Abstract: A semiconductor device and method of manufacture are provided. After a patterning of a middle layer, the middle layer is removed. In order to reduce or prevent damage to other underlying layers exposed by the patterning of the middle layer and intervening layers, an inhibitor is included within an etching process in order to inhibit the amount of material removed from the underlying layers.

Abstract: Embodiments described herein relate generally to methods for forming a conductive feature in a dielectric layer in semiconductor processing and structures formed thereby. In some embodiments, a structure includes a dielectric layer over a substrate, a surface modification layer, and a conductive feature. The dielectric layer has a sidewall. The surface modification layer is along the sidewall, and the surface modification layer includes phosphorous and carbon. The conductive feature is along the surface modification layer.

Abstract: A method to form a plurality of inductors in a single process by placing multiple coils on a first magnetic sheet, and then stacking magnetic layers on the first magnetic sheet to encapsulate the coils so as to from a large magnetic body, and then cutting the large magnetic body into multiple inductors, wherein a terminal part of the coil disposed on the bottom surface of the magnetic body of the inductor is extended away from the axis of the coil and is entirely located at a same side of the axis of the coil.

Abstract: An electrical component, comprising: a magnetic body and a coil disposed in the magnetic body, wherein the magnetic body comprises a first magnetic powder and a second magnetic powder, wherein the D50 of the first magnetic powder is greater than the D50 of the second magnetic powder, wherein the D90 of the first magnetic powder is not greater than 50 um, and the D90 of the second magnetic powder is not greater than 50 um.

Abstract: A method to form a plurality of inductors in a single process by stacking multiple magnetic sheets, wherein each sheet is made to form a particular part in quantities, which can be a base part, a pillar part, a hollow part, or a cover part, for forming a magnetic body of an inductor.

Abstract: A method to form a plurality of inductors in a single process by placing multiple coils on a first magnetic sheet, and then stacking magnetic layers on the first magnetic sheet to encapsulate the coils so as to from a large magnetic body, and then cutting the large magnetic body into multiple inductors, wherein a terminal part of the coil disposed on the bottom surface of the magnetic body of the inductor is extended away from the axis of the coil and is entirely located at a same side of the axis of the coil.

Abstract: A coil component includes a core member, a coil structure, at least one terminal electrode and a soldering member. The coil structure includes an insulating layer. A first portion of the coil structure is wound around the core member. The terminal electrode is mounted onto the core member. The terminal electrode includes a clamping portion and a supporting portion. The clamping portion includes a bent part for clamping a second portion of the coil structure. The supporting portion includes a protruding part. A conductive wire of a third portion of the coil structure is revealed. A soldering member covers the protruding part to connect the supporting portion to the conductive wire to form electrical connection between the coil structure and the terminal electrode.

Abstract: A coil component includes a core member, a coil structure, at least one terminal electrode and a soldering member. The coil structure includes an insulating layer. A first portion of the coil structure is wound around the core member. The terminal electrode is mounted onto the core member. The terminal electrode includes a clamping portion and a supporting portion. The clamping portion includes a bent part for clamping a second portion of the coil structure. The supporting portion includes a protruding part. A conductive wire of a third portion of the coil structure is revealed. A soldering member covers the protruding part to connect the supporting portion to the conductive wire to form electrical connection between the coil structure and the terminal electrode.

Abstract: The present invention discloses a method and a device for detecting a signal power, and belongs to the field of communications. The method includes: when a receiver converts a received receive signal and outputs an output signal, separating a direct current signal and an alternating current signal from the output signal; converting the direct current signal into a first analog voltage signal; converting the alternating current signal into a second analog voltage signal through a transimpedance amplifier TIA; and obtaining a power of the receive signal according to the first analog voltage signal and the second analog voltage signal. The device includes: a first separating module, a first converting module, and an obtaining module. The present invention can improve accuracy of detecting a signal power.