Abstract: A printed circuit board assembly is provided. The printed circuit board assembly includes a printed circuit board (PCB), a plurality of electronic components configured to be mounted on a first surface of the PCB, a first shielding member configured to cover the plurality of electronic components, and a heat transfer member received within the first shielding member, having a portion disposed in a space formed between the plurality of electronic components, and configured to be thermally deformable.

Abstract: A display device includes: a battery; a voltage generator configured to generate a first driving power source, corresponding to an input power source supplied from the battery; and pixels connected to scan lines and data lines, wherein the pixels include: a first pixel configured to emit light of a first color, corresponding to the first driving power source; and a second pixel configured to emit light of a second color, corresponding to a second driving power source supplied from the battery.

Abstract: An electronic device is provided. The electronic device includes a first support member partially including a thermally conductive material, a printed circuit board arranged to face the first support member, an integrated circuit chip arranged between the first support member and the printed circuit board, arranged on one surface of the printed circuit board, a solid-state thermal interface material (TIM) with compressibility, of which a portion of one surface is in contact with the integrated circuit chip and a portion of the other surface is in contact with the first support member, to transfer heat between the integrated circuit chip and the first support member, and a shielding film which is arranged between the TIM and the first support member and partially attached to the TIM and provides a first opening allowing a portion of the other surface of the TIM to be attached to the first support member.

Abstract: An electronic device according to one embodiment of the present disclosure, comprises: a housing including a first surface and a second surface that faces away from the first surface; a support member accommodated in the housing between the first surface and the second surface, the support member including an accommodating recess or an accommodating hole formed at a first depth from one of both faces and a seating recess provided in at least a portion of the circumference of the accommodating recess or the accommodating hole on any one surface of the support member; and a heat dissipation member including a chamber portion, which is at least partially accommodated in the accommodating recess or the accommodating hole, and at least one flange portion, which extends from at least a portion of the edge of the chamber portion so as to be welded to the bottom surface of the seating recess, wherein the seating recess is recessed at a second depth that is less than the first depth from any one surface of the support

Abstract: A semiconductor package substrate includes a base substrate including a conductive material, a die pad portion, and a lead portion, a metal catalyst layer disposed on the base substrate, and a graphene layer disposed on the metal catalyst layer, wherein the semiconductor package substrate has a Vickers hardness of 135 to 150.

Abstract: An electronic device is provided. The electronic device includes a housing, a first printed circuit board, a second printed circuit board, an interposer forming a space between the first printed circuit board and the second printed circuit board, a first electronic component disposed on the first printed circuit board, a second electronic component occupying a first area of the space, and a thermal interface material (TIM) included in the space, wherein the second printed circuit board includes a first opening for inserting a nozzle for injecting the TIM, the first opening corresponding to a second area of the space that is different from the first area.

Abstract: An electronic device may include: a housing and a board assembly disposed inside the housing. The board assembly may include a printed circuit board having a first surface and a second surface, an electronic component disposed on the first surface of the board assembly, a shielding portion disposed on the first surface and surrounding the electronic component, the shielding portion including a first support portion forming a receiving space and a shielding sheet covering the receiving space, and a heat transfer portion disposed between the electronic component and the shielding sheet and configured to exchange heat with the electronic component, wherein the heat transfer portion may include a first base layer disposed on the electronic component, a coating layer disposed on the first base layer, a heat dissipating material disposed on the coating layer and chemically bonded to the coating layer, and a second base layer disposed on the heat dissipating material.

Abstract: An electronic device is provided. The electronic device includes a printed circuit board, an electronic component disposed on the printed circuit board, a shield can including a planar portion having a seating portion formed as a groove including an injection hole, and a side portion which extending from the planar portion, the shield can being coupled to the printed circuit board to cover the electronic component, a cover member disposed in the seating portion of the shield can, and a heat transfer material filled inside the shield can, wherein the cover member is bendable for insertion of an external object for injecting the heat transfer material inside the shield can through the injection hole.

Abstract: An electronic device according to various embodiments of the present disclosure may comprise: a circuit board; at least one electronic component disposed on one surface of the circuit board; a shield can mounted to the one surface of the circuit board and accommodating the electronic component therein and includes at least one opening formed in the area corresponding to the electric component; a heat-dissipating structure disposed in at least a part of the shield can to close at least a part of the at least one opening; and a heat transfer member disposed between and in contact with the electronic component and the heat-dissipating structure and at least a part of which is disposed in the at least one opening.

Abstract: An electronic device according to an embodiment of the disclosure may comprise a housing, a circuit board disposed in the housing, an antenna module disposed in the housing and including an antenna pattern portion electrically connected to the circuit board, and a heat dissipation film attached to the antenna module. The heat dissipation film may include a first layer formed of a conductive material, a second layer having a predetermined width to surround the antenna pattern portion and disposed on one surface of the first layer, and a third layer disposed on one surface of the second layer and formed of an insulating material. The second layer may be configured to be hydrogen-bonded with the first layer and covalently bonded with the third layer.

Abstract: The present exemplary embodiments may provide a latent curing agent for an epoxy resin including a diene compound, a dienophile compound, and an imidazole-based compound, wherein the latent curing agent is protected by a Diels-Alder reaction between the diene compound and the dienophile compound, and wherein the imidazole-based compound is present in an amount of 20 wt % to 90 wt % based on the weight of the latent curing agent.

Abstract: The disclosure relates to an electronic device. According to an embodiment of the disclosure, the electronic device may include a first substrate including a first surface and a second surface opposite to the first surface, a second substrate including a third surface facing the first surface and a fourth surface opposite to the third surface, at least one interposer between the first surface and the second surface, a first electronic component on the fourth surface, and a heat dissipation member which is in a solid phase at room temperature and is in a space defined by the first substrate, the second substrate, and the at least one interposer so as to overlap with the first electronic component when viewed in a direction perpendicular to the fourth surface.

Abstract: An electronic device includes a printed circuit board (“PCB”) structure which accommodates a thermal interface material (“TIM”). The PCB structure includes a base plate, a first component on the base plate, a second component on the base plate and apart from the first component, an interposer connected to the base plate and surrounding the first component and the second component, a cover plate connected to the interposer and covering the first component and the second component, and an accommodation part which is between the base plate and a heat conduction plate and accommodates the TIM.

Abstract: Aspects of the present disclosure provide methods and apparatuses for operating an analog-to-digital converter. A method in accordance with an aspect of the present disclosure may comprise initializing a digital-to-analog converter (DAC) value of a DAC, determining whether an analog-to-digital converter (ADC) operates within a predetermined range based on an input to the DAC, initiating a conversion at a first ADC resolution when the ADC is operating within the predetermined range, and incrementally changing the DAC value when the ADC is not operating within the predetermined range.

Abstract: The disclosure relates to an electronic device. An electronic device according to an embodiment of the disclosure may comprise: a printed circuit board, a first electronic component mounted on the printed circuit board, a second electronic component mounted in a first area of a surface of the first electronic component, and a thermoresponsive heat dissipation member comprising a heat dissipation material and contacting a second area of the surface of the first electronic component and a top surface of the second electronic component. The heat dissipation member is configured to be in a solid phase and is configured to be softened based on a temperature of the heat dissipation member.

Abstract: Disclosed is a radar device capable of operating in a dual mode, which includes a transmitter that includes a first signal generator that generates a Doppler radar signal and a second signal generator that generates a Frequency Modulated Continuous Wave (FMCW) radar signal, a receiver that receives a reflected signal reflected from a target and converts the reflected signal to a digital signal, a signal processing circuit that processes the digital signal differently depending on the dual mode to output an output signal, a signal analysis circuit that analyzes the output signal, and a controller that controls operations of the transmitter, the receiver, the signal processing circuit, and the signal analysis circuit, and the dual mode includes a first mode in which the first signal generator is activated and a second mode in which the second signal generator is activated.

Abstract: The disclosure relates to an electronic device including: a circuit board; a first component disposed on the circuit board; a shield can disposed to surround at least a part of the first component and including an opening; and a nanofiber film disposed on the shield can to cover the opening, wherein the nanofiber film includes a first layer, a second layer, and a third layer sequentially laminated in a first direction, the first layer or the third layer having a lower electrical resistance value than an electrical resistance value of the second layer in a second direction different from the first direction, and the second layer has a lower electrical resistance value than an electrical resistance value of the first layer or the third layer in the first direction.

Abstract: According to an embodiment, a printed circuit board (PCB) structure may include: a first PCB; an interposer; a second PCB; and a cover structure including a mounting layer which is connected to the second PCB and includes a base hole, a support layer which is on a surface of the mounting layer that faces away from the second PCB, and a visible layer which is connected to the support layer and includes a material having transparency.

Abstract: Provided is a drive amplifier. A drive amplifier may include: a main circuit configured to receive an RF input signal and output a first RF output signal; and a selective bias adjustment circuit comprising a first common gate transistor to which a first common gate bias voltage is applied and a second common gate transistor to which a second common gate bias voltage is applied, and configured to output a second RF output signal using the first common gate transistor and the second common gate transistor.

Abstract: Disclosed is an electronic device including a shielding member. The electronic device includes a substrate having an electric element mounted thereon; a shield can mounted on the electric element and including an opening formed at a part facing the electric element; a shielding member mounted around a part in which the opening is formed on an outer surface of the shield can, and electrically connected to the shield can; a metal plate mounted on the shielding member, with the opening covered, and electrically connected to the shielding member; and a heat conductive member mounted in the opening and interposed between the electric element and the metal plate, and in contact with the electric element and the metal plate.