Abstract: The present invention provides a flexible substrate for a package of a die which has an active surface and a plurality of first bond pads arranged in a form of a row and formed on the active surface. The flexible substrate includes a flexible insulating film and a plurality of first leads formed on the flexible insulating film. Each of the first leads corresponds to one of the first bond pads and has a respective first body portion, a respective first bond portion and a respective first extension portion. For each of the first leads, the width of the first bond portion is larger than those of the first body portion and the first extension portion.

Abstract: A semiconductor chip has fine pitch bumps. The bumps are respectively bonded to the inner leads of a tape during a tape automatic bonding process. The surface of the semiconductor chip has a plurality of bumps. Each of the bumps has at least a first region with a larger width and a second region with a smaller width, and the heights of the first region and the second region are approximately the same. The first region allows an inner lead to be bonded together correctly when placed at a position within the tolerance. As the width of the second region is smaller, after the second region is bonded to the inner lead and is deformed, the width of the bump is preferably not larger than the width of the first region.

Abstract: The present invention provides a flexible substrate for a package of a die which has an active surface and a plurality of first bond pads arranged in a form of a row and formed on the active surface. The flexible substrate includes a flexible insulating film and a plurality of first leads formed on the flexible insulating film. Each of the first leads corresponds to one of the first bond pads and has a respective first body portion, a respective first bond portion and a respective first extension portion. For each of the first leads, the width of the first bond portion is larger than those of the first body portion and the first extension portion.

Abstract: The invention discloses a flexible substrate including a flexible insulating film and a plurality of leads formed on an upper surface of the flexible insulating film. Each of the leads includes a first portion, a second portion, and a connection portion connecting the first portion and the second portion. The connection portion of at least one of the leads is designed as being crooked to provide a deformability to resist a tensile force once suffered by said one lead.