting an L-homoserine derivative with a solid acid catalyst.

Abstract: A semiconductor package includes a first semiconductor chip and a second semiconductor chip which are disposed side-by-side on a surface of a package substrate. A heat insulation wall is disposed between the first semiconductor chip and the second semiconductor chip. The heat insulation wall thermally isolates the first semiconductor chip from the second semiconductor chip.

Abstract: Provided is a preparation method of magnetic nanostructures. The preparation method of magnetic nanostructures may comprise the steps of: preparing a source solution comprising a first precursor comprising a rare earth element, a second precursor comprising a transition metal element, and a third precursor comprising Cu; electrospinning the source solution to form preliminary magnetic nano-structures comprising a rare-earth element oxide, a transition metal oxide, and Cu oxide; and reducing the preliminary magnetic nano-structures to produce magnetic nano-structures comprising an alloy composition comprising the rare-earth element, the transition metal element, and the Cu.

Abstract: Provided is a method for manufacturing a magnetic nano-structure. The method for manufacturing a magnetic nano-structure may comprise the steps of: preparing a source solution containing a first precursor including a rare-earth element, a second precursor including a transition metal element, and a third precursor including Fe; electrospinning the source solution to form a preliminary magnetic nano-structure containing a rare-earth oxide, a transition metal oxide, and a Fe oxide; and reducing the preliminary magnetic micro-structure to manufacture a magnetic nano-structure containing an alloy composition of the rare-earth element, the transition metal element, and the Fe.

Abstract: The present disclosure relates to a preparation method of a methionine-metal chelate, and the methionine-metal chelate, which is prepared by first reacting Ca(OH)2 and methionine and adding metal chloride salts, can be used as feeds and feed additives.

Abstract: Disclosed are a Mn—Bi—Sb-based magnetic substance and a method of manufacturing the same. Particularly, the Mn—Bi—Sb-based magnetic substance includes Mn and Bi forming a hexagonal crystal structure, and a portion of Bi elements forming the crystal structure is substituted with Sb so as to improve the magnetic properties thereof.

Abstract: A semiconductor package includes a plurality of stacked first semiconductor chips disposed over a substrate. At least a portion of the plurality of stacked first semiconductor chips is encapsulated in a first mold layer. The semiconductor package also includes a plurality of stacked second semiconductor chips disposed over the topmost chip of the stacked first semiconductor chips and the first mold layer. The semiconductor package also includes a third semiconductor chip disposed over the first mold layer and adjacent to the stacked second semiconductor chips. At least a portion of the third semiconductor chip overlaps with a portion of one or more of the stacked second semiconductor chips.

Abstract: The present disclosure relates to a preparation method of a methionine-metal chelate, and the methionine-metal chelate, which is prepared by first reacting Ca(OH)2 and methionine and adding metal nitrate, can be widely used as feeds and feed additives.

Abstract: A semiconductor package includes a package substrate, a first chip stack, a second chip stack, and a supporting block. The first chip stack includes first semiconductor chips stacked on the package substrate to be offset in a first direction, and the second chip stack includes second semiconductor chips stacked on the first chip stack to be offset in a second direction. The supporting block includes a through via structure. The second chip stack is supported by the first chip stack and the supporting block.

Abstract: The present disclosure relates to a preparation method of a methionine-metal chelate, and the methionine-metal chelate, which is prepared by first reacting Ca(OH)2 and methionine and adding metal nitrate, can be widely used as feeds and feed additives.

Abstract: A semiconductor package includes a plurality of stacked first semiconductor chips disposed over a substrate. At least a portion of the plurality of stacked first semiconductor chips is encapsulated in a first mold layer. The semiconductor package also includes a plurality of stacked second semiconductor chips disposed over the topmost chip of the stacked first semiconductor chips and the first mold layer. The semiconductor package also includes a third semiconductor chip disposed over the first mold layer and adjacent to the stacked second semiconductor chips. At least a portion of the third semiconductor chip overlaps with a portion of one or more of the stacked second semiconductor chips.