Abstract: The disclosure is related to an identity recognition device. The identity recognition device includes a thermal conductive casing, an identity recognition module, a heat dissipation assembly, and a heat dissipation coating. The heat dissipation assembly includes a plurality of heat pipes, a heat absorbing block and a first heat sink. The heat pipes are disposed on the thermal conductive casing, and are in thermal contacts with the thermal conductive casing. The heat absorbing block is in thermal contacts with the identity recognition module, and two opposite sides of the first heat sink respectively are in thermal contacts with the heat pipes and the heat absorbing block. The heat dissipation coating is coated on the thermal conductive casing and the heat pipes, wherein the thermal conductivity of the heat dissipation coating is larger than the thermal conductivities of the thermal conductive casing and the heat pipes.

Abstract: An electronic device comprises a metal casing, a circuit board and a heating assembly. The metal casing has a storage space. The circuit board is located in the storage space. The heating assembly comprises a first heating part and a second heating part. The first heating part is in thermal contact with the circuit board, and the second heating part is in thermal contact with the metal casing.

Abstract: A liquid cooling heat dissipation module adapted to be disposed on a heat source of a motherboard is provided. The liquid cooling heat dissipation module includes a heat conducting member, a first tank, a pump and a first agitating member. The heat conducting member is adapted to be thermally coupled to the heat source. The first tank is filled with cooling liquid, and the cooling liquid thermally couples with the heat conducting member. The pump is connected through with the first tank to drive the cooling liquid to flow along a direction. The first agitating member is disposed on a flowing path of the cooling liquid so as to homogenize a temperature of the cooling liquid.

Abstract: A liquid cooling apparatus includes a heat exchange module and a cooling module. The heat exchange module includes a liquid outlet and a liquid outlet. The cooling module includes a first body, a second body, a first cooling component and a cooling duct. The first body is connected to the liquid outlet. The second body is connected to the liquid outlet, and the first body is disposed above the second body. The first cooling component is disposed between the first body and the second body. The cooling duct is connected to the first body and the second body, and the cooling duct is in thermal contact with the first cooling component.

Abstract: A liquid cooling apparatus includes a heat exchange module and a cooling module. The heat exchange module includes a liquid outlet and a liquid outlet. The cooling module includes a first body, a second body, a first cooling component and a cooling duct. The first body is connected to the liquid outlet. The second body is connected to the liquid outlet, and the first body is disposed above the second body. The first cooling component is disposed between the first body and the second body. The cooling duct is connected to the first body and the second body, and the cooling duct is in thermal contact with the first cooling component.

Abstract: A liquid-cooling module includes a liquid-providing component, a liquid-receiving component and at least one heat dissipating assembly. The liquid-providing component has a liquid inlet and a plurality of liquid-providing openings, while the liquid inlet is used for being connected to a cooler. The liquid-receiving component has a plurality of liquid-receiving openings and a liquid outlet, and the liquid outlet is used for being connected to the cooler. The at least one heat dissipating assembly includes a flow tube. One end of the flow tube is detachably connected to one of the plurality of liquid-providing openings, and the other end of the flow tube is connected on one of the plurality of liquid-receiving openings.

Abstract: A liquid-cooling module includes a liquid-providing component, a liquid-receiving component and at least one heat dissipating assembly. The liquid-providing component has a liquid inlet and a plurality of liquid-providing openings, while the liquid inlet is used for being connected to a cooler. The liquid-receiving component has a plurality of liquid-receiving openings and a liquid outlet, and the liquid outlet is used for being connected to the cooler. The at least one heat dissipating assembly includes a flow tube. One end of the flow tube is detachably connected to one of the plurality of liquid-providing openings, and the other end of the flow tube is connected on one of the plurality of liquid-receiving openings.

Abstract: A memory module includes a circuit board and a heat sink. The circuit board is disposed with multiple chip packages separated from each other by a spacing. The heat sink is attached to the chip packages and opened with multiple holes corresponding to the spacings. Thereby, a thermal air flow chamber is formed for an airflow to enter the spacings and exchange heat with the chip packages.

Abstract: A chip-like heat source equipment includes a simulation package, a thermal conductor, a heat source, a thermal grease, and an insulating pad. The thermal conductor is disposed in the simulation package, and has a simulated heat source region on one side. The heat source is disposed on another side of the thermal conductor having the simulated heat source region. The insulating pad is covered on the other side of the thermal conductor having the simulated heat source region and the heat source, such that the heat energy generated by the heat source is transferred to the simulated heat source region via the thermal conductor. In this manner, a structure having the heat generating states similar to that of the real chip is formed.

Abstract: A memory-like heat source device includes a substrate, a conductive layer disposed on the substrate, and at least one simulative heat source region. The simulative heat source region has at least one passive element and a simulative package. The passive element is disposed on the conductive layer and electrically connected to the conductive layer. Once being powered on, the passive element generates thermal energy and is covered by the simulative package. Therefore, a structure extremely similar to a thermal state in a practical memory is constituted.